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1. 发明申请

US20160086898A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20160086898A1
公开(公告)日：2016-03-24
申请号：US14722742
申请日：2015-05-27
申请人： Jin-wook Jang , Se-jin Yoo , Sung-il Cho , Jae-ho Choi
发明人： Jin-wook Jang , Se-jin Yoo , Sung-il Cho , Jae-ho Choi
IPC分类号： H01L23/00 , H01L25/065 , H01L23/48 , H01L23/498 , H01L23/31
CPC分类号： H01L24/09 , H01L21/565 , H01L23/3128 , H01L23/3135 , H01L23/3142 , H01L23/315 , H01L23/481 , H01L23/49811 , H01L23/49838 , H01L23/49861 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L2224/0401 , H01L2224/05022 , H01L2224/05572 , H01L2224/131 , H01L2224/16146 , H01L2224/16227 , H01L2224/16237 , H01L2224/17181 , H01L2224/73204 , H01L2224/8192 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/141 , H01L2924/143 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/18161 , H01L2924/014
摘要： A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.
摘要翻译：半导体封装包括：包括多个焊盘的布线基板; 芯片，其包括通过多个焊料连接到焊盘的多个芯片焊盘; 密封层，其被构造成密封所述芯片和所述焊料，所述至少一个空隙在所述焊料之间; 以及在由所述至少一个空隙暴露的所述焊料的一个侧壁上的焊料挤出防止层。

2. 发明授权

US07402488B2 Method of manufacturing a semiconductor memory device 有权
标题翻译：制造半导体存储器件的方法
公开(公告)号：US07402488B2
公开(公告)日：2008-07-22
申请号：US11159130
申请日：2005-06-23
申请人： Sung-il Cho , Kyeong-koo Chi , Seung-pil Chung , Chang-jin Kang , Cheol-kyu Lee
发明人： Sung-il Cho , Kyeong-koo Chi , Seung-pil Chung , Chang-jin Kang , Cheol-kyu Lee
IPC分类号： H01L21/8242
CPC分类号： H01L21/31116 , H01L21/31122 , H01L21/31138 , H01L27/10852 , H01L28/91
摘要： A method of manufacturing a semiconductor memory device includes forming a carbon-containing layer on a semiconductor substrate, forming an insulating layer pattern on the carbon-containing layer, the insulating layer pattern partially exposing an upper surface of the carbon-containing layer, dry-etching the exposed portion of the carbon-containing layer, to form a carbon-containing layer pattern for defining a storage node hole, forming a bottom electrode inside the storage node hole, forming a dielectric layer on the bottom electrode inside the storage node hole, the dielectric layer covering the bottom electrode, and forming an upper electrode on the dielectric layer inside the storage node hole, the upper electrode covering the dielectric layer.
摘要翻译：半导体存储器件的制造方法包括在半导体衬底上形成含碳层，在含碳层上形成绝缘层图案，将含碳层的上表面部分地露出的绝缘层图案，蚀刻含碳层的暴露部分，形成用于限定存储节点孔的含碳层图案，在存储节点孔内部形成底部电极，在存储节点孔内部的底部电极上形成电介质层，所述介电层覆盖所述底部电极，并且在所述存储节点孔内部的所述电介质层上形成上部电极，所述上部电极覆盖所述电介质层。

3. 发明授权

US06198468B1 Apparatus for performing various on-screen display functions and methods for each function 失效
标题翻译：用于执行各种屏幕显示功能的装置和用于每个功能的方法
公开(公告)号：US06198468B1
公开(公告)日：2001-03-06
申请号：US08969101
申请日：1997-11-13
申请人： Sung-il Cho
发明人： Sung-il Cho
IPC分类号： G06F104
CPC分类号： H04N5/44504 , H04N9/64 , H04N21/431 , Y10S248/917
摘要： An apparatus having various on-screen display (OSD) functions and methods for each function are provided. The apparatus includes an on-screen display device for receiving serial data having a RAM write address, a ROM address, and the on-screen display functions. The apparatus synthesizes a character signal corresponding to serial data with a background color signal or an external composite video signal in response to an internal or external composite synchronous signal and provides the result to a monitor. The apparatus also includes a synchronous signal generating device for generating internal horizontal and vertical synchronous signals upon receiving a main clock signal, synthesizing means for synthesizing an internal equalization pulse with the internal horizontal and vertical synchronous signals, and means for determining the internal composite synchronous signal or the external composite synchronous signal extracted from the composite video signal. A control device is also part of the OSD apparatus. The control device outputs user serial data to the on-screen display device, generates the main clock signal from a system clock, and controls the on-screen display device and the synchronous signal generating device.
摘要翻译：提供具有各种屏幕显示（OSD）功能和各种功能的方法的设备。该装置包括用于接收具有RAM写地址，ROM地址和屏幕显示功能的串行数据的屏幕显示装置。该装置响应于内部或外部复合同步信号，合成具有背景颜色信号或外部复合视频信号的与串行数据对应的字符信号，并将结果提供给监视器。该装置还包括同步信号发生装置，用于在接收主时钟信号时产生内部水平和垂直同步信号，合成装置用于将内部均衡脉冲与内部水平和垂直同步信号合成，以及用于确定内部复合同步信号的装置或从复合视频信号中提取的外部复合同步信号。控制装置也是OSD装置的一部分。控制装置将用户串行数据输出到屏幕显示装置，从系统时钟产生主时钟信号，并控制屏幕显示装置和同步信号产生装置。

4. 发明授权

US5398270A Data coincidence detecting circuit 失效
标题翻译：数据一致检测电路
公开(公告)号：US5398270A
公开(公告)日：1995-03-14
申请号：US29597
申请日：1993-03-11
申请人： Sung-il Cho , Ki-ho Shin
发明人： Sung-il Cho , Ki-ho Shin
IPC分类号： G06F7/04 , G06F7/02 , G06F11/00 , H03K3/037 , H03K5/19 , H03K19/21 , H03K23/66 , H03L7/00 , H03K21/08
CPC分类号： G06F7/02 , H03K19/21 , H03K23/66 , H03K3/037
摘要： A data coincidence detecting circuit including a register for receiving n-bit data, a counter for counting up until 2.sup.n to compare the n-bit data with it, a comparator for comparing the outputs of the register and the outputs of the counter, respectively to generate a coincidence detecting signal, a mask portion connected to the output of the comparator for masking the period from a time point when the n-bit data is input to a time point when the input of data ends, and a logic circuit for logically adding the output of the mask portion and the output of the comparator to output the result.
摘要翻译：一种数据符合检测电路，包括用于接收n位数据的寄存器，用于向上计数直到2n以比较n位数据的计数器，比较器，用于将寄存器的输出和计数器的输出分别对应于产生符合检测信号，连接到比较器的输出的掩模部分，用于掩蔽从输入n位数据的时间点到数据输入结束的时间点的周期;以及逻辑电路，用于逻辑地加法屏蔽部分的输出和比较器的输出以输出结果。

5. 发明申请

US20080146002A1 Method of manufacturing semiconductor device having buried gate 有权
标题翻译：制造具有掩埋栅极的半导体器件的方法
公开(公告)号：US20080146002A1
公开(公告)日：2008-06-19
申请号：US12000496
申请日：2007-12-13
申请人： Eun-young Kang , Jun Seo , Jae-seung Hwang , Sung-il Cho , Yong-hyun Kwon
发明人： Eun-young Kang , Jun Seo , Jae-seung Hwang , Sung-il Cho , Yong-hyun Kwon
IPC分类号： H01L21/76
CPC分类号： H01L21/823456 , H01L21/823481 , H01L27/105 , H01L27/1052
摘要： A method of manufacturing a semiconductor device having buried gates may include forming a stacked structure of sequentially stacked first mask patterns and second mask patterns with equal widths to expose active regions and isolation regions of a semiconductor substrate. After forming reduced first mask patterns by decreasing the width only of the first mask patterns, trenches may be formed in the active regions and the isolation regions by etching the exposed portions of the semiconductor substrate using the second mask patterns as an etch mask. Then, gate insulating films may be formed on inner walls of the trenches in the active regions, and a conductive material may be buried into the trenches in the active regions and the isolation regions to form gates.
摘要翻译：制造具有掩埋栅极的半导体器件的方法可以包括形成具有相等宽度的顺序层叠的第一掩模图案和第二掩模图案的叠层结构，以暴露半导体衬底的有源区和隔离区。在通过仅减小第一掩模图案的宽度来形成减小的第一掩模图案之后，可以通过使用第二掩模图案作为蚀刻掩模蚀刻半导体衬底的暴露部分来在有源区域和隔离区域中形成沟槽。然后，栅极绝缘膜可以形成在有源区域中的沟槽的内壁上，并且导电材料可以被埋入有源区域和隔离区域中的沟槽中，以形成栅极。

6. 发明申请

US20050287738A1 Method of manufacturing a semiconductor memory device 有权
标题翻译：制造半导体存储器件的方法
公开(公告)号：US20050287738A1
公开(公告)日：2005-12-29
申请号：US11159130
申请日：2005-06-23
申请人： Sung-il Cho , Kyeong-koo Chi , Seung-pil Chung , Chang-jin Kang , Cheol-kyu Lee
发明人： Sung-il Cho , Kyeong-koo Chi , Seung-pil Chung , Chang-jin Kang , Cheol-kyu Lee
IPC分类号： H01L21/8242 , H01L21/02 , H01L21/311
CPC分类号： H01L21/31116 , H01L21/31122 , H01L21/31138 , H01L27/10852 , H01L28/91
摘要： A method of manufacturing a semiconductor memory device includes forming a carbon-containing layer on a semiconductor substrate, forming an insulating layer pattern on the carbon-containing layer, the insulating layer pattern partially exposing an upper surface of the carbon-containing layer, dry-etching the exposed portion of the carbon-containing layer, to form a carbon-containing layer pattern for defining a storage node hole, forming a bottom electrode inside the storage node hole, forming a dielectric layer on the bottom electrode inside the storage node hole, the dielectric layer covering the bottom electrode, and forming an upper electrode on the dielectric layer inside the storage node hole, the upper electrode covering the dielectric layer.
摘要翻译：半导体存储器件的制造方法包括在半导体衬底上形成含碳层，在含碳层上形成绝缘层图案，将含碳层的上表面部分地露出的绝缘层图案，蚀刻含碳层的暴露部分，形成用于限定存储节点孔的含碳层图案，在存储节点孔内部形成底部电极，在存储节点孔内部的底部电极上形成电介质层，所述介电层覆盖所述底部电极，并且在所述存储节点孔内部的所述电介质层上形成上部电极，所述上部电极覆盖所述电介质层。

7. 发明授权

US08466074B2 Method for processing a substrate using a laser beam 失效
标题翻译：使用激光束处理基板的方法
公开(公告)号：US08466074B2
公开(公告)日：2013-06-18
申请号：US13083043
申请日：2011-04-08
申请人： Sung-il Cho , Ho-tae Jin , Heui-seog Kim , Seon-ju Oh
发明人： Sung-il Cho , Ho-tae Jin , Heui-seog Kim , Seon-ju Oh
IPC分类号： H01L21/268
CPC分类号： H01L21/268 , H01L21/2007
摘要： A method for processing a substrate includes generating a first laser beam, splitting the first laser beam into a plurality of second laser beams, focusing the split second laser beams on a plane in the substrate parallel to a main surface of the substrate, and performing surface separation of the substrate along the plane.
摘要翻译：一种用于处理衬底的方法包括：生成第一激光束，将第一激光束分成多个第二激光束，将分裂的第二激光束聚焦在平行于衬底的主表面的衬底的平面上，并且执行表面沿着平面分离衬底。

8. 发明申请

US20110256736A1 METHOD FOR PROCESSING A SUBSTRATE USING A LASER BEAM 失效
标题翻译：使用激光束处理基板的方法
公开(公告)号：US20110256736A1
公开(公告)日：2011-10-20
申请号：US13083043
申请日：2011-04-08
申请人： Sung-il Cho , Ho-tae Jin , Heui-seog Kim , Seon-ju Oh
发明人： Sung-il Cho , Ho-tae Jin , Heui-seog Kim , Seon-ju Oh
IPC分类号： H01L21/268
CPC分类号： H01L21/268 , H01L21/2007
摘要： A method for processing a substrate includes generating a first laser beam, splitting the first laser beam into a plurality of second laser beams, focusing the split second laser beams on a plane in the substrate parallel to a main surface of the substrate, and performing surface separation of the substrate along the plane.
摘要翻译：一种用于处理衬底的方法包括：生成第一激光束，将第一激光束分成多个第二激光束，将分裂的第二激光束聚焦在平行于衬底的主表面的衬底的平面上，并且执行表面沿着平面分离衬底。

9. 发明授权

US07728375B2 Semiconductor memory device and method of forming the same 有权
标题翻译：半导体存储器件及其形成方法
公开(公告)号：US07728375B2
公开(公告)日：2010-06-01
申请号：US12219358
申请日：2008-07-21
申请人： Kyoung-Sub Shin , Cheol-Kyu Lee , Sung-il Cho , Young-Kyu Cho
发明人： Kyoung-Sub Shin , Cheol-Kyu Lee , Sung-il Cho , Young-Kyu Cho
IPC分类号： H01L27/108
CPC分类号： H01L28/91 , H01L27/10855 , H01L27/10888
摘要： Example embodiments relate to a semiconductor memory device and a method of forming the semiconductor memory device. The semiconductor memory device may include a first interlayer insulating layer on a semiconductor substrate. A bit line may be arranged in a first direction on the first interlayer insulating layer. A bit line contact pad may be disposed in the first interlayer insulating layer and electrically connected to the bit line. A storage contact pad may be disposed in the first interlayer insulating layer. A top surface of the bit line contact pad may be lower than a top surface of the storage contact pad.
摘要翻译：示例性实施例涉及半导体存储器件和形成半导体存储器件的方法。半导体存储器件可以包括半导体衬底上的第一层间绝缘层。位线可以在第一层间绝缘层上沿第一方向布置。位线接触焊盘可以设置在第一层间绝缘层中并电连接到位线。存储接触焊盘可以设置在第一层间绝缘层中。位线接触焊盘的顶表面可以低于存储触点焊盘的顶表面。

10. 发明授权

US07749902B2 Methods of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07749902B2
公开(公告)日：2010-07-06
申请号：US11825272
申请日：2007-06-05
申请人： Hyun-chul Kim , Sung-il Cho , Jae-seung Hwang , Jun Sen , Yong-hyun Kwon
发明人： Hyun-chul Kim , Sung-il Cho , Jae-seung Hwang , Jun Sen , Yong-hyun Kwon
IPC分类号： H01L21/44 , H01L21/302 , H01L21/461 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： H01L21/31144 , H01L21/0337 , H01L21/0338 , Y10S438/942 , Y10S438/946 , Y10S438/947
摘要： Provided is a method of manufacturing a semiconductor device using double patterning. The method includes: forming a first material layer pattern having recesses in a first direction on an object layer and a second material layer pattern formed on the first material layer pattern; selectively etching the second material layer pattern and the first material layer pattern in a direction perpendicular to the first direction to form an etching mask; and etching the object layer to form minute patterns.
摘要翻译：提供了使用双重图案化制造半导体器件的方法。该方法包括：在物体层上形成具有沿第一方向的凹陷的第一材料层图案和形成在第一材料层图案上的第二材料层图案; 在与第一方向垂直的方向上选择性蚀刻第二材料层图案和第一材料层图案以形成蚀刻掩模; 并蚀刻目标层以形成微小的图案。

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