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1. 发明授权

US07273266B2 Micro-fluid ejection assemblies 有权
标题翻译：微流体喷射组件
公开(公告)号：US07273266B2
公开(公告)日：2007-09-25
申请号：US10823939
申请日：2004-04-14
申请人： John William Krawczyk , Andrew Lee McNees , James Michael Mrvos , Carl Edmond Sullivan
发明人： John William Krawczyk , Andrew Lee McNees , James Michael Mrvos , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628
摘要： A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.
摘要翻译：一种微流体喷射组件，包括其中具有精确形成的流体路径的硅衬底。流体路径是通过在具有不超过约5000埃的电介质层厚度的蚀刻之前在具有蚀刻前的表面特性的基底上进行的深反应离子蚀刻工艺形成的，以及基本上不含介质材料的凹坑表面，其中a 表面点蚀的均方根深度小于约500埃，最大表面点蚀深度不超过约2500埃。这种衬底中的流体路径具有改进的流动特性以便更可靠的流体喷射操作。

2. 发明授权

US06902867B2 Ink jet printheads and methods therefor 有权
标题翻译：喷墨打印头及其方法
公开(公告)号：US06902867B2
公开(公告)日：2005-06-07
申请号：US10262827
申请日：2002-10-02
申请人： Eric Spencer Hall , Shauna Marie Leis , Andrew Lee McNees , James Michael Mrvos , James Harold Powers , Carl Edmond Sullivan
发明人： Eric Spencer Hall , Shauna Marie Leis , Andrew Lee McNees , James Michael Mrvos , James Harold Powers , Carl Edmond Sullivan
IPC分类号： B41J2/16 , B41J2/05
CPC分类号： B41J2/1623 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1635 , B41J2/1645
摘要： The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
摘要翻译：本发明提供了一种在用于喷墨打印头的半导体硅衬底芯片中制造墨水供给通孔的方法，以及通过该方法制造的含有硅芯片的喷墨打印头。该方法包括将第一光致抗蚀剂材料施加到芯片的第一表面侧。第一光致抗蚀剂材料被图案化和显影以在其中限定至少一个墨通孔位置。将蚀刻停止材料施加到芯片的第二表面侧。通过干法蚀刻工艺将至少一个墨通孔从芯片的第一表面侧通过硅片的厚度直到蚀刻停止层。与传统的油墨通孔形成技术相反，该方法显着提高了硅芯片的生产量，并减少了由于断屑和破裂造成的损耗。所得到的芯片对于长期的打印头使用更可靠。

3. 发明申请

US20110205305A1 HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE 有权
标题翻译：硅胶衬垫加热硅胶衬垫
公开(公告)号：US20110205305A1
公开(公告)日：2011-08-25
申请号：US13102091
申请日：2011-05-06
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过模具的金属将基板前部的导体连接到模具前部的加热元件。

4. 发明申请

US20090256891A1 HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHODS OF FABRICATING THE HEATER CHIPS 有权
标题翻译：硅胶衬垫上加热硅胶的加热器及其制作方法
公开(公告)号：US20090256891A1
公开(公告)日：2009-10-15
申请号：US12101215
申请日：2008-04-11
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05 , H01L21/00
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过对载体和器件晶片的单独处理，可以调整衬底和管芯的尺寸和特征以提供期望的加热器芯片结构。

5. 发明授权

US08087756B2 Heater chips with silicon die bonded on silicon substrate 有权
标题翻译：硅芯片加热芯片焊接在硅基板上
公开(公告)号：US08087756B2
公开(公告)日：2012-01-03
申请号：US13102091
申请日：2011-05-06
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过模具的金属将基板前部的导体连接到模具前部的加热元件。

6. 发明授权

US07938513B2 Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips 有权
标题翻译：具有硅芯片的加热芯片粘合在硅衬底上以及制造加热器芯片的方法
公开(公告)号：US07938513B2
公开(公告)日：2011-05-10
申请号：US12101215
申请日：2008-04-11
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05 , B21D53/76
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过对载体和器件晶片的单独处理，可以调整衬底和管芯的尺寸和特征以提供期望的加热器芯片结构。

7. 发明授权

US06409312B1 Ink jet printer nozzle plate and process therefor 有权
标题翻译：喷墨打印机喷嘴板及其工艺
公开(公告)号：US06409312B1
公开(公告)日：2002-06-25
申请号：US09818736
申请日：2001-03-27
申请人： James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams
发明人： James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams
IPC分类号： B41J204
CPC分类号： B41J2/1628 , B41J2/1433 , B41J2/162 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645
摘要： The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a semiconductor substrate containing ink ejection devices and a dry-etched ink via therein. A first photo-imaged polymer layer is applied to the semiconductor substrate, the first photo-imaged polymer layer being patterned and developed to contain ink flow chambers and ink flow channels corresponding to the ink ejection devices on the semiconductor substrate. A second photo-imaged polymer layer is applied to the first photo-imaged polymer layer. The second photo-imaged polymer layer is patterned and developed to contain nozzle holes corresponding to the ink chambers in the first photo-imaged polymer layer and corresponding to the ink ejection devices on the semiconductor substrate. The invention provides increased printhead manufacturing accuracy and elimination of alignment and adhesive attachment of a separate nozzle plate to an ink jet heater chip.
摘要翻译：本发明提供了一种用于喷墨打印机的打印头和一种用于制造用于喷墨打印机的打印头的方法。打印头包括含有喷墨装置的半导体基板和其中经过干蚀刻的墨水通道。将第一光成像聚合物层施加到半导体衬底上，第一光成像聚合物层被图案化和显影以包含对应于半导体衬底上的喷墨装置的墨流动室和墨流动通道。将第二光成像聚合物层施加到第一光成像聚合物层。第二光成像聚合物层被图案化和显影以包含对应于第一光成像聚合物层中的墨室的喷嘴孔，并对应于半导体衬底上的喷墨装置。本发明提供了增加的打印头制造精度并消除了单独的喷嘴板对喷墨加热器芯片的对准和粘合附着。

8. 发明授权

US06387719B1 Method for improving adhesion 有权
标题翻译：改善附着力的方法
公开(公告)号：US06387719B1
公开(公告)日：2002-05-14
申请号：US09795731
申请日：2001-02-28
申请人： James Michael Mrvos , Carl Edmond Sullivan
发明人： James Michael Mrvos , Carl Edmond Sullivan
IPC分类号： H01L2100
CPC分类号： B41J2/1645 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , H01L21/312
摘要： The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.
摘要翻译：本发明提供了一种改善聚合物平面化膜和半导体芯片表面之间粘附性的方法。该方法包括沉积电阻，导电和/或绝缘材料到电感器芯片表面以提供用于喷墨打印机的半导体芯片。芯片表面在氧气氛下用干法蚀刻工艺处理一段时间并且在足以激活芯片表面的条件下进行处理。将聚合物平面化膜施加到半导体芯片的活化表面。作为干法蚀刻工艺的结果，在不进行芯片表面的干法蚀刻处理的情况下，平坦化膜的粘合性比平坦化膜与半导体表面之间的粘附性增加。

9. 发明授权

US06550893B2 Semiconductor chip for an ink jet printhead and method for making same 有权
公开(公告)号：US06550893B2
公开(公告)日：2003-04-22
申请号：US10047055
申请日：2002-01-14
申请人： James Michael Mrvos , Carl Edmond Sullivan
发明人： James Michael Mrvos , Carl Edmond Sullivan
IPC分类号： B41J2135
CPC分类号： B41J2/1645 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , H01L21/312
摘要： The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.

10. 发明授权

US06668445B1 Method of increasing tab bond strength using reactive ion etching 有权
标题翻译：使用反应离子蚀刻增加片状结合强度的方法
公开(公告)号：US06668445B1
公开(公告)日：2003-12-30
申请号：US09481254
申请日：2000-01-11
申请人： James Michael Mrvos , Michael Raulinaitis , Carl Edmond Sullivan
发明人： James Michael Mrvos , Michael Raulinaitis , Carl Edmond Sullivan
IPC分类号： H05B300
CPC分类号： G03G9/0821 , H05K3/3489 , H05K3/361 , Y10S438/906 , Y10T29/49083 , Y10T29/49169 , Y10T29/49401
摘要： A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.
摘要翻译：将喷墨打印机的加热器芯片自动粘合到柔性电路的带的方法包括将导电焊盘附接到加热器芯片的表面的第一部分的步骤。将掩模施加到加热器芯片的表面的第二部分。接合焊盘的暴露表面被化学干蚀刻预定的时间段，从而从蚀刻的暴露表面去除污染物。化学干蚀刻在预定时间段结束时终止，使得基本上没有去除焊盘。最后，柔性电路电连接到蚀刻的暴露表面。

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