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    • 1. 发明授权
    • Jig for coating rotor blades
    • 用于涂覆转子叶片的夹具
    • US5702574A
    • 1997-12-30
    • US505322
    • 1996-05-03
    • John FosterAlan TaylorMartin Patrick Chatterley
    • John FosterAlan TaylorMartin Patrick Chatterley
    • C25D5/02C25D5/12C25D15/02C25D17/06F01D5/20F01D25/28
    • F01D25/285C25D15/02C25D17/06C25D5/02F01D11/12
    • A method of and apparatus for producing abrasive tips on compressor or turbine rotor blades by electrolytic or electroless deposition in which the blades are mounted in a hollow jig with the tips of the blades extending through sealed openings in the jig and abrasive tips are formed on the tips. The parts of the blades within the hollow jig are isolated from the electrolyte without the need for wax masking. Preferably the jig is cylindrical with the blades extending radially through at least one circumferential row of apertures. The jig may comprise two end discs and at least one ring in which a circumferential row of apertures is formed. The ring is positioned between the end discs and means are provided for securing the discs and ring together.
    • PCT No.PCT / GB94 / 02777 Sec。 371日期:1996年5月3日 102(e)日期1996年5月3日PCT 1994年12月21日PCT PCT。 第WO95 / 17535号公报 日期1995年6月29日一种用于通过电解或无电沉积在压缩机或涡轮转子叶片上产生磨料尖端的方法和设备,其中叶片安装在中空夹具中,其中叶片的尖端延伸穿过夹具中的密封开口和磨料 技巧是在技巧上形成的。 中空夹具内的叶片的部分与电解质分离,而不需要蜡掩蔽。 优选地,夹具是圆柱形的,其中叶片径向延伸穿过至少一个圆周排的孔。 夹具可以包括两个端盘和至少一个环,其中形成有圆周排的孔。 环位于端盘之间,并且提供用于将盘和环固定在一起的装置。
    • 7. 发明授权
    • Low temperature etching of silicon nitride structures using phosphoric acid solutions
    • 使用磷酸溶液对氮化硅结构进行低温蚀刻
    • US08716146B2
    • 2014-05-06
    • US13541397
    • 2012-07-03
    • Gregory NowlingJohn Foster
    • Gregory NowlingJohn Foster
    • H01L21/302
    • H01L21/31111H01L21/67086H01L29/6653
    • Provided are methods for processing semiconductor substrates. The methods involve etching silicon nitride structures using phosphoric acid solutions maintained at low temperatures, such as between about 110° C. and 130° C. These temperatures provide adequate etching rates and do not damage surrounding metal silicide and silicon oxide structures. The etching rates of silicon nitride may be 10 Angstroms per minute and greater. Lower temperatures also allow decreasing concentrations of phosphoric acid in the etching solutions, which in some embodiments may be less than 90 weight percent. As a result, more selective etching of the silicon nitride structures may be achieved. This selectivity may be as high as hundred times relative to the silicide and silicon oxide structures. The surface conductivity of the silicide structures may remain substantially unchanged by this etching process.
    • 提供了用于处理半导体衬底的方法。 该方法包括使用保持在低温(例如约110℃至130℃)之间的磷酸溶液来蚀刻氮化硅结构。这些温度提供足够的蚀刻速率,并且不会损坏周围的金属硅化物和氧化硅结构。 氮化硅的蚀刻速率可以为每分钟10埃或更高。 较低的温度也允许蚀刻溶液中磷酸的浓度降低,在一些实施方案中磷酸的浓度可以小于90重量%。 结果,可以实现对氮化硅结构的更多的选择性蚀刻。 相对于硅化物和氧化硅结构,该选择性可高达百倍。 通过该蚀刻工艺,硅化物结构的表面电导率可以保持基本不变。