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1. 发明申请

US20070133352A1 System and method for position awareness for minimizing power consumption in sensor network environment 失效
标题翻译：用于定位感知的系统和方法，用于最小化传感器网络环境中的功耗
公开(公告)号：US20070133352A1
公开(公告)日：2007-06-14
申请号：US11633456
申请日：2006-12-05
申请人： Jin Kim , Seung Park , II Park , Kwang Lee , Doo Eom , Won Lee , Woo Lee , Tae Kim
发明人： Jin Kim , Seung Park , II Park , Kwang Lee , Doo Eom , Won Lee , Woo Lee , Tae Kim
IPC分类号： G01S3/80
CPC分类号： G01S5/18 , G01S5/0289
摘要： Provided are a system and method for position awareness that can be used indoors in a large-scale environment and can minimize generation of radio frequency (RF) and ultrasonic waves in a wireless sensor network including low-priced sensor nodes capable of precise position measurement, thus improving energy efficiency by reducing unnecessary power consumption. The method includes the steps of: (a) calculating initial position coordinates using beacon information received from adjacent beacons through a broadcast beacon solicitation signal, sending a synchronization signal to the beacons, and synchronizing the beacons; (b) receiving ultrasonic waves generated from the adjacent beacons activated by a broadcast start message, and calculating position coordinates; and (c) when the calculated position coordinates correspond to a predetermined hand-off threshold position, transmitting a hand-off process message to a newly activated beacon, and executing a hand-off process routine.
摘要翻译：提供一种用于位置感知的系统和方法，其可以在大规模环境中室内使用，并且可以在包括能够进行精确位置测量的低价传感器节点的无线传感器网络中最小化射频（RF）和超声波的产生，从而通过减少不必要的功率消耗来提高能量效率。该方法包括以下步骤：（a）使用通过广播信标请求信号从相邻信标接收到的信标信息来计算初始位置坐标，向信标发送同步信号，并同步信标; （b）接收由广播开始消息激活的相邻信标产生的超声波，并计算位置坐标; 以及（c）当计算出的位置坐标对应于预定的切换阈值位置时，将切换处理消息发送到新激活的信标，并且执行切换处理程序。

2. 发明申请

US20060192712A1 Antenna module and electronic device using the same 失效
标题翻译：天线模块和使用其的电子设备
公开(公告)号：US20060192712A1
公开(公告)日：2006-08-31
申请号：US11311255
申请日：2005-12-20
申请人： II Park , Chul Kim , Gi Do , Duk Lee , Jeong Seo , Tae Kim , Sae Oh , Hyun Kim
发明人： II Park , Chul Kim , Gi Do , Duk Lee , Jeong Seo , Tae Kim , Sae Oh , Hyun Kim
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0407 , H01Q1/242 , H01Q1/243 , H01Q1/38
摘要： The present invention relates to an antenna module which can minimize the occupying space in an electronic device, enhancing degrees of freedom to increase efficiency in space utilization, thereby accommodating miniaturization and multi-functionality of the electronic device, and an electronic device having the same. The antenna module includes a flexible substrate, an antenna element having a feeder part, a first fixing part, and a radiation part. The antenna module further includes a feeder line connected to the feeder part having a feeder pad, a first fixing pad connected to the first fixing part, and a pad coupling element. In the invention, signals are processed via interaction between the resonance of the current running through the feeder line to the radiation part and the resonance of the current coming into the pad coupling element.
摘要翻译：本发明涉及一种天线模块，其能够最小化电子设备中的占用空间，提高空间利用效率的自由度，从而适应电子设备的小型化和多功能性，以及具有该天线模块的电子设备。天线模块包括柔性基板，具有馈电部分的天线元件，第一固定部分和辐射部分。所述天线模块还包括连接到所述馈电部分的馈电线，所述馈线部分具有馈电焊盘，连接到所述第一固定部分的第一固定焊盘以及焊盘联接元件。在本发明中，信号通过在通过馈线的电流的谐振与辐射部分之间的相互作用以及进入焊盘耦合元件的电流的谐振之间的相互作用而被处理。

3. 发明申请

US20060144618A1 Fill plated structure of inner via hole and manufacturing method thereof 审中-公开
标题翻译：内通孔的镀层结构及其制造方法
公开(公告)号：US20060144618A1
公开(公告)日：2006-07-06
申请号：US11137357
申请日：2005-05-24
申请人： Chang Song , Tae Kim , Kyung Kim , Woo Lee , Jee Mok
发明人： Chang Song , Tae Kim , Kyung Kim , Woo Lee , Jee Mok
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H05K3/423 , H01L2924/0002 , H05K3/427 , H05K2201/09563 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A fill plated structure of an inner via hole, which includes an electroless plated layer formed on a copper clad laminate having an inner via hole formed therethrough, a first copper electroplated layer formed on the electroless plated layer on the copper clad laminate and formed on an inner wall of the via hole to form an belly portion having a belly shape, and a second copper electroplated layer formed on the first copper electroplated layer of a surface of the copper clad laminate and formed on upper and lower portions of the first copper electroplated layer of the inner wall of the via hole to fill the via hole; and a method of manufacturing the same.
摘要翻译：内部通孔的填充电镀结构，其包括形成在其上形成有内通孔的覆铜层压板上的化学镀层，形成在覆铜层压板上的化学镀层上的第一铜电镀层，通孔的内壁形成具有腹部形状的腹部部分，以及形成在覆铜层压板的表面的第一铜电镀层上并形成在第一铜电镀层的上部和下部上的第二铜电镀层通孔的内壁填充通孔; 及其制造方法。

4. 发明申请

US20050255662A1 Semiconductor device with load resistor and fabrication method 失效
标题翻译：具有负载电阻的半导体器件及制造方法
公开(公告)号：US20050255662A1
公开(公告)日：2005-11-17
申请号：US11169894
申请日：2005-06-30
申请人： Won Lee , Joon-Mo Kwon , Tae Kim , Jin-Kee Choi , Dong-Gun Park , Hyeong-Chan Ko , Hong-Joon Moon
发明人： Won Lee , Joon-Mo Kwon , Tae Kim , Jin-Kee Choi , Dong-Gun Park , Hyeong-Chan Ko , Hong-Joon Moon
IPC分类号： H01L23/52 , H01L21/02 , H01L21/3205 , H01L21/768 , H01L21/822 , H01L21/8242 , H01L27/04 , H01L27/08 , H01L27/108 , H02H3/00 , H01L21/20 , H01L21/44 , H02H7/00
CPC分类号： H01L28/20 , H01L27/0802
摘要： A semiconductor device with a load resistor is manufactured such that a contact is formed at both ends of the load resistor, and at least one contact is formed between the contacts, in order to prevent impurities from being generated within each contact while the contacts are being generated by etching an insulation layer phenomena of electric charge build up from occurring when an etching process fabricates an insulation layer to generate the contact in a long load resistor located under the insulation layer and insulated electrically and physically.
摘要翻译：制造具有负载电阻器的半导体器件，使得在负载电阻器的两端形成接触，并且在触点之间形成至少一个触点，以便防止在触点期间在每个触点内产生杂质通过蚀刻绝缘层产生的电荷产生，当蚀刻工艺制造绝缘层以在位于绝缘层下方的长负载电阻器中产生接触并在电和物理上绝缘时产生电荷现象。

5. 发明申请

US20060032666A1 Printed circuit board including embedded capacitors and method of manufacturing the same 有权
标题翻译：印刷电路板包括嵌入式电容器及其制造方法
公开(公告)号：US20060032666A1
公开(公告)日：2006-02-16
申请号：US11031508
申请日：2005-01-06
申请人： Jin Kim , Min Kim , Jun Oh , Tae Kim
发明人： Jin Kim , Min Kim , Jun Oh , Tae Kim
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K1/0373 , H05K3/4602 , H05K3/4623 , H05K3/4688 , H05K2201/0209 , H05K2201/09536 , H05K2201/09672 , Y10T29/435 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.
摘要翻译：本发明公开了一种印刷电路板，其包括嵌入式电容器，其由聚合物冷凝器层压体构成，聚合物冷凝层压板包括多个聚合物聚合物层，每个聚合物聚合物层具有形成在聚合物片上的聚合物片和导体图案，以及用于层间连接的通孔以及形成在聚合物冷凝层叠体的任一表面或两个表面上的电路层，并且具有电路图案和用于通过其进行层间连接的通孔。本发明的印刷电路板具有比常规的嵌入式电容器印刷电路板更高的每单位面积的电容密度，由此具有各种电容值的电容器，例如具有高电容的多层陶瓷电容器可以嵌入印刷电路板中，而不是安装在其上。此外，提供了一种制造包括嵌入式电容器的印刷电路板的方法。

6. 发明申请

US20070125574A1 PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITORS USING HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：使用混合材料的嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US20070125574A1
公开(公告)日：2007-06-07
申请号：US11672245
申请日：2007-02-07
申请人： Tae Kim , Jun Oh , Jin Kim
发明人： Tae Kim , Jun Oh , Jin Kim
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K3/4611 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0141 , H05K2201/0209 , H05K2201/09309 , H05K2201/09509 , H05K2201/09518 , H05K2201/09672 , Y10T29/43 , Y10T29/435 , Y10T29/4913
摘要： The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
摘要翻译：本发明涉及具有使用混合材料的嵌入式电容器的印刷电路板及其制造方法。本发明提供了一种具有嵌入式电容器的印刷电路板，以及使用包括液晶聚合物和陶瓷粉末的混合电介质层的材料，以及制造这种印刷电路板的方法。

7. 发明申请

US20060194356A1 Method for manufacturing multi-wavelength semiconductor laser device 审中-公开
标题翻译：制造多波长半导体激光器件的方法
公开(公告)号：US20060194356A1
公开(公告)日：2006-08-31
申请号：US11238319
申请日：2005-09-29
申请人： Keun Song , Su Lee , Jin Kim , Tae Kim , Chang Kim , Sang Han
发明人： Keun Song , Su Lee , Jin Kim , Tae Kim , Chang Kim , Sang Han
IPC分类号： H01L21/00
CPC分类号： H01S5/4031 , H01S5/209 , H01S5/32316 , H01S5/32325 , H01S5/4087
摘要： The present invention provides a method for forming a multi-wavelength semiconductor laser device. The method comprises sequentially forming an AlGaAs-based epitaxial layer for a first semiconductor laser diode and an etching stop layer composed of AlxGayIn(1-x-y)P (0≦x≦1, 0≦y≦1) on a substrate and sequentially growing an n-type GaAs flattening buffer layer and an AlGaInP-based epitaxial layer for a second semiconductor laser diode on the substrate, after selectively removing the AlGaAs-based epitaxial layer and the etching stop layer.
摘要翻译：本发明提供一种形成多波长半导体激光器件的方法。该方法包括顺序形成用于第一半导体激光二极管的AlGaAs基外延层和由AlxGayIn（1-xy）P（0≤x≤1,0<= y <= 1）组成的蚀刻停止层）在选择性地除去基于AlGaAs的外延层和蚀刻停止层之后，在衬底上顺序生长n型GaAs平坦化缓冲层和用于第二半导体激光二极管的AlGaInP基外延层。

8. 发明申请

US20070240303A1 PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITORS AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：印刷电路板，包括嵌入式电容器及其制造方法
公开(公告)号：US20070240303A1
公开(公告)日：2007-10-18
申请号：US11670463
申请日：2007-02-02
申请人： Jin Kim , Min Kim , Jun Oh , Tae Kim
发明人： Jin Kim , Min Kim , Jun Oh , Tae Kim
IPC分类号： H01R43/00 , H05K1/00
CPC分类号： H05K1/162 , H05K1/0373 , H05K3/4602 , H05K3/4623 , H05K3/4688 , H05K2201/0209 , H05K2201/09536 , H05K2201/09672 , Y10T29/435 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.
摘要翻译：本发明公开了一种印刷电路板，其包括嵌入式电容器，其由聚合物冷凝器层压体构成，聚合物冷凝层压板包括多个聚合物聚合物层，每个聚合物聚合物层具有形成在聚合物片上的聚合物片和导体图案，以及用于层间连接的通孔以及形成在聚合物冷凝层叠体的任一表面或两个表面上的电路层，并且具有电路图案和用于通过其进行层间连接的通孔。本发明的印刷电路板比传统的嵌入式电容器印刷电路板具有更高的每单位面积的电容密度，由此具有各种电容值的电容器，例如具有高电容的多层陶瓷电容器可以嵌入印刷电路板中，而不是安装在其上。此外，提供了一种制造包括嵌入式电容器的印刷电路板的方法。

9. 发明申请

US20060243479A1 Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same 失效
标题翻译：使用混合材料的嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US20060243479A1
公开(公告)日：2006-11-02
申请号：US11361078
申请日：2006-02-22
申请人： Tae Kim , Jun Oh , Jin Kim
发明人： Tae Kim , Jun Oh , Jin Kim
IPC分类号： H05K1/03 , H05K1/16
CPC分类号： H05K1/162 , H05K3/4611 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0141 , H05K2201/0209 , H05K2201/09309 , H05K2201/09509 , H05K2201/09518 , H05K2201/09672 , Y10T29/43 , Y10T29/435 , Y10T29/4913
摘要： The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
摘要翻译：本发明涉及具有使用混合材料的嵌入式电容器的印刷电路板及其制造方法。本发明提供了一种具有嵌入式电容器的印刷电路板，以及使用包括液晶聚合物和陶瓷粉末的混合电介质层的材料，以及制造这种印刷电路板的方法。

10. 发明申请

US20060158088A1 Method of forming shadow mask pattern 有权
标题翻译：形成荫罩图案的方法
公开(公告)号：US20060158088A1
公开(公告)日：2006-07-20
申请号：US11325312
申请日：2006-01-05
申请人： Jin Kim , Sang Han , Hee Kang , Eu Kang , Tae Kim
发明人： Jin Kim , Sang Han , Hee Kang , Eu Kang , Tae Kim
IPC分类号： H01L21/00 , H01J29/80
CPC分类号： C23C14/042 , H01L51/0011 , Y10T29/49867
摘要： Disclosed is a method of forming a pattern on a mask sheet including an attaching portion to be attached to a mask frame, and a pattern area in which the pattern is formed. The method includes positioning the mask sheet on an auxiliary sheet with a thickness greater than the thickness of the mask sheet, fastening the auxiliary sheet to the mask frame, applying a stretching force to the mask sheet and the auxiliary sheet, and forming the pattern on the pattern area of the mask sheet. Thus, a predetermined pattern is formed on a mask sheet while a uniformly distributed external force is applied to the mask sheet, so that bending or deflecting out of plane by the mask sheet is prevented, thereby forming a precise mask pattern.
摘要翻译：公开了一种在掩模板上形成图案的方法，该掩模板包括附着到掩模框架的附接部分和形成图案的图案区域。该方法包括将掩模片定位在厚度大于掩模片的厚度的辅助片上，将辅助片固定到掩模框架上，向掩模片和辅助片施加拉伸力，并将形状形成在掩模片的图案区域。因此，在均匀分布的外力施加到掩模片上时，在掩模板上形成预定图案，从而防止由掩模片弯曲或偏转出平面，从而形成精确的掩模图案。

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