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    • 6. 发明授权
    • Thermal management for microcircuit testing system
    • 微电路测试系统的热管理
    • US09476936B1
    • 2016-10-25
    • US14211016
    • 2014-03-14
    • Johnstech International Corporation
    • David JohnsonJeffrey SherryHarlan FallerBrian WarwickSarosh PatelJohn BucherJay Drescher
    • G01R31/28
    • G01R31/2891G01R31/2874
    • The IC test system provides a system and method for thermal management of test pins. A test pin array (22) in a pin guide (24) is mounted in a retainer (20) which is located between an IC wafer (12) which contains IC devices to be tested (DUT) and a load board (40) which provides pathways to test signals to the DUT. On the other side of the load board is a contact plate (50) which together with the retainer straddles the load board. Leg extensions (36) pass through the load board apertures (42) and provide a thermal circuit from the contact plate to the retainer and to the pin array. On the upper side of the contact plate is a cooling/heating system with a thermal electric peltier device (62) and a further heat exchanger (64) as needed. Holes (44) are provided in the legs (36) to provide a supply of dry air to the wafer and pin array to minimize condensation as a result of cooling effects.
    • IC测试系统提供了一种用于测试引脚热管理的系统和方法。 销引导件(24)中的测试针阵列(22)安装在位于包含要测试的IC器件(DUT)的IC晶片(12)和负载板(40)之间的保持器(20)中,该保持器 提供了向DUT测试信号的路径。 在负载板的另一侧是与保持架跨接负载板的接触板(50)。 腿部延伸部分(36)穿过负载板孔(42)并提供从接触板到保持器和引脚阵列的热回路。 在接触板的上侧是具有热电致动器装置(62)和另外的热交换器(64)的冷却/加热系统。 孔(44)设置在腿部(36)中,以向晶片和针阵列提供干燥空气供应,以使冷凝效果最小化。