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1. 发明授权

US06409312B1 Ink jet printer nozzle plate and process therefor 有权
标题翻译：喷墨打印机喷嘴板及其工艺
公开(公告)号：US06409312B1
公开(公告)日：2002-06-25
申请号：US09818736
申请日：2001-03-27
申请人： James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams
发明人： James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams
IPC分类号： B41J204
CPC分类号： B41J2/1628 , B41J2/1433 , B41J2/162 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645
摘要： The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a semiconductor substrate containing ink ejection devices and a dry-etched ink via therein. A first photo-imaged polymer layer is applied to the semiconductor substrate, the first photo-imaged polymer layer being patterned and developed to contain ink flow chambers and ink flow channels corresponding to the ink ejection devices on the semiconductor substrate. A second photo-imaged polymer layer is applied to the first photo-imaged polymer layer. The second photo-imaged polymer layer is patterned and developed to contain nozzle holes corresponding to the ink chambers in the first photo-imaged polymer layer and corresponding to the ink ejection devices on the semiconductor substrate. The invention provides increased printhead manufacturing accuracy and elimination of alignment and adhesive attachment of a separate nozzle plate to an ink jet heater chip.
摘要翻译：本发明提供了一种用于喷墨打印机的打印头和一种用于制造用于喷墨打印机的打印头的方法。打印头包括含有喷墨装置的半导体基板和其中经过干蚀刻的墨水通道。将第一光成像聚合物层施加到半导体衬底上，第一光成像聚合物层被图案化和显影以包含对应于半导体衬底上的喷墨装置的墨流动室和墨流动通道。将第二光成像聚合物层施加到第一光成像聚合物层。第二光成像聚合物层被图案化和显影以包含对应于第一光成像聚合物层中的墨室的喷嘴孔，并对应于半导体衬底上的喷墨装置。本发明提供了增加的打印头制造精度并消除了单独的喷嘴板对喷墨加热器芯片的对准和粘合附着。

2. 发明授权

US06613687B2 Reverse reactive ion patterning of metal oxide films 有权
公开(公告)号：US06613687B2
公开(公告)日：2003-09-02
申请号：US09820045
申请日：2001-03-28
申请人： Brian Christopher Hart , James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams , Qing Ming Wang
发明人： Brian Christopher Hart , James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams , Qing Ming Wang
IPC分类号： H01L21302
CPC分类号： B41J2/1628 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14411 , H01L21/31122
摘要： The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device. The method may be practiced without the use of more dangerous or hazardous wet chemical etching techniques which may provide undesirable undercutting of the metal oxide layers or may leave contaminants on the patterned metal oxide layers.

3. 发明授权

US06357864B1 Tab circuit design for simplified use with hot bar soldering technique 有权
标题翻译： Tab电路设计，简化使用热棒焊接技术
公开(公告)号：US06357864B1
公开(公告)日：2002-03-19
申请号：US09464969
申请日：1999-12-16
申请人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
发明人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
IPC分类号： B41J205
CPC分类号： B41J2/14072 , B41J2/14024 , H05K3/3494 , H05K3/363 , H05K3/4084 , H05K2201/0394 , H05K2201/10681 , H05K2201/10977 , H05K2203/0195 , H05K2203/1311
摘要： The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.
摘要翻译：本发明提供了一种包含在喷墨打印机内的打印头墨盒体，其包含带状自动粘合（TAB）电路，其具有电连接到打印头加热器芯片和印刷电路板（PCB）的独特结构。此外，TAB电路架构可以通过各种方法容易地密封。 TAB电路包括细长孔，其具有垂直于穿过孔的电迹线对准的长度轴。每个迹线具有穿过孔的第一端，并且通过热棒焊接技术连接到PCB，并且迹线的第二端连接到打印头加热器芯片。密封剂层基本上包围矩形孔和防止墨雾接触连接的电连接。 TAB电路设计提供了制造过程的改进，并能够重新连接连接而不破坏TAB电路。

4. 发明授权

US06402299B1 Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer 有权
标题翻译：用于喷墨打印机中的喷墨墨盒组件的胶带自动粘合电路
公开(公告)号：US06402299B1
公开(公告)日：2002-06-11
申请号：US09425094
申请日：1999-10-22
申请人： Jan Richard DeMeerleer , Brian Christopher Hart , James Michael Mrvos , Gary Raymond Williams
发明人： Jan Richard DeMeerleer , Brian Christopher Hart , James Michael Mrvos , Gary Raymond Williams
IPC分类号： B41J214
CPC分类号： B41J2/14072 , B41J2/14016 , B41J2/14024
摘要： An ink jet cartridge assembly for use in an ink jet printer has a body with at least one inner ink chamber. A printhead is carried by the body and has a plurality of ink jetting orifices in fluid communication with the ink chamber. A tape automated bonding circuit carried by the body includes a flexible tape and a plurality of electrical traces. The flexible tape includes a chip window with a peripheral edge. The printhead is disposed within the chip window at a distance from the peripheral edge. Each electrical trace has a bottom side adjacent the body, a substrate held portion carried by the flexible tape, a free trace portion extending between the peripheral edge of the chip window and the printhead, and a printhead held portion connected with the printhead. The tape automated bonding circuit further includes a photoimagable coating which covers the bottom side of each electrical trace on all of the substrate held portion and the free trace portion, but does not cover the printhead held portion.
摘要翻译：用于喷墨打印机的喷墨墨盒组件具有至少一个内部墨水室的主体。打印头由主体承载并且具有与墨水室流体连通的多个喷墨孔。由本体承载的胶带自动接合电路包括柔性带和多个电迹线。柔性带包括具有外围边缘的芯片窗口。打印头设置在芯片窗口内与外围边缘一段距离处。每个电迹线具有邻近主体的底侧，由柔性带承载的基底保持部分，在芯片窗口的周边边缘和打印头之间延伸的自由迹线部分和与打印头连接的打印头保持部分。带式自动接合电路还包括可光成像的涂层，其覆盖所有基板保持部分和自由迹线部分上的每个电迹线的底侧，但不覆盖打印头保持部分。

5. 发明授权

US06323456B1 Method of forming an ink jet printhead structure 有权
标题翻译：形成喷墨打印头结构的方法
公开(公告)号：US06323456B1
公开(公告)日：2001-11-27
申请号：US09569127
申请日：2000-05-11
申请人： Ashok Murthy , Tonya Harris Jackson , Steven Robert Komplin , Gary Raymond Williams
发明人： Ashok Murthy , Tonya Harris Jackson , Steven Robert Komplin , Gary Raymond Williams
IPC分类号： B23K2638
CPC分类号： B41J2/1634 , B41J2/162 , B41J2/1623 , B41J2/1635 , B41J2/1645 , Y10T29/49401
摘要： A method for making an inkjet printhead nozzle plate from a composite strip containing a nozzle layer and an adhesive layer is disclosed. The adhesive layer is coated with a polymeric sacrificial layer prior to laser ablating the flow features in the composite strip. A method is also provided form improving adhesion between the adhesive layer and the sacrificial layer. Once the composite strip containing the sacrificial layer is prepared, the coated composite strip is then laser ablated to form flow features in the strip in order to form the nozzle plates. After forming the flow features, the sacrificial layer is removed individual inkjet printhead nozzle plate are separated from the composite strip by singulating the nozzle plates with a laser.
摘要翻译：公开了一种从包含喷嘴层和粘合剂层的复合带制造喷墨打印头喷嘴板的方法。在激光烧蚀复合带材中的流动特征之前，将粘合剂层涂覆有聚合物牺牲层。还提供了一种提高粘合剂层和牺牲层之间的粘附性的方法。一旦制备了包含牺牲层的复合带材，然后将涂覆的复合带材激光烧蚀以形成条带中的流动特征，以便形成喷嘴板。在形成流动特征之后，去除牺牲层，通过用激光单分割喷嘴板，单独的喷墨打印头喷嘴板与复合带分离。

6. 发明授权

US06852241B2 Method for making ink jet printheads 有权
标题翻译：制造喷墨打印头的方法
公开(公告)号：US06852241B2
公开(公告)日：2005-02-08
申请号：US09929849
申请日：2001-08-14
申请人： Brian Christopher Hart , Shauna Marie Leis , Gary Raymond Williams
发明人： Brian Christopher Hart , Shauna Marie Leis , Gary Raymond Williams
IPC分类号： B41J2/16 , B21D53/76 , B23P17/00 , G01D15/00 , G11B5/127
CPC分类号： B41J2/1645 , B41J2/1601 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1635 , Y10T29/49401
摘要： The invention provides an improved method for grit blasting slots in a silicon wafer. The method includes, providing a silicon wafer having a first surface and a second surface, the first surface containing resistive, conductive and insulative layers defining individual semiconductor components, applying a first substantially permanent non-water soluble layer selected from silane, photoresist materials and a combination of a silane layer and a photoresist layer to the first surface of the wafer to provide a first substantially permanent layer thereon, applying a water-soluble protective material to the first layer to provide a second layer, grit blasting slots in the wafer corresponding to the individual semiconductor components, and subsequently, removing the water-soluble protective layer from the wafer. The protective layer provides enhanced protection for the electrical components on a silicon wafer during a grit blasting process so that a higher yield of useable semiconductor chips may be made.
摘要翻译：本发明提供了一种用于硅晶片中的喷砂槽的改进方法。该方法包括：提供具有第一表面和第二表面的硅晶片，所述第一表面包含限定各个半导体部件的电阻，导电和绝缘层，施加选自硅烷，光致抗蚀剂材料的第一基本上永久的非水溶性层，以及将硅烷层和光致抗蚀剂层组合到晶片的第一表面上以在其上提供第一基本上永久的层，向第一层施加水溶性保护材料以提供第二层，在晶片中的喷砂槽对应于单独的半导体组件，随后从晶片上去除水溶性保护层。保护层在喷砂处理过程中为硅晶片上的电气部件提供增强的保护，从而可以制造更高的可用半导体芯片的产量。

7. 发明授权

US06243117B1 Print head cartridge and method of making a print head cartridge by one-shot injection molding 失效
标题翻译：打印头盒和通过一次注射成型制造打印头盒的方法
公开(公告)号：US06243117B1
公开(公告)日：2001-06-05
申请号：US08439912
申请日：1995-05-12
申请人： Fred Young Brandon , Robert Arnold Christiansen , Curtis Ray Droege , Lawrence Russell Steward , Gary Raymond Williams
发明人： Fred Young Brandon , Robert Arnold Christiansen , Curtis Ray Droege , Lawrence Russell Steward , Gary Raymond Williams
IPC分类号： B41J2175
CPC分类号： B41J2/17513 , B41J2/17553
摘要： A print head having an ink reservoir therein is made by forming, in a one-shot plastic injection molding step, a rigid monolithic frame comprising high melt temperature material having an opening therein extending from a first side to a second side, and first and second bonding surfaces surrounding the opening and facing the first and second sides, respectively. First and second thin flexible films are adhesively secured to the first and second bonding surfaces, respectively. The adhesive material may be a hot melt adhesive or dry adhesive films pre-formed to the shape of the bonding surfaces. By securing the flexible films to the bonding surfaces adhesively, rather than by heat staking, it is not necessary to form the frame of different materials during two separate molding steps.
摘要翻译：通过在单次注射成型步骤中形成包括具有从第一侧延伸到第二侧的开口的高熔体温度材料的刚性整体框架以及第一和第二侧面分别围绕开口并且面向第一和第二侧的表面粘合表面。第一和第二薄柔性膜分别粘合地固定到第一和第二接合表面。粘合剂材料可以是预先形成为粘合表面形状的热熔粘合剂或干燥粘合剂膜。通过粘合地将柔性膜固定到结合表面上，而不是通过热铆接，在两个分开的模制步骤期间不需要形成不同材料的框架。

8. 发明授权

US06834937B2 Printhead corrosion protection 有权
标题翻译：打印头防腐蚀
公开(公告)号：US06834937B2
公开(公告)日：2004-12-28
申请号：US10218063
申请日：2002-08-13
申请人： Eric Louis Killmeier , Paul Timothy Spivey , Sean Terrence Weaver , Gary Raymond Williams
发明人： Eric Louis Killmeier , Paul Timothy Spivey , Sean Terrence Weaver , Gary Raymond Williams
IPC分类号： B41J214
CPC分类号： B41J2/1753 , B41J2/14072 , H05K3/28 , H05K3/361
摘要： A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.
摘要翻译：一种用于将电迹线封装在柔性电路或TAB电路上的方法，以及柔性电路或TAB电路与打印头基板之间的电连接以抑制其油墨腐蚀的方法。该方法包括将第一粘合剂施加到柔性电路或TAB电路的第一表面。将第二粘合剂施加到柔性电路或TAB电路的第一表面，由此第一和第二粘合剂有效地涂覆迹线和连接的暴露部分。第一和第二粘合剂是可热固化的环氧组合物，其彼此可混溶，并且第一粘合剂具有低于第二粘合剂的第二粘度秒触变指数的第一粘度和第一触变指数。在施加粘合剂之后，第一和第二粘合剂被固化。

9. 发明授权

US06264317B1 Corrosion resistant printhead body for ink jet pen 有权
标题翻译：用于喷墨笔的防腐打印头体
公开(公告)号：US06264317B1
公开(公告)日：2001-07-24
申请号：US09443625
申请日：1999-11-19
申请人： Michael Raulinaitis , Jeanne Marie Saldanha Singh , Gary Raymond Williams
发明人： Michael Raulinaitis , Jeanne Marie Saldanha Singh , Gary Raymond Williams
IPC分类号： B41J2175
CPC分类号： B41J2/17536 , B41J2/17503 , B41J2/17553
摘要： The invention relates to an ink jet pen having exposed surfaces which are coated with a polymeric material. The polymeric material is treated with ultraviolet energy at a wavelength and for a period of time sufficient to increase the surface energy of the coating to thereby enhance the adhesive properties of the coating. The coated polymeric material and treated pen exhibits improved corrosion resistance and are more compatible with adhesives used to assemble components of the pen than similar untreated coatings.
摘要翻译：本发明涉及一种具有涂覆有聚合物材料的暴露表面的喷墨笔。聚合物材料用波长的紫外线能量处理足够长的时间以增加涂层的表面能，从而增强涂层的粘合性能。涂覆的聚合物材料和经处理的笔具有改善的耐腐蚀性，并且与相似的未处理涂层的组合装置的粘合剂更相容。

10. 发明授权

US6106096A Printhead stress relief 失效
标题翻译：打印头应力消除
公开(公告)号：US6106096A
公开(公告)日：2000-08-22
申请号：US990343
申请日：1997-12-15
申请人： Steven Robert Komplin , Ashok Murthy , Michael Raulinaitis , Gary Raymond Williams
发明人： Steven Robert Komplin , Ashok Murthy , Michael Raulinaitis , Gary Raymond Williams
IPC分类号： B41J2/05 , B41J2/14 , B41J2/16 , B41J2/015 , B41J2/135
CPC分类号： B41J2/1631 , B41J2/14032 , B41J2/1601 , B41J2/162 , B41J2/1623 , B41J2/1626 , B41J2/1634 , B41J2/1635 , B41J2/1645
摘要： The invention described in the specification relates to an ink jet printhead structure having semiconductor substrate containing energy imparting devices for ejecting ink through nozzle holes in a nozzle plate, to a method for making a printhead structure and to a printer cartridge containing the printhead structure. In order to reduce stresses induced in the structure during manufacturing and/or use thereof, a polymeric layer is disposed between the semiconductor substrate and nozzle plate which contains expansion void spaces or valleys sufficient to inhibit stresses in the structure during a process for bonding the nozzle plate to the polymeric layer thereby reducing misalignment and warpage problems associated with conventional printhead structures.
摘要翻译：本说明书中描述的本发明涉及一种具有半导体衬底的喷墨打印头结构，其具有用于通过喷嘴板中的喷嘴孔喷射墨水的能量赋予装置，以及用于制造打印头结构的方法以及包含打印头结构的打印机墨盒。为了减少在制造和/或使用期间在结构中引起的应力，在半导体衬底和喷嘴板之间设置聚合物层，该聚合物层包含在用于接合喷嘴的过程中足以抑制结构中的应力的膨胀空隙空间或谷从而减少与常规打印头结构相关的不对准和翘曲问题。

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