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1. 发明授权

US06409312B1 Ink jet printer nozzle plate and process therefor 有权
标题翻译：喷墨打印机喷嘴板及其工艺
公开(公告)号：US06409312B1
公开(公告)日：2002-06-25
申请号：US09818736
申请日：2001-03-27
申请人： James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams
发明人： James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams
IPC分类号： B41J204
CPC分类号： B41J2/1628 , B41J2/1433 , B41J2/162 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645
摘要： The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a semiconductor substrate containing ink ejection devices and a dry-etched ink via therein. A first photo-imaged polymer layer is applied to the semiconductor substrate, the first photo-imaged polymer layer being patterned and developed to contain ink flow chambers and ink flow channels corresponding to the ink ejection devices on the semiconductor substrate. A second photo-imaged polymer layer is applied to the first photo-imaged polymer layer. The second photo-imaged polymer layer is patterned and developed to contain nozzle holes corresponding to the ink chambers in the first photo-imaged polymer layer and corresponding to the ink ejection devices on the semiconductor substrate. The invention provides increased printhead manufacturing accuracy and elimination of alignment and adhesive attachment of a separate nozzle plate to an ink jet heater chip.
摘要翻译：本发明提供了一种用于喷墨打印机的打印头和一种用于制造用于喷墨打印机的打印头的方法。打印头包括含有喷墨装置的半导体基板和其中经过干蚀刻的墨水通道。将第一光成像聚合物层施加到半导体衬底上，第一光成像聚合物层被图案化和显影以包含对应于半导体衬底上的喷墨装置的墨流动室和墨流动通道。将第二光成像聚合物层施加到第一光成像聚合物层。第二光成像聚合物层被图案化和显影以包含对应于第一光成像聚合物层中的墨室的喷嘴孔，并对应于半导体衬底上的喷墨装置。本发明提供了增加的打印头制造精度并消除了单独的喷嘴板对喷墨加热器芯片的对准和粘合附着。

2. 发明授权

US06613687B2 Reverse reactive ion patterning of metal oxide films 有权
公开(公告)号：US06613687B2
公开(公告)日：2003-09-02
申请号：US09820045
申请日：2001-03-28
申请人： Brian Christopher Hart , James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams , Qing Ming Wang
发明人： Brian Christopher Hart , James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams , Qing Ming Wang
IPC分类号： H01L21302
CPC分类号： B41J2/1628 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14411 , H01L21/31122
摘要： The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device. The method may be practiced without the use of more dangerous or hazardous wet chemical etching techniques which may provide undesirable undercutting of the metal oxide layers or may leave contaminants on the patterned metal oxide layers.

3. 发明授权

US06387719B1 Method for improving adhesion 有权
标题翻译：改善附着力的方法
公开(公告)号：US06387719B1
公开(公告)日：2002-05-14
申请号：US09795731
申请日：2001-02-28
申请人： James Michael Mrvos , Carl Edmond Sullivan
发明人： James Michael Mrvos , Carl Edmond Sullivan
IPC分类号： H01L2100
CPC分类号： B41J2/1645 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , H01L21/312
摘要： The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.
摘要翻译：本发明提供了一种改善聚合物平面化膜和半导体芯片表面之间粘附性的方法。该方法包括沉积电阻，导电和/或绝缘材料到电感器芯片表面以提供用于喷墨打印机的半导体芯片。芯片表面在氧气氛下用干法蚀刻工艺处理一段时间并且在足以激活芯片表面的条件下进行处理。将聚合物平面化膜施加到半导体芯片的活化表面。作为干法蚀刻工艺的结果，在不进行芯片表面的干法蚀刻处理的情况下，平坦化膜的粘合性比平坦化膜与半导体表面之间的粘附性增加。

4. 发明授权

US06550893B2 Semiconductor chip for an ink jet printhead and method for making same 有权
公开(公告)号：US06550893B2
公开(公告)日：2003-04-22
申请号：US10047055
申请日：2002-01-14
申请人： James Michael Mrvos , Carl Edmond Sullivan
发明人： James Michael Mrvos , Carl Edmond Sullivan
IPC分类号： B41J2135
CPC分类号： B41J2/1645 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , H01L21/312
摘要： The invention provides a method for improving adhesion between a polymeric planarizing film and a semiconductor chip surface. The method includes deposition resistive, conductive and/or insulative materials to a seimconductor chip surface to provide a semiconductor chip for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip. A polymeric planarizing film is applied to the activated surface of the semiconductor chip. As a result of the dry etch process, adhesion of the planarizing film is increased over adhesion between the planarizing film and a semiconductor surface in the absence of the dry etch treatment of the chip surface.

5. 发明授权

US07273266B2 Micro-fluid ejection assemblies 有权
标题翻译：微流体喷射组件
公开(公告)号：US07273266B2
公开(公告)日：2007-09-25
申请号：US10823939
申请日：2004-04-14
申请人： John William Krawczyk , Andrew Lee McNees , James Michael Mrvos , Carl Edmond Sullivan
发明人： John William Krawczyk , Andrew Lee McNees , James Michael Mrvos , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628
摘要： A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.
摘要翻译：一种微流体喷射组件，包括其中具有精确形成的流体路径的硅衬底。流体路径是通过在具有不超过约5000埃的电介质层厚度的蚀刻之前在具有蚀刻前的表面特性的基底上进行的深反应离子蚀刻工艺形成的，以及基本上不含介质材料的凹坑表面，其中a 表面点蚀的均方根深度小于约500埃，最大表面点蚀深度不超过约2500埃。这种衬底中的流体路径具有改进的流动特性以便更可靠的流体喷射操作。

6. 发明授权

US06902867B2 Ink jet printheads and methods therefor 有权
标题翻译：喷墨打印头及其方法
公开(公告)号：US06902867B2
公开(公告)日：2005-06-07
申请号：US10262827
申请日：2002-10-02
申请人： Eric Spencer Hall , Shauna Marie Leis , Andrew Lee McNees , James Michael Mrvos , James Harold Powers , Carl Edmond Sullivan
发明人： Eric Spencer Hall , Shauna Marie Leis , Andrew Lee McNees , James Michael Mrvos , James Harold Powers , Carl Edmond Sullivan
IPC分类号： B41J2/16 , B41J2/05
CPC分类号： B41J2/1623 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1635 , B41J2/1645
摘要： The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
摘要翻译：本发明提供了一种在用于喷墨打印头的半导体硅衬底芯片中制造墨水供给通孔的方法，以及通过该方法制造的含有硅芯片的喷墨打印头。该方法包括将第一光致抗蚀剂材料施加到芯片的第一表面侧。第一光致抗蚀剂材料被图案化和显影以在其中限定至少一个墨通孔位置。将蚀刻停止材料施加到芯片的第二表面侧。通过干法蚀刻工艺将至少一个墨通孔从芯片的第一表面侧通过硅片的厚度直到蚀刻停止层。与传统的油墨通孔形成技术相反，该方法显着提高了硅芯片的生产量，并减少了由于断屑和破裂造成的损耗。所得到的芯片对于长期的打印头使用更可靠。

7. 发明授权

US06668445B1 Method of increasing tab bond strength using reactive ion etching 有权
标题翻译：使用反应离子蚀刻增加片状结合强度的方法
公开(公告)号：US06668445B1
公开(公告)日：2003-12-30
申请号：US09481254
申请日：2000-01-11
申请人： James Michael Mrvos , Michael Raulinaitis , Carl Edmond Sullivan
发明人： James Michael Mrvos , Michael Raulinaitis , Carl Edmond Sullivan
IPC分类号： H05B300
CPC分类号： G03G9/0821 , H05K3/3489 , H05K3/361 , Y10S438/906 , Y10T29/49083 , Y10T29/49169 , Y10T29/49401
摘要： A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.
摘要翻译：将喷墨打印机的加热器芯片自动粘合到柔性电路的带的方法包括将导电焊盘附接到加热器芯片的表面的第一部分的步骤。将掩模施加到加热器芯片的表面的第二部分。接合焊盘的暴露表面被化学干蚀刻预定的时间段，从而从蚀刻的暴露表面去除污染物。化学干蚀刻在预定时间段结束时终止，使得基本上没有去除焊盘。最后，柔性电路电连接到蚀刻的暴露表面。

8. 发明授权

US06310641B1 Integrated nozzle plate for an inkjet print head formed using a photolithographic method 有权
标题翻译：用于使用光刻法形成的喷墨打印头的集成喷嘴板
公开(公告)号：US06310641B1
公开(公告)日：2001-10-30
申请号：US09330973
申请日：1999-06-11
申请人： James Michael Mrvos , Carl Edmond Sullivan , Ashok Murthy
发明人： James Michael Mrvos , Carl Edmond Sullivan , Ashok Murthy
IPC分类号： B41J214
CPC分类号： B41J2/1631 , B41J2/1433 , B41J2/162 , B41J2/1628 , B41J2/1629 , B41J2/1645 , B41J2/1646
摘要： An integrated nozzle plate having a heater chip and nozzles, firing chambers and channels formed from several layers of resist material affixed to the heater chip. The nozzles, firing chambers and channels are formed in the resist material using a photolithographic method. The photolithographic method involves placing a negative resist layer directly on a silicon wafer heater chip. A protective layer is then placed on top of the negative resist layer to act as a mask. A positive resist layer is then placed on top of the protective layer. A first mask is placed on the positive resist layer. The integrated nozzle plate is then exposed to ultraviolet light and the positive resist layer is developed. The protective layer not covered by the positive resist layer is removed and a second negative resist layer is deposited thereon. A second mask is placed on the second negative resist layer. The first and second negative resist layers are exposed to ultraviolet light and the negative resist layers are developed. The resulting integrated nozzle plate is then mounted to a print head, connected to an ink reservoir and placed in an inkjet printer for use.
摘要翻译：具有加热器芯片和喷嘴，燃烧室和由固定到加热器芯片上的几层抗蚀剂材料形成的通道的集成喷嘴板。使用光刻法在抗蚀剂材料中形成喷嘴，燃烧室和通道。光刻方法包括将负抗蚀剂层直接放置在硅晶片加热器芯片上。然后将保护层放置在负抗蚀剂层的顶部上以用作掩模。然后将正性抗蚀剂层放置在保护层的顶部。将第一掩模放置在正抗蚀剂层上。然后将集成喷嘴板暴露于紫外光，并且正性抗蚀剂层显影。除去未被正性抗蚀剂层覆盖的保护层，并在其上沉积第二负性抗蚀剂层。第二掩模被放置在第二负抗蚀剂层上。第一和第二负抗蚀剂层暴露于紫外光，负的抗蚀剂层显影。所得到的集成喷嘴板然后安装到打印头，连接到墨水储存器并放置在喷墨打印机中以供使用。

9. 发明授权

US06357864B1 Tab circuit design for simplified use with hot bar soldering technique 有权
标题翻译： Tab电路设计，简化使用热棒焊接技术
公开(公告)号：US06357864B1
公开(公告)日：2002-03-19
申请号：US09464969
申请日：1999-12-16
申请人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
发明人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
IPC分类号： B41J205
CPC分类号： B41J2/14072 , B41J2/14024 , H05K3/3494 , H05K3/363 , H05K3/4084 , H05K2201/0394 , H05K2201/10681 , H05K2201/10977 , H05K2203/0195 , H05K2203/1311
摘要： The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.
摘要翻译：本发明提供了一种包含在喷墨打印机内的打印头墨盒体，其包含带状自动粘合（TAB）电路，其具有电连接到打印头加热器芯片和印刷电路板（PCB）的独特结构。此外，TAB电路架构可以通过各种方法容易地密封。 TAB电路包括细长孔，其具有垂直于穿过孔的电迹线对准的长度轴。每个迹线具有穿过孔的第一端，并且通过热棒焊接技术连接到PCB，并且迹线的第二端连接到打印头加热器芯片。密封剂层基本上包围矩形孔和防止墨雾接触连接的电连接。 TAB电路设计提供了制造过程的改进，并能够重新连接连接而不破坏TAB电路。

10. 发明授权

US08061811B2 Micro-fluid ejection heads with chips in pockets 有权
标题翻译：微型液体喷射头，带有口袋中的芯片
公开(公告)号：US08061811B2
公开(公告)日：2011-11-22
申请号：US11536470
申请日：2006-09-28
申请人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
发明人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
IPC分类号： B41J2/04
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , Y10T29/49401
摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.
摘要翻译：提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。导电材料沉积在衬底的器件表面附近并与芯片电连通。

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