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1. 发明授权

US09293677B2 Heat conducting slug having multi-step structure and light emitting diode package using the same 有权
标题翻译：具有多级结构的导热块和使用其的发光二极管封装
公开(公告)号：US09293677B2
公开(公告)日：2016-03-22
申请号：US13302450
申请日：2011-11-22
申请人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
发明人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
IPC分类号： H01L33/64 , B29C45/14 , B29C45/26 , B29C45/34
CPC分类号： H01L33/642 , B29C45/14655 , B29C45/14836 , B29C45/2669 , B29C45/34 , B29K2995/0013 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a light-emitting diode package having a plurality of inner leads, a plurality of outer leads extending from the inner leads, a slug electrically connected to at least one of the inner leads, the slug having a thermally conductive material, a light-emitting chip arranged on the slug, and a housing supporting the light-emitting diode package.
摘要翻译：本发明涉及一种发光二极管封装，其具有多个内引线，从该内引线延伸的多个外引线，与该内引线中的至少一个电连接的芯块，其具有导热材料，布置在芯块上的发光芯片和支撑发光二极管封装的壳体。

2. 发明授权

US09236549B2 Heat conducting slug having multi-step structure and light emitting diode package using the same 有权
标题翻译：具有多级结构的导热块和使用其的发光二极管封装
公开(公告)号：US09236549B2
公开(公告)日：2016-01-12
申请号：US12519954
申请日：2007-12-18
申请人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
发明人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
IPC分类号： F21V29/00 , H01L33/64 , B29C45/14 , B29C45/26 , B29C45/34
CPC分类号： H01L33/642 , B29C45/14655 , B29C45/14836 , B29C45/2669 , B29C45/34 , B29K2995/0013 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.
摘要翻译：本发明提供一种具有多级结构的导热块，其被安装到LED封装以将从发光芯片产生的热量散发到外部。导热块包括形成在第一块上的第一块，第二块和形成在第二块上的第三块，其中发光芯片安装到第三块，第二和第三块分别成形为具有边缘布置成彼此交叉。在这种配置中，从发光芯片产生的热量遵循散热路径，其中热量集中在一个芯块的边缘并从其散发并且然后聚集在另一个芯块的边缘，被布置成跨越一个芯块。因此，整个散热路径不集中在特定区域，而是广泛分布，从而提高导热块的散热效果。

3. 发明申请

US20100091504A1 HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME 有权
标题翻译：具有多级结构的热导管和使用其的发光二极管封装
公开(公告)号：US20100091504A1
公开(公告)日：2010-04-15
申请号：US12519954
申请日：2007-12-18
申请人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
发明人： Jong Kook Lee , Byoung Ki Pyo , Hyuck Jung Choi , Kyung Nam Kim , Won Cho
IPC分类号： F21V29/00 , F28F7/00
CPC分类号： H01L33/642 , B29C45/14655 , B29C45/14836 , B29C45/2669 , B29C45/34 , B29K2995/0013 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.
摘要翻译：本发明提供一种具有多级结构的导热块，其被安装到LED封装以将从发光芯片产生的热量散发到外部。导热块包括形成在第一块上的第一块，第二块和形成在第二块上的第三块，其中发光芯片安装到第三块，第二和第三块分别成形为具有边缘布置成彼此交叉。在这种配置中，从发光芯片产生的热量遵循散热路径，其中热量集中在一个芯块的边缘并从其散发并且然后聚集在另一个芯块的边缘，被布置成跨越一个芯块。因此，整个散热路径不集中在特定区域，而是广泛分布，从而提高导热块的散热效果。

4. 发明申请

US20100020531A1 BACK LIGHTING UNIT HAVING PHOSPHOR FILM STRUCTURE 有权
标题翻译：具有磷光体膜结构的背光单元
公开(公告)号：US20100020531A1
公开(公告)日：2010-01-28
申请号：US12521489
申请日：2007-12-26
申请人： Hyuck Jung Choi , Sang Min Lee , Kyung Nam Kim , Yun Bok Lee
发明人： Hyuck Jung Choi , Sang Min Lee , Kyung Nam Kim , Yun Bok Lee
IPC分类号： F21V9/16
CPC分类号： G02F1/133617
摘要： A back lighting unit is disclosed in which lower and upper surfaces of a light transmitting plate function as incident and exit surfaces of light, respectively, and a phosphor film structure for wavelength-converting the light is provided at a position which the light is incident on or exits from. The disclosed back lighting unit includes a light emitting means including a light emitting diode disposed to emit light upwards; a light transmitting plate disposed over the light emitting diode, the light transmitting plate having a lower surface allowing light to be incident thereon and an upper surface allowing light to exit therefrom; and a phosphor film structure including a particulate phosphor and formed on at least one of the lower and upper surfaces of the light transmitting plate.
摘要翻译：公开了一种背光照明装置，其中透光板的下表面和上表面分别用作光入射和出射表面，以及用于波长转换光的荧光膜结构设置在光入射的位置或退出。所公开的背光照明单元包括：发光装置，包括设置成向上发光的发光二极管; 设置在所述发光二极管上方的透光板，所述透光板具有允许光入射的下表面和允许光从其出射的上表面; 以及包含微粒荧光体并形成在所述透光板的下表面和上表面中的至少一个上的荧光体膜结构。

5. 发明授权

US08454184B2 Back lighting unit having phosphor film structure 有权
标题翻译：具有荧光膜结构的背光单元
公开(公告)号：US08454184B2
公开(公告)日：2013-06-04
申请号：US12521489
申请日：2007-12-26
申请人： Hyuck Jung Choi , Sang Min Lee , Kyung Nam Kim , Yun Bok Lee
发明人： Hyuck Jung Choi , Sang Min Lee , Kyung Nam Kim , Yun Bok Lee
IPC分类号： F21V9/16 , G09F13/20
CPC分类号： G02F1/133617
摘要： A back lighting unit is disclosed in which lower and upper surfaces of a light transmitting plate function as incident and exit surfaces of light, respectively, and a phosphor film structure for wavelength-converting the light is provided at a position which the light is incident on or exits from. The disclosed back lighting unit includes a light emitting means including a light emitting diode disposed to emit light upwards; a light transmitting plate disposed over the light emitting diode, the light transmitting plate having a lower surface allowing light to be incident thereon and an upper surface allowing light to exit therefrom; and a phosphor film structure including a particulate phosphor and formed on at least one of the lower and upper surfaces of the light transmitting plate.
摘要翻译：公开了一种背光照明装置，其中透光板的下表面和上表面分别用作光入射和出射表面，以及用于波长转换光的荧光膜结构设置在光入射的位置或退出。所公开的背光照明单元包括：发光装置，包括设置成向上发光的发光二极管; 设置在所述发光二极管上方的透光板，所述透光板具有允许光入射的下表面和允许光从其出射的上表面; 以及包含微粒荧光体并形成在所述透光板的下表面和上表面中的至少一个上的荧光体膜结构。

6. 发明授权

US09447957B2 LED lamp 有权
标题翻译：点灯
公开(公告)号：US09447957B2
公开(公告)日：2016-09-20
申请号：US14129795
申请日：2012-06-20
申请人： Hyuck Jung Choi , Kyung Hee Ye
发明人： Hyuck Jung Choi , Kyung Hee Ye
IPC分类号： F21V1/00 , F21V29/00 , F21K99/00 , F21V29/74 , F21Y101/02
CPC分类号： F21V29/70 , F21K9/232 , F21V29/004 , F21V29/74 , F21Y2101/00 , F21Y2115/10 , Y02B20/30
摘要： The present invention relates to an LED lamp. In the LED lamp, light may be emitted in lateral and rear directions as well as in a front direction to obtain light distribution characteristics similar to those of an incandescent lamp, and heat generated when the LED emits light may be effectively dissipated.
摘要翻译：本发明涉及一种LED灯。在LED灯中，可以在横向和后方以及正面方向上发射光，以获得与白炽灯类似的分布特性，并且可以有效地消散LED发光时产生的热量。

7. 发明申请

US20150036329A1 LIGHT EMITTING MODULE HAVING WAFER WITH INTEGRATED POWER SUPPLY DEVICE 审中-公开
标题翻译：具有集成电源设备的散热器发光模块
公开(公告)号：US20150036329A1
公开(公告)日：2015-02-05
申请号：US13976653
申请日：2011-08-22
申请人： Hyuck Jung Choi , Young Eun Yang
发明人： Hyuck Jung Choi , Young Eun Yang
IPC分类号： F21V23/00 , F21L4/08 , H01L25/16 , H01L33/52 , H01L33/62 , H01L31/02 , H01L31/052 , H01L33/50 , F21S9/03 , H01L25/075
CPC分类号： F21V23/005 , F21L4/08 , F21S9/037 , F21Y2101/00 , H01L25/0753 , H01L25/167 , H01L31/02021 , H01L31/02327 , H01L31/0543 , H01L31/153 , H01L33/502 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/62 , H01L2924/0002 , Y02E10/52 , H01L2924/00
摘要： A light emitting module is disclosed. The light emitting module comprises a wafer having first and second surfaces; a light emitting diode chip disposed on the first surface of the wafer; a power supply device for supplying power to the light emitting diode chip; and a photoelectric conversion device for converting sunlight into electricity and providing it to the power supply device, wherein the power supply device is disposed on the second surface of the wafer.
摘要翻译：公开了一种发光模块。发光模块包括具有第一和第二表面的晶片; 设置在晶片的第一表面上的发光二极管芯片; 用于向发光二极管芯片供电的电源装置; 以及用于将太阳光转换成电并将其提供给电源装置的光电转换装置，其中电源装置设置在晶片的第二表面上。

8. 发明授权

US08937326B2 LED package having an array of light emitting cells coupled in series 有权
标题翻译： LED封装具有串联耦合的发光单元阵列
公开(公告)号：US08937326B2
公开(公告)日：2015-01-20
申请号：US13033702
申请日：2011-02-24
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/62 , H01L27/15 , F21K99/00 , H01L33/48 , H01L33/64
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

9. 发明授权

US08188492B2 Light emitting device having plural light emitting diodes and at least one phosphor for emitting different wavelengths of light 有权
标题翻译：具有多个发光二极管和至少一个用于发射不同波长的光的荧光体的发光器件
公开(公告)号：US08188492B2
公开(公告)日：2012-05-29
申请号：US12439052
申请日：2007-08-24
申请人： Sang Min Lee , Hyuck Jung Choi , Mi Hae Kim
发明人： Sang Min Lee , Hyuck Jung Choi , Mi Hae Kim
IPC分类号： H01L33/50
CPC分类号： H01L25/0753 , C09K11/7734 , C09K11/7792 , H01L33/50 , H01L2224/48 , Y02B20/181
摘要： The present invention provides a light emitting device, comprising a first light emitting diode for emitting light in an ultraviolet wavelength region; at least one phosphor arranged around the first light emitting diode and excited by the light emitted from the first light emitting diode to emit light having a peak wavelength longer than the wavelength of the light emitted from the first light emitting diode; and at least one second light emitting diode for emitting light having a wavelength different from the peak wavelength of the light emitted from the phosphor. According to the present invention, there is provided a white light emitting device, wherein using a light emitting diode for emitting light different in wavelength from light that is ex-cititively emitted from the phosphor, an excitation light source, i.e., light in the ultraviolet region for exciting the phosphor is effectively used, thereby improving energy conversion efficiency and improving reliability.
摘要翻译：本发明提供了一种发光器件，包括用于发射紫外线波长区域的光的第一发光二极管; 至少一个磷光体布置在第一发光二极管周围并被从第一发光二极管发射的光激发，以发射具有比从第一发光二极管发射的光的波长更长的峰值波长的光; 以及至少一个第二发光二极管，用于发射波长不同于从荧光体发出的光的峰值波长的波长的光。根据本发明，提供了一种白光发光装置，其中使用发光二极管发射波长不同于从荧光体中突出出射的光的光，激发光源，即紫外线中的光有效地利用激发荧光体的区域，从而提高能量转换效率并提高可靠性。

10. 发明授权

US08053259B2 Manufacturing method of light emitting diode 有权
标题翻译：发光二极管的制造方法
公开(公告)号：US08053259B2
公开(公告)日：2011-11-08
申请号：US12718465
申请日：2010-03-05
申请人： Sang Min Lee , Hyuck Jung Choi , Won Il Kim
发明人： Sang Min Lee , Hyuck Jung Choi , Won Il Kim
IPC分类号： H01L21/00
CPC分类号： B29C45/27 , B29C45/0055 , B29C45/02 , B29C45/14655 , B29C45/1671 , B29C2045/0058 , B29C2045/2712 , B29K2995/0025 , B29K2995/0026 , H01L24/97 , H01L33/52 , H01L2224/32257 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.
摘要翻译：公开了一种发光二极管的制造方法。制造方法包括准备基板并将发光芯片安装在基板上的步骤。中间板位于基板上。中间板具有用于接收发光芯片的通孔和用于在其上表面上将通孔彼此连接的凹槽。通过使用沟槽作为流道，通过透明模塑材料进行传递模塑工艺以形成填充通孔的第一模制部分。此后，中间板被去除，并且基板被分离成单独的发光二极管。因此，可以提供一种发光二极管，其中通过传递模塑工艺形成的第一模制部分位于由衬底的切割表面包围的区域内。由于第一成型部分位于由基板的切割面包围的区域内，所以第二成型部分可以以各种方式对称地形成在第一成型部分的侧表面上。

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