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1. 发明授权

US07855099B2 Manufacturing method for a secure-digital (SD) flash card with slanted asymmetric circuit board 失效
标题翻译：具有倾斜不对称电路板的安全数字（SD）闪存卡的制造方法
公开(公告)号：US07855099B2
公开(公告)日：2010-12-21
申请号：US12423657
申请日：2009-04-14
申请人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/02 , H01L23/498
CPC分类号： G06K19/077 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/07732 , G07C9/00087 , Y02D10/13
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括通过安全数字（SD）接口到外部计算机的输入/输出接口电路，以及从闪存芯片读取数据块的处理单元。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。在每个SD接触垫和中肋下的支撑端肋以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。

2. 发明授权

US07535088B2 Secure-digital (SD) flash card with slanted asymmetric circuit board 失效
标题翻译：具有倾斜不对称电路板的安全数字（SD）闪存卡
公开(公告)号：US07535088B2
公开(公告)日：2009-05-19
申请号：US11309844
申请日：2006-10-11
申请人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： H01L23/02 , H01L23/34 , H01L29/68
CPC分类号： G06K19/077 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/07732 , G07C9/00087 , Y02D10/13
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括通过安全数字（SD）接口到外部计算机的输入/输出接口电路，以及从闪存芯片读取数据块的处理单元。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。在每个SD接触垫和中肋下的支撑端肋以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。

3. 发明授权

US07476105B2 Super-digital (SD) flash card with asymmetric circuit board and mechanical switch 失效
标题翻译：具有非对称电路板和机械开关的超级数字（SD）闪存卡
公开(公告)号：US07476105B2
公开(公告)日：2009-01-13
申请号：US11846725
申请日：2007-08-29
申请人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： H01R12/00
CPC分类号： G06K19/07743 , A45C2011/188 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/077 , G06K19/07732 , G07C9/00087 , H05K1/117 , H05K1/118 , H05K1/189 , H05K3/284 , H05K3/4691 , H05K2201/091 , H05K2201/10159 , H05K2203/1527
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB. A user-slidable switch may be slanted to compensate for the PCB slant. The PCB may have a flex section to facilitate the slant without a slanted switch.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以便为安装在PCB底部表面的芯片提供更大的厚度。用户可滑动的开关可以倾斜以补偿PCB倾斜。 PCB可以具有弯曲部分以便于倾斜而没有倾斜的开关。

4. 发明申请

US20090203168A1 Manufacturing Method for a Secure-Digital (SD) Flash Card with Slanted Asymmetric Circuit Board 失效
标题翻译：具有倾斜不对称电路板的安全数字（SD）闪存卡的制造方法
公开(公告)号：US20090203168A1
公开(公告)日：2009-08-13
申请号：US12423657
申请日：2009-04-14
申请人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： H01L21/00
CPC分类号： G06K19/077 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/07732 , G07C9/00087 , Y02D10/13
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括通过安全数字（SD）接口到外部计算机的输入/输出接口电路，以及从闪存芯片读取数据块的处理单元。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。在每个SD接触垫和中肋下的支撑端肋以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。

5. 发明授权

US07479039B2 Manufacturing process for a super-digital (SD) flash card with slanted asymmetric circuit board 失效
标题翻译：具有倾斜不对称电路板的超级数字（SD）闪存卡的制造工艺
公开(公告)号：US07479039B2
公开(公告)日：2009-01-20
申请号：US11846733
申请日：2007-08-29
申请人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
发明人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh , Ming-Shiang Shen
IPC分类号： H01R13/66
CPC分类号： G06K19/07743 , A45C2011/188 , G06F12/1416 , G06F21/32 , G06F21/78 , G06K9/00087 , G06K19/07 , G06K19/07354 , G06K19/077 , G06K19/07732 , G07C9/00087 , H05K1/117 , H05K1/118 , H05K1/189 , H05K3/284 , H05K3/4691 , H05K2201/091 , H05K2201/10159 , H05K2203/1527
摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline. A metal switch-bar or an over-molded controller die may be substituted.
摘要翻译：闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。金属开关杆或过模制的控制器管芯可以被替代。

6. 发明申请

US20080151487A1 Memory Module Assembly Including Heat-Sink Plates With Heat-Exchange Fins Attached To Integrated Circuits By Adhesive 有权
标题翻译：内存模块装配，包括带有热交换散热片的散热片，通过粘合剂连接到集成电路
公开(公告)号：US20080151487A1
公开(公告)日：2008-06-26
申请号：US12042229
申请日：2008-03-04
申请人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh
发明人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H01L23/42 , H01L23/367 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the base structure such that a step-like positioning surface is defined therebetween, and heat-exchange fins extending from the opposite side of the base structure. An optional upper heat-sink plate is secured to a second side of the PCBA by a second adhesive layer, and contacts the lower heat-sink plate to facilitate heat transfer to the heat-exchange fins. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
摘要翻译：存储器模块组件包括通过粘合剂附接到存储器模块PCBA的一个或多个集成电路（例如，存储器件）的散热板。散热板包括细长的基部结构，从基部结构延伸的第一接触板，以便在其间限定台阶状的定位表面，以及从基部结构的相对侧延伸的热交换翅片。可选的上部散热板通过第二粘合剂层固定到PCBA的第二侧，并且接触下部散热板以便于热传递到热交换翅片。粘合剂是热活化或热固化的。将粘合剂施加到存储器件或散热板上，然后使用夹具在散热板和存储器模块之间进行压缩。然后将夹具通过烘箱以激活/固化粘合剂。

7. 发明授权

US07768785B2 Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive 有权
标题翻译：存储器模块组件包括散热板，其中热交换翅片通过粘合剂附接到集成电路
公开(公告)号：US07768785B2
公开(公告)日：2010-08-03
申请号：US12042229
申请日：2008-03-04
申请人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh
发明人： Jim Chin-Nan Ni , Abraham C. Ma , Paul Hsueh
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/42 , H01L23/367 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the base structure such that a step-like positioning surface is defined therebetween, and heat-exchange fins extending from the opposite side of the base structure. An optional upper heat-sink plate is secured to a second side of the PCBA by a second adhesive layer, and contacts the lower heat-sink plate to facilitate heat transfer to the heat-exchange fins. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
摘要翻译：存储器模块组件包括通过粘合剂附接到存储器模块PCBA的一个或多个集成电路（例如，存储器件）的散热板。散热板包括细长的基部结构，从基部结构延伸的第一接触板，使得在其间形成台阶状的定位面，以及从基部结构的相对侧延伸的热交换翅片。可选的上部散热板通过第二粘合剂层固定到PCBA的第二侧，并且接触下部散热板以便于热传递到热交换翅片。粘合剂是热活化或热固化的。将粘合剂施加到存储器件或散热板上，然后使用夹具在散热板和存储器模块之间进行压缩。然后将夹具通过烘箱以激活/固化粘合剂。

8. 发明申请

US20080145968A1 Manufacturing Method For Micro-SD Flash Memory Card 失效
标题翻译： Micro-SD闪存卡的制造方法
公开(公告)号：US20080145968A1
公开(公告)日：2008-06-19
申请号：US11966871
申请日：2007-12-28
申请人： Siew S. Hiew , Nan Nan , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
发明人： Siew S. Hiew , Nan Nan , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
IPC分类号： H05K3/00 , H01L21/00
CPC分类号： H05K3/0052 , H01L21/561 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H05K1/117 , H05K3/284 , H05K2201/09063 , H05K2201/0909 , Y10T29/49002 , Y10T29/49124 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49146 , Y10T29/49789 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.
摘要翻译：一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离。无源元件通过常规表面贴装技术（SMT）技术连接。包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。然后使用用于将每个PCB连接到PCB面板的连接桥件进行切割，然后使用旋转锯切割。然后执行前沿倒角处理。

9. 发明授权

US08141240B2 Manufacturing method for micro-SD flash memory card 失效
标题翻译：微型SD闪存卡的制造方法
公开(公告)号：US08141240B2
公开(公告)日：2012-03-27
申请号：US11966871
申请日：2007-12-28
申请人： Siew S. Hiew , Nan Nan , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
发明人： Siew S. Hiew , Nan Nan , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
IPC分类号： H05K3/30 , H05K3/00 , H01L23/00
CPC分类号： H05K3/0052 , H01L21/561 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H05K1/117 , H05K3/284 , H05K2201/09063 , H05K2201/0909 , Y10T29/49002 , Y10T29/49124 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49146 , Y10T29/49789 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using using a rotary saw. A front edge chamfer process is then performed.
摘要翻译：一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离。无源元件通过常规表面贴装技术（SMT）技术连接。包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。然后使用旋转锯切割连接的桥接件。然后执行前沿倒角处理。

10. 发明申请

US20080235939A1 Manufacturing Method For Micro-SD Flash Memory Card 审中-公开
标题翻译： Micro-SD闪存卡制造方法
公开(公告)号：US20080235939A1
公开(公告)日：2008-10-02
申请号：US12033851
申请日：2008-02-19
申请人： Siew S. Hiew , Charles C. Lee , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
发明人： Siew S. Hiew , Charles C. Lee , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
IPC分类号： H05K3/20 , G11C11/34
CPC分类号： H05K3/284 , H01L21/561 , H01L24/97 , H01L2224/48227 , H01L2224/97 , H01L2924/01029 , H01L2924/14 , H01L2924/1815 , H05K1/117 , H05K3/0032 , H05K3/0052 , H05K2201/09154 , H05K2201/10159 , H05K2203/0228 , H05K2203/0746 , H05K2203/1316 , Y10T29/49126 , Y10T29/49128 , Y10T29/49146 , Y10T29/49147 , Y10T29/49171 , Y10T29/49789 , Y10T29/49798 , H01L2224/85 , H01L2924/00
摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCB regions arranged in parallel rows. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded layer is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The panel is then singulated using one of a laser cutting method, an abrasive water jet cutting method, and a mechanical grinding method such that the resulting PCB substrate and plastic housing have the width, height and length specified by MicroSD specifications. A front edge chamfer process is then performed.
摘要翻译：一种用于制造MicroSD器件的方法包括形成具有平行排布置的多个PCB区域的PCB面板。无源元件通过常规表面贴装技术（SMT）技术连接。包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制层。然后使用激光切割方法，磨料水射流切割方法和机械研磨方法之一将面板切片，使得所得PCB基板和塑料外壳具有由MicroSD规格规定的宽度，高度和长度。然后执行前沿倒角处理。

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