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    • 7. 发明授权
    • Metal oxide semiconductor (MOS) transistors having a recessed gate electrode
    • 具有凹陷栅电极的金属氧化物半导体(MOS)晶体管
    • US08487352B2
    • 2013-07-16
    • US13236389
    • 2011-09-19
    • Yong-Sung KimTae-Young Chung
    • Yong-Sung KimTae-Young Chung
    • H01L27/148
    • H01L29/7834H01L29/51H01L29/66621
    • A metal oxide semiconductor (MOS) includes an isolation layer disposed in a semiconductor substrate to define an active region. A source region and a drain region are disposed on both sides of the active region such that a first direction is defined from the source region to the drain region. A channel recess is disposed in the active region between the source and drain regions. The channel recess has a convex surface when viewed from a cross-sectional view taken along a second direction orthogonal to the first direction. A gate electrode fills the channel recess and crosses the active region in the second direction. A gate insulating layer is interposed between the gate electrode and the active region.
    • 金属氧化物半导体(MOS)包括设置在半导体衬底中以限定有源区的隔离层。 源极区域和漏极区域设置在有源区域的两侧,使得从源极区域到漏极区域限定第一方向。 通道凹槽设置在源区和漏区之间的有源区中。 当从沿着与第一方向正交的第二方向截取的横截面视图观察时,通道凹部具有凸形表面。 栅电极填充通道凹槽并沿第二方向跨过有源区。 栅极绝缘层插入在栅电极和有源区之间。
    • 9. 发明授权
    • Method of fabricating gate of fin type transistor
    • 鳍型晶体管栅极的制造方法
    • US07413943B2
    • 2008-08-19
    • US11460905
    • 2006-07-28
    • Yong-Sung KimTae-Young ChungSoo-Ho Shin
    • Yong-Sung KimTae-Young ChungSoo-Ho Shin
    • H01L21/336H01L31/062
    • H01L21/823437H01L21/823412H01L29/66795H01L29/7851
    • A method of fabricating a gate of a fin type transistor includes forming hard masks to define active regions of a substrate. A shallow trench isolation method is performed to form a first device separation layer, and then an etch-back process is performed such that the active regions protrude. Sidewall protection layers are formed on sidewalls of the active region, and a second device separation layer is formed thereon, thereby obtaining a device isolation region. The sidewall protection layers include an insulation material with an etch selectivity with respect to an insulation material composing the device isolation region. The device isolation region is selectively etched to form recesses for a fin type active region. Dry etching and wet etching are performed on the silicon nitride to remove the hard masks and the sidewall protection layers, respectively. Gates are formed to fill the recesses.
    • 制造鳍式晶体管的栅极的方法包括形成硬掩模以限定衬底的有源区。 执行浅沟槽隔离方法以形成第一器件分离层,然后执行回蚀处理,使得有源区域突出。 侧壁保护层形成在有源区的侧壁上,并且在其上形成第二器件分离层,从而获得器件隔离区。 侧壁保护层包括相对于构成器件隔离区域的绝缘材料具有蚀刻选择性的绝缘材料。 选择性地蚀刻器件隔离区以形成翅片型有源区的凹槽。 对氮化硅进行干蚀刻和湿蚀刻以分别去除硬掩模和侧壁保护层。 形成门以填充凹部。
    • 10. 发明授权
    • Metal oxide semiconductor (MOS) transistors having a recessed gate electrode
    • 具有凹陷栅电极的金属氧化物半导体(MOS)晶体管
    • US08039876B2
    • 2011-10-18
    • US12683089
    • 2010-01-06
    • Yong-Sung KimTae-Young Chung
    • Yong-Sung KimTae-Young Chung
    • H01L27/148
    • H01L29/7834H01L29/51H01L29/66621
    • A metal oxide semiconductor (MOS) includes an isolation layer disposed in a semiconductor substrate to define an active region. A source region and a drain region are disposed on both sides of the active region such that a first direction is defined from the source region to the drain region. A channel recess is disposed in the active region between the source and drain regions. The channel recess has a convex surface when viewed from a cross-sectional view taken along a second direction orthogonal to the first direction. A gate electrode fills the channel recess and crosses the active region in the second direction. A gate insulating layer is interposed between the gate electrode and the active region.
    • 金属氧化物半导体(MOS)包括设置在半导体衬底中以限定有源区的隔离层。 源极区域和漏极区域设置在有源区域的两侧,使得从源极区域到漏极区域限定第一方向。 通道凹槽设置在源区和漏区之间的有源区中。 当从沿着与第一方向正交的第二方向截取的横截面视图观察时,通道凹部具有凸形表面。 栅电极填充通道凹槽并沿第二方向跨过有源区。 栅极绝缘层插入在栅电极和有源区之间。