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1. 发明申请

US20080222349A1 IEEE 1394 INTERFACE-BASED FLASH DRIVE USING MULTILEVEL CELL FLASH MEMORY DEVICES 审中-公开
标题翻译： IEEE 1394基于接口的闪存驱动器，使用多单元电池闪存存储器件
公开(公告)号：US20080222349A1
公开(公告)日：2008-09-11
申请号：US12043628
申请日：2008-03-06
申请人： Jong Kook Lee , Franz Michael Schuette
发明人： Jong Kook Lee , Franz Michael Schuette
IPC分类号： G06F12/00
CPC分类号： G06F13/385 , G11C11/5621
摘要： A flash drive and method of transferring data from a system to a flash drive. The flash drive includes a casing, a plurality of flash memory devices within the casing, each of the flash memory devices having multilevel cells, an IEEE 1394 interface controller within the casing, coupled to the flash memory devices, and interfacing with the flash memory devices for interleaved multichannel access to and from at least two of the flash memory devices, and at least one IEEE 1394 interface connector projecting from the casing for interfacing the flash memory devices with a system through the controller. The method entails coupling a plurality of multilevel cell flash memory devices to a system through an IEEE 1394 interface controller and at least one IEEE 1394 interface connector, and performing interleaved multichannel access to and from at least two of the flash memory devices.
摘要翻译：闪存驱动器和将数据从系统传输到闪存驱动器的方法。闪存驱动器包括壳体，壳体内的多个闪存器件，每个闪存器件具有多电平单元，壳体内的IEEE 1394接口控制器，耦合到闪存器件，并与闪存器件接口用于对来自至少两个闪存器件的交织多通道访问，以及从壳体突出的至少一个IEEE 1394接口连接器，用于通过控制器将闪存器件与系统接口连接。该方法需要通过IEEE 1394接口控制器和至少一个IEEE 1394接口连接器将多个多电平单元闪存器件耦合到系统，并且执行至少两个闪存器件的交错多通道访问。

2. 发明授权

US09236549B2 Heat conducting slug having multi-step structure and light emitting diode package using the same 有权
标题翻译：具有多级结构的导热块和使用其的发光二极管封装
公开(公告)号：US09236549B2
公开(公告)日：2016-01-12
申请号：US12519954
申请日：2007-12-18
申请人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
发明人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
IPC分类号： F21V29/00 , H01L33/64 , B29C45/14 , B29C45/26 , B29C45/34
CPC分类号： H01L33/642 , B29C45/14655 , B29C45/14836 , B29C45/2669 , B29C45/34 , B29K2995/0013 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.
摘要翻译：本发明提供一种具有多级结构的导热块，其被安装到LED封装以将从发光芯片产生的热量散发到外部。导热块包括形成在第一块上的第一块，第二块和形成在第二块上的第三块，其中发光芯片安装到第三块，第二和第三块分别成形为具有边缘布置成彼此交叉。在这种配置中，从发光芯片产生的热量遵循散热路径，其中热量集中在一个芯块的边缘并从其散发并且然后聚集在另一个芯块的边缘，被布置成跨越一个芯块。因此，整个散热路径不集中在特定区域，而是广泛分布，从而提高导热块的散热效果。

3. 发明申请

US20100091504A1 HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME 有权
标题翻译：具有多级结构的热导管和使用其的发光二极管封装
公开(公告)号：US20100091504A1
公开(公告)日：2010-04-15
申请号：US12519954
申请日：2007-12-18
申请人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
发明人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
IPC分类号： F21V29/00 , F28F7/00
CPC分类号： H01L33/642 , B29C45/14655 , B29C45/14836 , B29C45/2669 , B29C45/34 , B29K2995/0013 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.
摘要翻译：本发明提供一种具有多级结构的导热块，其被安装到LED封装以将从发光芯片产生的热量散发到外部。导热块包括形成在第一块上的第一块，第二块和形成在第二块上的第三块，其中发光芯片安装到第三块，第二和第三块分别成形为具有边缘布置成彼此交叉。在这种配置中，从发光芯片产生的热量遵循散热路径，其中热量集中在一个芯块的边缘并从其散发并且然后聚集在另一个芯块的边缘，被布置成跨越一个芯块。因此，整个散热路径不集中在特定区域，而是广泛分布，从而提高导热块的散热效果。

4. 发明授权

US09293677B2 Heat conducting slug having multi-step structure and light emitting diode package using the same 有权
标题翻译：具有多级结构的导热块和使用其的发光二极管封装
公开(公告)号：US09293677B2
公开(公告)日：2016-03-22
申请号：US13302450
申请日：2011-11-22
申请人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
发明人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
IPC分类号： H01L33/64 , B29C45/14 , B29C45/26 , B29C45/34
CPC分类号： H01L33/642 , B29C45/14655 , B29C45/14836 , B29C45/2669 , B29C45/34 , B29K2995/0013 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a light-emitting diode package having a plurality of inner leads, a plurality of outer leads extending from the inner leads, a slug electrically connected to at least one of the inner leads, the slug having a thermally conductive material, a light-emitting chip arranged on the slug, and a housing supporting the light-emitting diode package.
摘要翻译：本发明涉及一种发光二极管封装，其具有多个内引线，从该内引线延伸的多个外引线，与该内引线中的至少一个电连接的芯块，其具有导热材料，布置在芯块上的发光芯片和支撑发光二极管封装的壳体。

5. 外观设计

USD579424S1 Light emitting diode (LED) 有权
公开(公告)号：USD579424S1
公开(公告)日：2008-10-28
申请号：US29277821
申请日：2007-03-09
申请人： Do Hyung Kim , Jong Kook Lee , Seok Jin Kang , Won Cho
设计人： Do Hyung Kim , Jong Kook Lee , Seok Jin Kang , Won Cho

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