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    • 5. 发明申请
    • Allowance Method for Point to Ground Resistance of Tray
    • 托盘点对地电阻的补偿方法
    • US20070272589A1
    • 2007-11-29
    • US10550056
    • 2004-03-22
    • Kwang SuhJong Kim
    • Kwang SuhJong Kim
    • H01B1/24
    • H01B1/22H01B1/124H01B1/20H01B1/24H01L21/67336
    • Disclosed is a method of providing a desired range of point-to-ground resistance to trays, by making a conductive pathway between both surfaces of the tray after forming and cutting processes. A desired range of point-to-ground resistance of the tray can be achieved by partially or entirely coating a conductive solution composed of a conductive polymersuch as polyaniline, polypyrrole, polythiophene and derivatives such as poly 3,4-ethylenedioxythiophene and mixtures thereof, metal powders and flakes composed of iron, copper, aluminum and other metals, metal oxides such as doped tin oxide and indium oxide, onto cut surfaces of the tray, by attaching a conductive or semi-conductive tape to top and bottom surfaces of the tray so as to cross them, or by using a metal clip. Thereby, a desired range of point-to-ground resistance can be provided to the tray by electrically connecting the top and bottom surfaces of the tray.
    • 公开了一种通过在成形和切割工艺之后在托盘的两个表面之间形成导电通路来向托盘提供所需范围的点对地电阻的方法。 托盘的点对地电阻的期望范围可以通过部分或全部涂覆由导电性聚合物构成的导电溶液来实现,例如聚苯胺,聚吡咯,聚噻吩和衍生物如聚3,4-亚乙基二氧噻吩及其混合物,金属 通过将导电或半导电胶带贴在托盘的顶面和底面上,将由铁,铜,铝和其它金属组成的粉末和薄片,诸如掺杂氧化锡和氧化铟的金属氧化物加到托盘的切割表面上 穿过他们,或通过使用金属夹子。 因此,可以通过电连接托盘的顶表面和底表面来向托盘提供期望的点对地电阻范围。