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1. 发明授权

US08466074B2 Method for processing a substrate using a laser beam 失效
标题翻译：使用激光束处理基板的方法
公开(公告)号：US08466074B2
公开(公告)日：2013-06-18
申请号：US13083043
申请日：2011-04-08
申请人： Sung-il Cho , Ho-tae Jin , Heui-seog Kim , Seon-ju Oh
发明人： Sung-il Cho , Ho-tae Jin , Heui-seog Kim , Seon-ju Oh
IPC分类号： H01L21/268
CPC分类号： H01L21/268 , H01L21/2007
摘要： A method for processing a substrate includes generating a first laser beam, splitting the first laser beam into a plurality of second laser beams, focusing the split second laser beams on a plane in the substrate parallel to a main surface of the substrate, and performing surface separation of the substrate along the plane.
摘要翻译：一种用于处理衬底的方法包括：生成第一激光束，将第一激光束分成多个第二激光束，将分裂的第二激光束聚焦在平行于衬底的主表面的衬底的平面上，并且执行表面沿着平面分离衬底。

2. 发明申请

US20110256736A1 METHOD FOR PROCESSING A SUBSTRATE USING A LASER BEAM 失效
标题翻译：使用激光束处理基板的方法
公开(公告)号：US20110256736A1
公开(公告)日：2011-10-20
申请号：US13083043
申请日：2011-04-08
申请人： Sung-il Cho , Ho-tae Jin , Heui-seog Kim , Seon-ju Oh
发明人： Sung-il Cho , Ho-tae Jin , Heui-seog Kim , Seon-ju Oh
IPC分类号： H01L21/268
CPC分类号： H01L21/268 , H01L21/2007
摘要： A method for processing a substrate includes generating a first laser beam, splitting the first laser beam into a plurality of second laser beams, focusing the split second laser beams on a plane in the substrate parallel to a main surface of the substrate, and performing surface separation of the substrate along the plane.
摘要翻译：一种用于处理衬底的方法包括：生成第一激光束，将第一激光束分成多个第二激光束，将分裂的第二激光束聚焦在平行于衬底的主表面的衬底的平面上，并且执行表面沿着平面分离衬底。

3. 发明申请

US20070013404A1 Apparatus, customer tray, and method for testing semiconductor packages 审中-公开
标题翻译：仪器，客户托盘和半导体封装测试方法
公开(公告)号：US20070013404A1
公开(公告)日：2007-01-18
申请号：US11488087
申请日：2006-07-18
申请人： Seok-young Yoon , Heui-seog Kim , Seon-ju Oh , Hyeck-jin Jeong
发明人： Seok-young Yoon , Heui-seog Kim , Seon-ju Oh , Hyeck-jin Jeong
IPC分类号： G01R31/26
CPC分类号： G01R31/2896 , G01R31/2893
摘要： Provided is electrical test equipment and method for testing semiconductor packages in an in-tray state. The equipment may include a loading site configured to receive a customer tray having a plurality of semiconductor packages therein, a test site configured to align the customer tray, and also configured to test all the plurality of semiconductor packages in the customer tray in-situ, a sorting site configured to sort the tested plurality of semiconductor packages in the customer tray, and an unloading site configured to unload the sorted plurality of semiconductor packages in the customer tray. A method of testing a plurality of semiconductor may include loading a plurality of semiconductor packages into a customer tray, connecting the plurality of semiconductor packages in the customer tray to a test board by pressing the plurality of semiconductor packages onto the test board, testing all the semiconductor packages in the customer tray in-situ, removing defective semiconductor packages from the customer tray, and unloading non-defective semiconductor packages from the customer tray.
摘要翻译：提供了用于测试托盘内的半导体封装的电气测试设备和方法。设备可以包括配置成接收其中具有多个半导体封装的顾客托盘的装载位置，被配置为对准顾客托盘的测试位置，并且还被配置为在现场测试客户托盘中的所有多个半导体封装，分类站点，被配置为对所述客户托盘中的所测试的多个半导体封装进行分类;以及卸载站点，被配置为卸载所述分类的多个半导体封装在所述客户托盘中。测试多个半导体的方法可以包括将多个半导体封装装载到客户托盘中，通过将多个半导体封装件压到测试板上将所述客户托盘中的多个半导体封装连接到测试板，测试所有客户托盘中的半导体封装件，从客户托盘去除有缺陷的半导体封装，以及从客户托盘卸载无缺陷的半导体封装。

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