专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120305882A1 NiO-based Resistive Random Access Memory and the Preparation Method Thereof 审中-公开
标题翻译：基于NiO的电阻随机存取存储器及其制备方法
公开(公告)号：US20120305882A1
公开(公告)日：2012-12-06
申请号：US13498973
申请日：2011-09-23
申请人： Jingjing Gu , Qingqing Sun , Pengfei Wang , Peng Zhou , Wei Zhang
发明人： Jingjing Gu , Qingqing Sun , Pengfei Wang , Peng Zhou , Wei Zhang
IPC分类号： H01L45/00 , H01L21/02
CPC分类号： H01L45/146 , G11C13/0007 , H01L45/06 , H01L45/16
摘要： The present invention belongs to the technical field of memory storage and specially relates to a NiO-based resistive random access memory system (RRAM) and a preparation method thereof. The RRAM is comprised of a substrate and a metal-insulator-metal (MIM) structure, wherein the electrodes are metal films, such as copper, aluminum, etc., capable of being applied to the interconnection process, and the resistive switching insulator is an Al2O3/NiO/Al2O3 laminated dielectric film. The MIM structure in the invention shows stable switching between the bi-stable resistance states as well as memory features; compared with the RRAM that only uses a single NiO-based dielectric film, the storage window is increased, and the resistance stability is improved. Therefore, the NiO-based RRAM has a good prospect in actual application. The present invention further provides a method for preparing the abovementioned memory storage system.
摘要翻译：本发明属于存储器的技术领域，特别涉及一种基于NiO的电阻随机存取存储器（RRAM）及其制备方法。 RRAM由衬底和金属 - 绝缘体 - 金属（MIM）结构构成，其中电极是可应用于互连工艺的金属膜，例如铜，铝等，并且电阻式开关绝缘子是 Al2O3 / NiO / Al2O3层压电介质膜。本发明的MIM结构显示了稳定的电阻状态和存储特征之间的稳定切换; 与仅使用单个NiO基电介质膜的RRAM相比，存储窗口增加，并且电阻稳定性得到改善。因此，基于NiO的RRAM在实际应用中具有良好的前景。本发明还提供了一种用于制备上述存储器存储系统的方法。

2. 发明授权

US09099178B2 Resistive random access memory with electric-field strengthened layer and manufacturing method thereof 有权
标题翻译：具有电场强化层的电阻随机存取存储器及其制造方法
公开(公告)号：US09099178B2
公开(公告)日：2015-08-04
申请号：US13457035
申请日：2012-04-26
申请人： Wei Zhang , Lin Chen , Peng Zhou , Qingqing Sun , Pengfei Wang
发明人： Wei Zhang , Lin Chen , Peng Zhou , Qingqing Sun , Pengfei Wang
IPC分类号： H01L29/86 , H01L27/24 , G11C13/00 , H01L45/00
CPC分类号： G11C13/0007 , G11C2213/55 , H01L27/2436 , H01L45/04 , H01L45/1233 , H01L45/146 , H01L45/1616
摘要： This invention belongs to the technical field of memories and specifically relates to a resistive random access memory structure with an electric-field strengthened layer and a manufacturing method thereof. The resistive random access memory in the present invention can include a top electrode, a bottom electrode and a composite layer which is placed between the top electrode and the bottom electrode and have a first resistive switching layer and a second resistive switching and electric-field strengthened layer; the second resistive switching and electric-field strengthened layer cab be adjacent to the first resistive switching layer and have a dielectric constant lower than that of the first resistive switching layer. The electric-field distribution in the RRAM unit is adjustable.
摘要翻译：本发明属于存储器的技术领域，具体涉及一种具有电场强化层的电阻随机存取存储器结构及其制造方法。本发明的电阻式随机存取存储器可以包括顶电极，底电极和复合层，它放置在顶电极和底电极之间，并具有第一电阻开关层和第二电阻开关和电场强化层; 第二电阻开关和电场强化层驾驶室与第一电阻式开关层相邻，其介电常数低于第一电阻式开关层的介电常数。 RRAM单元中的电场分布是可调的。

3. 发明申请

US20120305880A1 RESISTIVE RANDOM ACCESS MEMORY WITH ELECTRIC-FIELD STRENGTHENED LAYER AND MANUFACTURING METHOD THEREOF 有权
标题翻译：具有电场强化层的电阻随机存取存储器及其制造方法
公开(公告)号：US20120305880A1
公开(公告)日：2012-12-06
申请号：US13457035
申请日：2012-04-26
申请人： Wei Zhang , Lin Chen , Peng Zhou , Qingqing Sun , Pengfei Wang
发明人： Wei Zhang , Lin Chen , Peng Zhou , Qingqing Sun , Pengfei Wang
IPC分类号： H01L45/00
CPC分类号： G11C13/0007 , G11C2213/55 , H01L27/2436 , H01L45/04 , H01L45/1233 , H01L45/146 , H01L45/1616
摘要： This invention belongs to the technical field of memories and specifically relates to a resistive random access memory structure with an electric-field strengthened layer and a manufacturing method thereof. The resistive random access memory in the present invention can include a top electrode, a bottom electrode and a composite layer which is placed between the top electrode and the bottom electrode and have a first resistive switching layer and a second resistive switching and electric-field strengthened layer; the second resistive switching and electric-field strengthened layer cab be adjacent to the first resistive switching layer and have a dielectric constant lower than that of the first resistive switching layer. The electric-field distribution in the RRAM unit is adjustable.
摘要翻译：本发明属于存储器的技术领域，具体涉及一种具有电场强化层的电阻随机存取存储器结构及其制造方法。本发明的电阻式随机存取存储器可以包括顶电极，底电极和复合层，它放置在顶电极和底电极之间，并具有第一电阻开关层和第二电阻开关和电场强化层; 第二电阻开关和电场强化层驾驶室与第一电阻式开关层相邻，其介电常数低于第一电阻式开关层的介电常数。 RRAM单元中的电场分布是可调的。

4. 发明申请

US20140167134A1 SELF-ALIGNED VERTICAL NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 审中-公开
标题翻译：自对准垂直非线性半导体存储器件
公开(公告)号：US20140167134A1
公开(公告)日：2014-06-19
申请号：US13514032
申请日：2012-02-02
申请人： Pengfei Wang , Xi Lin , Qingqing Sun , Wei Zhang
发明人： Pengfei Wang , Xi Lin , Qingqing Sun , Wei Zhang
IPC分类号： H01L27/115
CPC分类号： H01L27/11563 , G11C16/0475 , H01L21/84 , H01L27/1021 , H01L27/1026 , H01L27/1157 , H01L27/1203 , H01L29/7391 , H01L29/7923 , H01L29/8616
摘要： The present invention belongs to the technical field of semiconductor memory devices and specifically relates to a self-aligned vertical nonvolatile semiconductor memory device, Including: a semiconductor substrate, a drain region of a first doping type, two source regions of a second doping type, a stacked gate used to capture electrons; wherein the drain region, the two source regions and the stacked gate form two tunneling field effect transistors (TFETs) sharing one gate and one drain, the drain region current of each of the TFET is affected by the quantity and distribution of the charges in the stacked gate used to capture electrons, the drain is buried in the semiconductor substrate, the source regions above the drain region are separated from the drain through a channel and separated form each other through a region of the first doping type. The semiconductor memory device of the present invention features small unit area and simple manufacturing process. The memory chip using the present invention is of low manufacturing cost and high storage density.
摘要翻译：本发明属于半导体存储器件的技术领域，具体涉及一种自对准的垂直非易失性半导体存储器件，包括：半导体衬底，第一掺杂类型的漏极区域，第二掺杂型的两个源极区域，用于捕获电子的堆叠栅; 其中漏极区域，两个源极区域和堆叠的栅极形成共享一个栅极和一个漏极的两个隧道场效应晶体管（TFET），每个TFET的漏极区域电流受到电荷的量和分布的影响用于捕获电子的堆叠栅极，漏极埋在半导体衬底中，漏极区域上方的源极区域通过沟道与漏极分离，并通过第一掺杂类型的区域彼此分离。本发明的半导体存储器件具有小的单位面积和简单的制造工艺。使用本发明的存储芯片的制造成本低，存储密度高。

5. 发明申请

US20140034891A1 SEMICONDUCTOR MEMORY STRUCTURE AND ITS MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体存储器结构及其制造方法
公开(公告)号：US20140034891A1
公开(公告)日：2014-02-06
申请号：US13376994
申请日：2011-08-15
申请人： Pengfei Wang , Xi Lin , Qingqing Sun , Wei Zhang
发明人： Pengfei Wang , Xi Lin , Qingqing Sun , Wei Zhang
IPC分类号： H01L27/24
CPC分类号： H01L27/2463 , H01L27/2445 , H01L27/2472 , H01L29/7391 , H01L45/04 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/146 , H01L45/1675
摘要： The present invention belongs to the technical field of microelectronic devices, specifically relates to a semiconductor memory structure and its manufacturing method thereof. The semiconductor memory structure which carries out erasing, writing and reading operation on the phase change memory or the resistance change memory through a tunneling field-effect transistor is formed, for one hand, the high current passed through the tunneling field-effect transistor when the p-n junction the biased positively, meeting the high current requirements for erasing of and writing of the phase change memory and the resistance change memory, and on the other hand, Vertical structure of the field-effect transistor can greatly improve the density of memory devices arrays. The present invention also discloses a method, which is very suitable for the memory chips, for the manufacturing of the semiconductor memory structure using self-aligned process.
摘要翻译：本发明属于微电子器件的技术领域，具体涉及一种半导体存储器结构及其制造方法。形成通过隧道场效应晶体管对相变存储器或电阻变化存储器进行擦除，写入和读取操作的半导体存储器结构，一方面，当电流通过隧道场效应晶体管时， pn结积极偏置，满足擦除和写入相变存储器和电阻变化存储器的高电流要求，另一方面，场效应晶体管的垂直结构可以大大提高存储器件阵列的密度。本发明还公开了一种非常适用于存储芯片的方法，用于使用自对准工艺制造半导体存储器结构。

6. 发明授权

US08574958B2 Method for manufacturing a gate-control diode semiconductor memory device 有权
标题翻译：栅极控制二极管半导体存储器件的制造方法
公开(公告)号：US08574958B2
公开(公告)日：2013-11-05
申请号：US13535032
申请日：2012-06-27
申请人： Pengfei Wang , Xiaoyong Liu , Qingqing Sun , Wei Zhang
发明人： Pengfei Wang , Xiaoyong Liu , Qingqing Sun , Wei Zhang
IPC分类号： H01L21/00
CPC分类号： H01L29/7391 , H01L29/8616
摘要： This invention belongs to semiconductor device manufacturing field and discloses a method for manufacturing a gate-control diode semiconductor storage device. When the floating gate voltage is relatively high, the channel under the floating gate is of n type and a simple gate-control pn junction structure is configured; by controlling effective n-type concentration of the ZnO film through back-gate control, inverting the n-type ZnO into p-type through a floating gate and using NiO as a p-type semiconductor, an n-p-n-p doping structure is formed while the quantity of charges in the floating gate determines the device threshold voltage, thus realizing memory functions. This invention features capacity of manufacturing gate-control diode memory devices able to reduce the chip power consumption through advantages of high driving current and small sub-threshold swing. This invention is applicable to semiconductor devices manufacturing based on flexible substrate and flat panel displays and floating gate memories, etc.
摘要翻译：本发明属于半导体器件制造领域，并且公开了一种用于制造栅极控制二极管半导体存储器件的方法。当浮动栅极电压相对较高时，浮动栅极下的沟道为n型，并配置了简单的栅极控制pn结结构; 通过背栅控制来控制ZnO膜的有效n型浓度，通过浮栅将n型ZnO反转为p型，并使用NiO作为p型半导体，形成npnp掺杂结构，浮动门中的电荷决定了器件的阈值电压，从而实现了存储器的功能。本发明具有制造栅极控制二极管存储器件的能力，其能够通过高驱动电流和小的次级阈值摆动的优点来降低芯片功耗。本发明适用于基于柔性基板和平板显示器和浮动栅极存储器等的半导体器件制造。

7. 发明申请

US20130178013A1 METHOD FOR MANUFACTURING A GATE-CONTROL DIODE SEMICONDUCTOR DEVICE 有权
标题翻译：制造门控二极管半导体器件的方法
公开(公告)号：US20130178013A1
公开(公告)日：2013-07-11
申请号：US13534983
申请日：2012-06-27
申请人： Pengfei Wang , Chengwei Cao , Qingqing Sun , Wei Zhang
发明人： Pengfei Wang , Chengwei Cao , Qingqing Sun , Wei Zhang
IPC分类号： H01L21/34
CPC分类号： H01L29/22 , H01L29/66356 , H01L29/7391
摘要： This invention belongs to semiconductor device manufacturing field and discloses a method for manufacturing a gate-control diode semiconductor device. When the gate voltage is relatively high, the channel under the gate has an n type and the device has a simple gate-control pn junction structure; by way of controlling the effective n-type concentration of the ZnO film through back-gate control, inverting the n-type ZnO into p-type through the gate and using NiO as a p-type semiconductor, an n-p-n-p doping structure is formed. The present invention features capacity of manufacturing gate-control diode devices able to reduce the chip power consumption through the advantages of a high driving current and small sub-threshold swing, is especially applicable to the manufacturing of reading & writing devices having flat panel displays & phase change memory, and semiconductor devices based on flexible substrates.
摘要翻译：本发明属于半导体器件制造领域，并且公开了一种用于制造栅极控制二极管半导体器件的方法。当栅极电压相对较高时，栅极下方的沟道具有n型，器件具有简单的栅极控制pn结结构; 通过背栅控制来控制ZnO膜的有效n型浓度，通过栅极将n型ZnO转换成p型并使用NiO作为p型半导体，形成n-p-n-p掺杂结构。本发明特征在于能够通过高驱动电流和小的次阈值摆幅的优点来制造能够降低芯片功耗的栅极控制二极管器件的能力，特别适用于具有平板显示器的读写装置的制造，相变存储器以及基于柔性基板的半导体器件。

8. 发明申请

US20130149824A1 METHOD FOR MANUFACTURING A TUNNELING FIELD EFFECT TRANSISTOR WITH A U-SHAPED CHANNEL 有权
标题翻译：用U形通道制造隧道场效应晶体管的方法
公开(公告)号：US20130149824A1
公开(公告)日：2013-06-13
申请号：US13537956
申请日：2012-06-29
申请人： Pengfei Wang , Xi Lin , Wei Liu , Qingqing Sun , Wei Zhang
发明人： Pengfei Wang , Xi Lin , Wei Liu , Qingqing Sun , Wei Zhang
IPC分类号： H01L21/336
CPC分类号： H01L29/7391 , H01L29/0657 , H01L29/0895 , H01L29/517 , H01L29/66356
摘要： The present invention belongs to the technical field of semiconductor device manufacturing and specifically relates to a method for manufacturing a tunneling field effect transistor with a U-shaped channel. The U-shaped channel can effectively extend the transistor channel length, restrain the generation of leakage current in the transistor, and decrease the chip power consumption. The method for manufacturing a tunneling field effect transistor with a U-shaped channel put forward in the present invention is capable of realizing an extremely narrow U-shaped channel, overcoming the alignment deviation introduced by photoetching, and improving the chip integration degree.
摘要翻译：本发明属于半导体器件制造的技术领域，具体涉及一种具有U形沟道的隧道效应晶体管的制造方法。 U型通道可以有效地延长晶体管沟道长度，抑制晶体管中漏电流的产生，降低芯片功耗。本发明提出的具有U形通道的隧道场效应晶体管的制造方法能够实现非常窄的U形沟道，克服由光刻引入的取向偏差，提高芯片集成度。

9. 发明申请

US20130078761A1 METHOD FOR MANUFACTURING A FLEXIBLE TRANSPARENT 1T1R STORAGE UNIT BASED ON A COMPLETELY LOW-TEMPERATURE PROCESS 审中-公开
标题翻译：基于完全低温过程制造柔性透明1T1R储存单元的方法
公开(公告)号：US20130078761A1
公开(公告)日：2013-03-28
申请号：US13528462
申请日：2012-06-20
申请人： Qingqing Sun , Runchen Fang , Wen Yang , Pengfei Wang , Wei Zhang
发明人： Qingqing Sun , Runchen Fang , Wen Yang , Pengfei Wang , Wei Zhang
IPC分类号： H01L21/336
CPC分类号： H01L45/04 , H01L27/2436 , H01L45/1233 , H01L45/1253 , H01L45/146 , H01L45/147 , H01L45/1616
摘要： The present invention belongs to the technical field of low temperature atomic layer deposition technology, and specifically relates to a method for manufacturing a flexible transparent 1T1R storage unit. In the present invention, a fully transparent 1T1R storage unit is developed on a flexible substrate through a completely low-temperature process, including an oxide layer dielectric, a transparent electrode and a transparent substrate which are deposited together through a low-temperature process, thus realizing a fully transparent device capable of achieving the functions of nontransparent devices. The present invention can be applied to the manufacturing of flexible low-temperature storage units in the future, as well as changing the packaging and existing modes of devices, which will make foldable and bendable portable storage units possible.
摘要翻译：本发明属于低温原子层沉积技术的技术领域，具体涉及柔性透明1T1R存储单元的制造方法。在本发明中，完全透明的1T1R存储单元通过完全低温处理在柔性基板上开发，包括通过低温工艺沉积在一起的氧化物层电介质，透明电极和透明衬底，因此实现能够实现非透明设备功能的完全透明的设备。本发明可以应用于将来的柔性低温存储单元的制造，以及改变装置的现有模式，这使得可折叠和可弯曲的便携式存储装置成为可能。

10. 发明授权

US08860179B2 Inductive loop formed by through silicon via interconnection 有权
标题翻译：通过硅通过互连形成的感应环路
公开(公告)号：US08860179B2
公开(公告)日：2014-10-14
申请号：US13392208
申请日：2011-05-19
申请人： Pengfei Wang , Qingqing Sun , Wei Zhang
发明人： Pengfei Wang , Qingqing Sun , Wei Zhang
IPC分类号： H01L27/00 , H01L23/522 , H01L23/64 , H01L25/065 , H01L23/00 , H01L23/48
CPC分类号： H01L22/14 , H01L21/76879 , H01L23/481 , H01L23/5227 , H01L23/645 , H01L24/13 , H01L24/94 , H01L25/0657 , H01L28/10 , H01L2224/32145 , H01L2225/06527 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/19042 , H01L2924/00
摘要： The present invention discloses an inductive element formed by through silicon via interconnections. The inductive element formed by means of the special through silicon via interconnection by using through silicon via technology features advantages such as high inductance and density. Moreover, the through silicon via interconnection integrated process forming the inductive element is compatible with the ordinary through silicon interconnection integrated process without any other steps, thus making the process simple and steady. The inductive element using the present invention is applicable to the through silicon via package manufacturing of various chips, especially the package manufacturing of power control chips and radio-frequency chips.
摘要翻译：本发明公开了一种通过硅经由互连形成的电感元件。通过使用硅通过技术的特殊硅通孔互连形成的电感元件具有诸如高电感和密度等优点。此外，形成电感元件的贯通硅通孔互连集成工艺与普通的通过硅互连一体化工艺兼容，无任何其他步骤，从而使工艺简单稳定。使用本发明的电感元件可应用于各种芯片的直通硅封装制造，特别是功率控制芯片和射频芯片的封装制造。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式