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    • 3. 发明授权
    • Method and structures for fabricating MEMS devices on compliant layers
    • 在柔性层上制造MEMS器件的方法和结构
    • US08367451B2
    • 2013-02-05
    • US12178563
    • 2008-07-23
    • Jin Qiu
    • Jin Qiu
    • H01L21/00
    • B81C1/00095B81B3/0072B81C2203/0728B81C2203/0771
    • Methods and structures for fabricating MEMS devices on compliant layers are provided. In particular, disclosed are methods and structures that can include the use of a sacrificial layer composed of a material having material properties relative to one or more other layers. These methods and structures can reduce final device shape sensitivity to process parameters, deposition temperature differences, specific material, time, and/or geometry. Further, such methods and structures can improve the final as-built shape of released devices, reduce variability in the as-built shape, eliminate decoupling of the deposited layers from the substrate, and reduce variability across a product array, die, or wafer.
    • 提供了在兼容层上制造MEMS器件的方法和结构。 特别地,公开了可以包括使用由具有相对于一个或多个其它层的材料性质的材料构成的牺牲层的方法和结构。 这些方法和结构可以减少对工艺参数,沉积温度差,特定材料,时间和/或几何形状的最终器件形状敏感性。 此外,这样的方法和结构可以改善释放装置的最终构造形状,减少所构造的形状的可变性,消除沉积的层与衬底的去耦合,并且减少跨越产品阵列,管芯或晶片的可变性。
    • 6. 发明申请
    • METHOD AND STRUCTURES FOR FABRICATING MEMS DEVICES ON COMPLIANT LAYERS
    • 用于在合适层上制造MEMS器件的方法和结构
    • US20090134513A1
    • 2009-05-28
    • US12178563
    • 2008-07-23
    • Jin Qiu
    • Jin Qiu
    • H01L23/48H01L21/46
    • B81C1/00095B81B3/0072B81C2203/0728B81C2203/0771
    • Methods and structures for fabricating MEMS devices on compliant layers are provided. In particular, disclosed are methods and structures that can include the use of a sacrificial layer composed of a material having material properties relative to one or more other layers. These methods and structures can reduce final device shape sensitivity to process parameters, deposition temperature differences, specific material, time, and/or geometry. Further, such methods and structures can improve the final as-built shape of released devices, reduce variability in the as-built shape, eliminate decoupling of the deposited layers from the substrate, and reduce variability across a product array, die, or wafer.
    • 提供了在兼容层上制造MEMS器件的方法和结构。 特别地,公开了可以包括使用由具有相对于一个或多个其它层的材料性质的材料构成的牺牲层的方法和结构。 这些方法和结构可以减少对工艺参数,沉积温度差,特定材料,时间和/或几何形状的最终器件形状敏感性。 此外,这样的方法和结构可以改善释放装置的最终构造形状,减少所构造的形状的可变性,消除沉积的层与衬底的去耦合,并且减少跨越产品阵列,管芯或晶片的可变性。