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1. 发明申请

US20080074848A1 HEAT SINK AND MEMORY MODULE USING THE SAME 有权
标题翻译：使用相同的散热和记忆模块
公开(公告)号：US20080074848A1
公开(公告)日：2008-03-27
申请号：US11859564
申请日：2007-09-21
申请人： Chang-Yong PARK , Yong-Hyun KIM , Kwang-Ho CHUN , Hyun-Jong OH
发明人： Chang-Yong PARK , Yong-Hyun KIM , Kwang-Ho CHUN , Hyun-Jong OH
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.
摘要翻译：提供了散热器和使用散热器的存储器模块。在一个实施例中，散热器包括分别设置在围绕待冷却物体放置的第一和第二散热器中的第一和第二引导销。第一和第二引导销有助于防止在第一和第二散热器之间发生不对准问题，以及当第一和第二散热器受到来自第一和第二散热器的压力施加压力时，有助于防止第一和第二散热器彼此接触外。

2. 发明申请

US20080044951A1 Semiconductor package and method of manufacturing the same 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20080044951A1
公开(公告)日：2008-02-21
申请号：US11812145
申请日：2007-06-15
申请人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Chang-yong Park , Hun Han
发明人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Chang-yong Park , Hun Han
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L21/563 , H01L24/10 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package may include a substrate having external contact terminals. A semiconductor chip having bonding pads may be formed on the substrate. Conductive bumps may connect the external contact terminals of the substrate to the bonding pads of the semiconductor chip. An underfill may be interposed between the substrate and the semiconductor chip. The underfill may include a first underfill region composed of a first material adjacent to the semiconductor chip and a second underfill region composed of a second material adjacent to the substrate, the first material having a higher glass transition temperature than the second material.
摘要翻译：半导体封装可以包括具有外部接触端子的衬底。具有接合焊盘的半导体芯片可以形成在基板上。导电凸块可以将衬底的外部接触端子连接到半导体芯片的接合焊盘。可以在基板和半导体芯片之间插入底部填充物。底部填充物可以包括由与半导体芯片相邻的第一材料组成的第一底部填充区域和由与基底相邻的第二材料构成的第二底部填充区域，第一材料具有比第二材料更高的玻璃化转变温度。

3. 发明申请

US20070161224A1 Semiconductor module and method of forming a semiconductor module 审中-公开
公开(公告)号：US20070161224A1
公开(公告)日：2007-07-12
申请号：US11723086
申请日：2007-03-16
申请人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
发明人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
IPC分类号： H01L21/44
CPC分类号： H05K3/303 , H01L2224/13 , H01L2224/16225 , H05K3/3457 , H05K2201/09781 , H05K2201/10734 , H05K2201/2036 , Y02P70/613
摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

4. 发明申请

US20060231949A1 Semiconductor module and method of forming a semiconductor module 有权
标题翻译：半导体模块和形成半导体模块的方法
公开(公告)号：US20060231949A1
公开(公告)日：2006-10-19
申请号：US11246303
申请日：2005-10-11
申请人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
发明人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/49811 , H01L23/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1403 , H01L2224/141 , H01L2224/16 , H01L2224/81192 , H01L2924/00014 , H01L2924/01079 , H05K3/303 , H05K3/3457 , H05K2201/09781 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.
摘要翻译：在一个实施例中，半导体模块包括至少一个半导体芯片封装，具有功能焊盘和虚拟焊盘的板，以及将半导体芯片封装和板的功能焊盘之一电连接的至少一个焊点。此外，在一个虚拟焊盘上形成至少一个支撑焊料凸块并且设置在半导体芯片封装的一部分之下。例如，支撑焊料凸块可以设置在半导体芯片封装的外围区域的下方。

5. 发明授权

US07705449B2 Cooling apparatus for memory module 有权
标题翻译：内存模块冷却装置
公开(公告)号：US07705449B2
公开(公告)日：2010-04-27
申请号：US11528211
申请日：2006-09-27
申请人： Joong Hyun Baek , Yong Hyun Kim , Kwang Ho Chun , Chang Yong Park , Hae Hyung Lee , Hee Jin Lee
发明人： Joong Hyun Baek , Yong Hyun Kim , Kwang Ho Chun , Chang Yong Park , Hae Hyung Lee , Hee Jin Lee
IPC分类号： H01L23/34
CPC分类号： H01L25/18 , H01L25/072 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253
摘要： A cooling apparatus for a circuit module having a substrate extending axially with an IC chip of a first type and IC chips of a second type mounted thereon, comprising: a first heat spreading element disposed to form a heat conduction path with the IC chip of the first type; and a second heat spreading element disposed to form a heat conduction path with the IC chips of the second type, wherein there is at least one IC chip of the second type mounted axially away from opposite sides of the IC chip of the first type, wherein the first type of IC chip is capable of generating a larger amount of heat than the second type of IC chips, and the first heat spreading element has a higher thermal conductivity than the second heat spreading element.
摘要翻译：一种用于电路模块的冷却装置，其具有在第一类型的IC芯片上轴向延伸的基板和安装在其上的第二类型的IC芯片的基板，包括：第一散热元件，设置成与IC芯片形成热传导路径第一类型以及第二散热元件，其设置成与所述第二类型的IC芯片形成热传导路径，其中至少一个所述第二类型的IC芯片轴向地远离所述第一类型的IC芯片的相对侧，其中第一类型的IC芯片能够产生比第二类型的IC芯片更大的热量，并且第一散热元件具有比第二散热元件更高的热导率。

6. 发明申请

US20080157389A1 SEMICONDUCTOR PACKAGE AND MODULE PRINTED CIRCUIT BOARD FOR MOUNTING THE SAME 有权
标题翻译：半导体封装和模块印刷电路板，用于安装它们
公开(公告)号：US20080157389A1
公开(公告)日：2008-07-03
申请号：US11968035
申请日：2007-12-31
申请人： Chang-Yong Park , Kwang-Ho Chun , Dong-Chun Lee , Yong-Hyun Kim
发明人： Chang-Yong Park , Kwang-Ho Chun , Dong-Chun Lee , Yong-Hyun Kim
IPC分类号： H01L23/48 , H05K7/02
CPC分类号： H05K1/111 , H01L2924/0002 , H05K3/3452 , H05K2201/0367 , H05K2201/09381 , H05K2201/094 , H05K2201/09845 , H05K2201/0989 , H05K2201/099 , H05K2201/10734 , Y02P70/611 , H01L2924/00
摘要： Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.
摘要翻译：提供了用于安装它的半导体封装和模块印刷电路板（PCB）。半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。

7. 发明授权

US07215026B2 Semiconductor module and method of forming a semiconductor module 有权
标题翻译：半导体模块和形成半导体模块的方法
公开(公告)号：US07215026B2
公开(公告)日：2007-05-08
申请号：US11246303
申请日：2005-10-11
申请人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
发明人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
IPC分类号： H01L23/12
CPC分类号： H01L23/49811 , H01L23/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1403 , H01L2224/141 , H01L2224/16 , H01L2224/81192 , H01L2924/00014 , H01L2924/01079 , H05K3/303 , H05K3/3457 , H05K2201/09781 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.
摘要翻译：在一个实施例中，半导体模块包括至少一个半导体芯片封装，具有功能焊盘和虚拟焊盘的板，以及将半导体芯片封装和板的功能焊盘之一电连接的至少一个焊点。此外，在一个虚拟焊盘上形成至少一个支撑焊料凸块并且设置在半导体芯片封装的一部分之下。例如，支撑焊料凸块可以设置在半导体芯片封装的外围区域的下方。

8. 发明申请

US20080289356A1 Apparatus for Producing Ice Vessel 审中-公开
标题翻译：冰船生产设备
公开(公告)号：US20080289356A1
公开(公告)日：2008-11-27
申请号：US12092194
申请日：2006-11-03
申请人： Chang Yong Park
发明人： Chang Yong Park
IPC分类号： F25C1/10
CPC分类号： F25C5/14 , A23G9/44 , F25C1/22
摘要： The invention is an apparatus for producing an ice vessel, in which the lumps of ice spread uniformly so that each portion of the vessel can be molded uniformly. The invention includes a main body (20), upper mold and lower mold (24 and 26) mounted to the main body (20) and having convex portion (22) and concave portion (23) of shape of the ice vessel respectively so as to mold the ice vessel (18) by coupling the upper mold (24) or the lower mold (26) and pressing lumps of ice (2) poured into the molds (22 and 24), pushers (32 and 34) liftably mounted to the convex portion (22) of the upper mold (24), and resilient members (36 and 38) mounted to press the pushers (32 and 34) downward, wherein when the upper and lower molds (24 and 26) are coupled with each other, the pushers (32 and 34) push the lumps of ice (2) laterally in the concave portion (23) of the lower mold (26) so that the lumps of ice (2) are uniformly dispersed.
摘要翻译：本发明是一种用于制造冰容器的装置，其中，冰块均匀地扩散，使得容器的每一部分能均匀地模制。本发明包括主体（20），上模具和下模具（24,26），其安装在主体（20）上并分别具有凸起部分（22）和冰箱形状的凹部（23），以便通过联接上模具（24）或下模具（26）和挤压到模具（22和24）中的块体（2）来模制冰容器（18），推动器（32和34）可拆卸地安装到上模具（24）的凸部（22）和安装成向下挤压推动器（32和34）的弹性构件（36和38），其中当上模具（24）和下模具（26）与每个另一方面，推动器（32和34）在下模具（26）的凹部（23）中横向推动块体（2），使得冰块（2）均匀地分散。

9. 发明授权

US07172106B2 Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board 有权
标题翻译：可与引脚连接器连接的印刷电路板和制造印刷电路板的方法
公开(公告)号：US07172106B2
公开(公告)日：2007-02-06
申请号：US10748868
申请日：2003-12-29
申请人： Jong-Soo Choi , Byung-Man Kim , Joung-Rhang Lee , Chang-Yong Park
发明人： Jong-Soo Choi , Byung-Man Kim , Joung-Rhang Lee , Chang-Yong Park
IPC分类号： B23K31/00
CPC分类号： H05K3/3447 , H05K3/3415 , H05K3/3484 , H05K3/3489 , H05K2201/10189 , H05K2203/043 , H05K2203/1476 , H05K2203/1572 , Y10T29/49147 , Y10T29/49149
摘要： A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap unit at the same time it is applied to pads of the printed circuit board and, for example, by performing high temperature reflow. In addition, reliability and reduction in cost of a pin connector can be ensured without using a pin connector into which a high-priced wired solder is inserted. Rather a general pin connector can be used because the pin connector and the tap unit are connected to each other through the solidified solder formed on the tap unit.
摘要翻译：提供了可与引脚连接器连接的印刷电路板和制造印刷电路板的方法。可以在分接单元上形成固化的焊料，而不需要额外的工艺，通过在施加到印刷电路板的焊盘并且例如通过进行高温回流的同时将焊锡印刷施加到分接单元。此外，可以确保针连接器的可靠性和成本的降低，而不使用插入有高价位的有线焊料的针连接器。相反，可以使用通用针连接器，因为针连接器和分接头单元通过形成在分接头单元上的固化焊料相互连接。

10. 发明申请

US20060228878A1 Semiconductor package repair method 审中-公开
标题翻译：半导体封装修复方法
公开(公告)号：US20060228878A1
公开(公告)日：2006-10-12
申请号：US11387801
申请日：2006-03-24
申请人： Chang-Yong Park , Kyung-Du Kim , Kwang-Ho Chun , Byung-Man Kim , Yong-Hyun Kim , Hyun-Jong Oh
发明人： Chang-Yong Park , Kyung-Du Kim , Kwang-Ho Chun , Byung-Man Kim , Yong-Hyun Kim , Hyun-Jong Oh
IPC分类号： H01L21/44
CPC分类号： H05K3/3436 , H01L25/105 , H01L25/50 , H01L2224/16 , H01L2225/1058 , H01L2225/1094 , H01L2924/15331 , H05K3/3463 , H05K3/3484 , H05K2201/10992 , Y02P70/613
摘要： A lower-melting-point solder having a lower melting point than solder balls is used to bond the solder balls with a module substrate. The lower-melting-point solder has a melting point lower than the solder balls. A bonding temperature is at a temperature between the melting point of the lower-melting-point solder and the melting point of the solder balls.
摘要翻译：使用熔点低于焊料球的低熔点焊料用于将焊球与模块基板结合。低熔点焊料的熔点低于焊料球。接合温度处于低熔点焊料的熔点和焊料球的熔点之间的温度。

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