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1. 发明授权

US08110906B2 Semiconductor device including isolation layer 有权
标题翻译：半导体器件包括隔离层
公开(公告)号：US08110906B2
公开(公告)日：2012-02-07
申请号：US11778427
申请日：2007-07-16
申请人： Joachim Mahler , Wae Chet Yong , Stanley Job Doraisamy , Gerhard Deml , Rupert Fischer , Reimund Engl
发明人： Joachim Mahler , Wae Chet Yong , Stanley Job Doraisamy , Gerhard Deml , Rupert Fischer , Reimund Engl
IPC分类号： H01L21/00 , H01L23/02 , H01L23/495
CPC分类号： H01L23/49562 , H01L21/6836 , H01L23/49513 , H01L23/49575 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/04026 , H01L2224/05554 , H01L2224/274 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.
摘要翻译：半导体器件包括载体，半导体芯片，其包括在第一面上的有源区域和施加到第二面上的单独的隔离层，以及将隔离层耦合到载体的粘合材料，第二面朝向载体。

2. 发明申请

US20080173992A1 SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER 有权
标题翻译：包含隔离层的半导体器件
公开(公告)号：US20080173992A1
公开(公告)日：2008-07-24
申请号：US11778427
申请日：2007-07-16
申请人： Joachim Mahler , Wae Chet Yong , Stanley Job Doraisamy , Gerhard Deml , Rupert Fischer , Reimund Engl
发明人： Joachim Mahler , Wae Chet Yong , Stanley Job Doraisamy , Gerhard Deml , Rupert Fischer , Reimund Engl
IPC分类号： H01L21/00 , H01L23/02 , H01L23/495
CPC分类号： H01L23/49562 , H01L21/6836 , H01L23/49513 , H01L23/49575 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/04026 , H01L2224/05554 , H01L2224/274 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10253 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.
摘要翻译：半导体器件包括载体，半导体芯片，其包括在第一面上的有源区域和施加到第二面上的单独的隔离层，以及将隔离层耦合到载体的粘合材料，第二面朝向载体。

3. 发明授权

US08067841B2 Semiconductor devices having a resin with warpage compensated surfaces 有权
标题翻译：具有具有翘曲补偿表面的树脂的半导体器件
公开(公告)号：US08067841B2
公开(公告)日：2011-11-29
申请号：US12036930
申请日：2008-02-25
申请人： Chai Wei Heng , Wae Chet Yong , Stanley Job Doraisamy , Khai Huat Jeffrey Low , Gerhard Deml
发明人： Chai Wei Heng , Wae Chet Yong , Stanley Job Doraisamy , Khai Huat Jeffrey Low , Gerhard Deml
IPC分类号： H01L23/29
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
摘要翻译：一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面，具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。

4. 发明申请

US20090212446A1 Semiconductor Device 有权
标题翻译：半导体器件
公开(公告)号：US20090212446A1
公开(公告)日：2009-08-27
申请号：US12036930
申请日：2008-02-25
申请人： Chai Wei Heng , Wae Chet Yong , Stanley Job Doraisamy , Khai Huat Jeffrey Low , Gerhard Deml
发明人： Chai Wei Heng , Wae Chet Yong , Stanley Job Doraisamy , Khai Huat Jeffrey Low , Gerhard Deml
IPC分类号： H01L23/31 , H01L21/56
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
摘要翻译：一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面，具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。

5. 发明申请

US20120058606A1 Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures 有权
标题翻译：制造具有翘曲补偿结构的树脂的半导体器件的方法
公开(公告)号：US20120058606A1
公开(公告)日：2012-03-08
申请号：US13293844
申请日：2011-11-10
申请人： Chai Wei Heng , Wae Chet Yong , Stanley Job Doraisamy , Khai Huat Jeffrey Low , Gerhard Deml
发明人： Chai Wei Heng , Wae Chet Yong , Stanley Job Doraisamy , Khai Huat Jeffrey Low , Gerhard Deml
IPC分类号： H01L21/50 , H01L21/56
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
摘要翻译：一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置用于安装到外部设备的主表面，具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。

6. 发明授权

US08377753B2 Method of fabricating a semiconductor device having a resin with warpage compensated structures 有权
标题翻译：具有具有翘曲补偿结构的树脂的半导体器件的制造方法
公开(公告)号：US08377753B2
公开(公告)日：2013-02-19
申请号：US13293844
申请日：2011-11-10
申请人： Chai Wei Heng , Wae Chet Yong , Stanley Job Doraisamy , Khai Huat Jeffrey Low , Gerhard Deml
发明人： Chai Wei Heng , Wae Chet Yong , Stanley Job Doraisamy , Khai Huat Jeffrey Low , Gerhard Deml
IPC分类号： H01L23/29
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/49562 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
摘要翻译：一种半导体器件，包括：管芯焊盘，管芯焊盘上的管芯，以及封装所述管芯并在所述管芯焊盘上形成隔离厚度的树脂，所述树脂包括安装孔和被配置为安装到外部设备的主表面，具有与模具相邻的非翘曲补偿部分的主表面和在非翘曲补偿部分和翘曲补偿部分之间具有近似不连续性和/或梯度的突然变化的相对热不活动区域中的翘曲补偿部分。

7. 发明申请

US20090045493A1 SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING 有权
标题翻译：半导体元件及其生产方法
公开(公告)号：US20090045493A1
公开(公告)日：2009-02-19
申请号：US12067113
申请日：2005-09-27
申请人： Wae Chet Yong , Mohd Fauzi HJ Mahat , Stanley Job Doraisamy , Tien Lai Tan
发明人： Wae Chet Yong , Mohd Fauzi HJ Mahat , Stanley Job Doraisamy , Tien Lai Tan
IPC分类号： H01L21/66 , H01L23/48
CPC分类号： H01L24/85 , H01L23/49562 , H01L24/05 , H01L24/06 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05552 , H01L2224/05554 , H01L2224/05624 , H01L2224/0603 , H01L2224/40245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/73221 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/20757 , H01L2924/2076 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor component and method for producing. The semiconductor component includes a semiconductor device and a leadframe. A package layout is defined and the orientation of electrically conductive members with respect to the semiconductor device and inner contact areas of the leadframe is altered so as to maximize the interfacial bonding area. The constraints of the standard package dimensions and the component assembly method are taken into account.
摘要翻译：半导体元件及其制造方法。半导体部件包括半导体器件和引线框架。定义封装布局，改变导电构件相对于半导体器件和引线框架的内部接触区域的取向，从而最大化界面结合面积。考虑到标准包尺寸和组件装配方法的约束。

8. 发明申请

US20120162924A1 Integrated Semiconductor Outline Package 审中-公开
标题翻译：集成半导体外形封装
公开(公告)号：US20120162924A1
公开(公告)日：2012-06-28
申请号：US13412881
申请日：2012-03-06
申请人： Stanley Job Doraisamy , Wae Chet Yong
发明人： Stanley Job Doraisamy , Wae Chet Yong
IPC分类号： H05K7/20 , H05K7/06
CPC分类号： H05K1/18 , H01L23/49541 , H01L23/49555 , H01L23/49562 , H01L2924/0002 , H05K1/0263 , H05K1/181 , H05K2201/10166 , H05K2201/10659 , H01L2924/00
摘要： A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.
摘要翻译：为适用于汽车的控制模块的半导体集成器件提供晶体管外形封装，用于连接印刷电路板和这种模块的母线。封装包括封装壳体，其具有适于安装到PCB并具有宽度的第一端。该封装还形成有引线框架，该引线框架包括适于连接到母线的散热器和接地平面叶片，适合于连接到PCB的多个连接器引线和适于连接到模块连接器的至少一个源极突起引线的这种控制模块。多个连接引线和源极突片从包装壳体的第一端沿着包装壳体的第一端的宽度方向并排地延伸。

9. 发明授权

US08169069B2 Integrated semiconductor outline package 有权
标题翻译：集成半导体外形封装
公开(公告)号：US08169069B2
公开(公告)日：2012-05-01
申请号：US12513906
申请日：2006-12-05
申请人： Stanley Job Doraisamy , Wae Chet Yong
发明人： Stanley Job Doraisamy , Wae Chet Yong
IPC分类号： H01L21/302
CPC分类号： H05K1/18 , H01L23/49541 , H01L23/49555 , H01L23/49562 , H01L2924/0002 , H05K1/0263 , H05K1/181 , H05K2201/10166 , H05K2201/10659 , H01L2924/00
摘要： A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.
摘要翻译：为适用于汽车的控制模块的半导体集成器件提供晶体管外形封装，用于连接印刷电路板和这种模块的母线。封装包括封装壳体，其具有适于安装到PCB并具有宽度的第一端。该封装还形成有引线框架，该引线框架包括适于连接到母线的散热器和接地平面叶片，适合于连接到PCB的多个连接器引线和适于连接到模块连接器的至少一个源极突起引线的这种控制模块。多个连接引线和源极突片从包装壳体的第一端沿着包装壳体的第一端的宽度方向并排地延伸。

10. 发明授权

US07791182B2 Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing 有权
标题翻译：具有使与半导体器件连接并连接到引线框的导电构件的接合面积最大化的半导体元件及其制造方法
公开(公告)号：US07791182B2
公开(公告)日：2010-09-07
申请号：US12067113
申请日：2005-09-27
申请人： Wae Chet Yong , Mohd Fauzi HJ Mahat , Stanley Job Doraisamy , Tien Lai Tan
发明人： Wae Chet Yong , Mohd Fauzi HJ Mahat , Stanley Job Doraisamy , Tien Lai Tan
IPC分类号： H01L23/495
CPC分类号： H01L24/85 , H01L23/49562 , H01L24/05 , H01L24/06 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05552 , H01L2224/05554 , H01L2224/05624 , H01L2224/0603 , H01L2224/40245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/73221 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/20757 , H01L2924/2076 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor component and method for producing. The semiconductor component includes a semiconductor device and a leadframe. A package layout is defined and the orientation of electrically conductive members with respect to the semiconductor device and inner contact areas of the leadframe is altered so as to maximize the interfacial bonding area. The constraints of the standard package dimensions and the component assembly method are taken into account.
摘要翻译：半导体元件及其制造方法。半导体部件包括半导体器件和引线框架。定义封装布局，改变导电构件相对于半导体器件和引线框架的内部接触区域的取向，从而最大化界面结合面积。考虑到标准包尺寸和组件装配方法的约束。

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