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1. 外观设计

USD1005756S1 Two tier organizer 有权
公开(公告)号：USD1005756S1
公开(公告)日：2023-11-28
申请号：US29892218
申请日：2023-05-16
申请人： Jianhong Wang
设计人： Jianhong Wang
摘要： FIG. 1 is a top perspective view of a two tier organizer, showing my new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof; and,
FIG. 7 is a top plan view thereof.
The broken lines in the figures are for the purposes of illustrating portions of the two tier organizer, which form no part of the claimed design.

2. 发明授权

US08466539B2 MRAM device and method of assembling same 有权
标题翻译： MRAM装置及其组装方法
公开(公告)号：US08466539B2
公开(公告)日：2013-06-18
申请号：US13334006
申请日：2011-12-21
申请人： Jun Li , Jianhong Wang , Xuesong Xu , Jinzhong Yao , Wanming Yu
发明人： Jun Li , Jianhong Wang , Xuesong Xu , Jinzhong Yao , Wanming Yu
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/01013 , H01L2924/01028 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.
摘要翻译：一种组装磁阻随机存取存储器（MRAM）器件的方法包括提供具有开口的衬底。将带施加到基板的表面，并且第一磁屏蔽被放置在带上和基板开口内。在第一磁屏蔽和基板之间施加粘合剂以将第一磁屏蔽件附接到基板。将MRAM管芯连接到第一磁屏蔽，并且MRAM管芯的接合焊盘通过电线连接到衬底上的焊盘。第二磁屏蔽连接到MRAM管芯的顶表面。将封装材料分配到基板上，MRAM裸片，第二磁屏蔽和第一磁屏蔽的一部分固化，然后去除胶带。焊球然后可以附着到基板上。

3. 发明授权

US08354739B2 Thin semiconductor package and method for manufacturing same 有权
标题翻译：薄半导体封装及其制造方法
公开(公告)号：US08354739B2
公开(公告)日：2013-01-15
申请号：US13092159
申请日：2011-04-22
申请人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
发明人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
IPC分类号： H01L23/495 , H01L21/28
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/8501 , H01L2924/00014 , H01L2924/18165 , H01L2224/45099
摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
摘要翻译：一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。半导体管芯安装在中央区域的可拆卸基板上。半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。然后去除部分第一密封剂以减小包装的厚度并暴露引线。

4. 发明授权

US08096346B2 Method for casting high-power wind turbine base with ductile iron 有权
标题翻译：用球墨铸铁大功率风力发电机底座的方法
公开(公告)号：US08096346B2
公开(公告)日：2012-01-17
申请号：US12363779
申请日：2009-02-01
申请人： Yongluo Hua , Jianhong Wang , Yufang Chen , Qiang Wang , Yuebing Wu
发明人： Yongluo Hua , Jianhong Wang , Yufang Chen , Qiang Wang , Yuebing Wu
IPC分类号： B22C1/22 , B22C9/02 , B22C9/08 , B22D27/00
CPC分类号： B22D25/06 , C22C37/10
摘要： A method of casting a base of high-power wind turbines with low-temperature nodular graphite iron, using furan resin sand as the mold sand and having no risers or chills in the mold. The mold undergoes microseismic compaction and has no chills risers. The parting face of the mold is perpendicular to the ground. The molten iron in the mold is solidified evenly. Therefore, shrinkage holes and disperse shrinkages base are reduced greatly and the dregs and air are discharged easily for the base. The pouring system designed together with a reasonable pouring rate and time make the filtering system useful for blocking dregs.
摘要翻译：一种用低温球墨铸铁铸造大功率风力发电机组的方法，使用呋喃树脂砂作为模具砂，并且在模具中没有立管或发冷。模具经历微震压实，并且没有发冷的提升管。模具的分型面垂直于地面。模具中的铁水均匀固化。因此，收缩孔和分散收缩基底大大减少，并且渣和空气容易地排出到基部。浇注系统与合理的浇注速率和时间一起设计，使得过滤系统可用于堵塞渣滓。

5. 发明申请

US20110316130A1 THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：薄半导体封装及其制造方法
公开(公告)号：US20110316130A1
公开(公告)日：2011-12-29
申请号：US13092159
申请日：2011-04-22
申请人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
发明人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
IPC分类号： H01L23/495 , H01L21/28
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/8501 , H01L2924/00014 , H01L2924/18165 , H01L2224/45099
摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
摘要翻译：一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。半导体管芯安装在中央区域的可拆卸基板上。半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。然后去除部分第一密封剂以减小包装的厚度并暴露引线。

6. 外观设计

USD992233S1 Wheel 有权
公开(公告)号：USD992233S1
公开(公告)日：2023-07-11
申请号：US29746487
申请日：2020-08-14
申请人： Jianhong Wang
设计人： Jianhong Wang
摘要： FIG. 1 is a right perspective view of a wheel showing my new design;
FIG. 2 is a left perspective view thereof;
FIG. 3 is a front perspective view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a rear perspective view showing the wheel in an alternate position.

7. 外观设计

USD933520S1 Censer 有权
公开(公告)号：USD933520S1
公开(公告)日：2021-10-19
申请号：US29721004
申请日：2020-01-17
申请人： Jianhong Wang
设计人： Jianhong Wang

8. 发明授权

US07370920B2 Anti-torque load captive bearings 失效
标题翻译：抗扭矩负载圈式轴承
公开(公告)号：US07370920B2
公开(公告)日：2008-05-13
申请号：US11298990
申请日：2005-12-09
申请人： Jianhong Wang , Wenming Yang , Alfred E. Barry, Jr.
发明人： Jianhong Wang , Wenming Yang , Alfred E. Barry, Jr.
IPC分类号： A47B88/00
CPC分类号： H05K7/1489 , A47B88/40 , A47B2210/0032 , A47B2210/0035 , A47B2210/004 , A47B2210/0059
摘要： A bearing drawer slide (10) has an inner slide member (16) which is slidably extensible from within an outer slide member (14). Captives bearings (28) have elongate bodies (29) for locating in fixed relation to a rearward end (20) of the inner slide member (16), disposed within the bearing spaces (48) between the inner slide member (16) and the outer slide member (14), with sides (31, 33) of the elongate bodies fitting against bearing races (36, 46) of the outer and inner slide members (14, 16). The captive bearings (28) are moveable with the inner slide member (16) relative to the outer slide member (14), and prevent movement of the rearward end (20) of the inner slide member (16) relative to the outer slide member (14) in directions which are transverse to the directions in which inner slide member (14) extends relative to the outer slide member (16), particularly when the inner slide member (14) is fully retracted within the outer slide member (16).
摘要翻译：轴承抽屉滑动件（10）具有内滑动构件（16），其从外滑动构件（14）中可滑动地延伸。护圈轴承（28）具有细长体（29），用于与内部滑动构件（16）的后端（20）固定地定位，设置在内部滑动构件（16）和外滑动构件（14），其中细长体的侧面（31,33）装配到外滑动构件（14）和内滑动构件（16）的轴承座（36,46）上。固定轴承（28）能够相对于外部滑动构件（14）与内部滑动构件（16）相互运动，并且防止内侧滑动构件（16）的后端（20）相对于外侧滑动构件（14）在与内滑动构件（14）相对于外滑动构件（16）延伸的方向横向的方向上，特别是当内滑动构件（14）完全缩回到外滑动构件（16）内时，。

9. 发明申请

US20070132347A1 Anti-torque load captive bearings 失效
标题翻译：抗扭矩负载圈式轴承
公开(公告)号：US20070132347A1
公开(公告)日：2007-06-14
申请号：US11298990
申请日：2005-12-09
申请人： Jianhong Wang , Wenming Yang , Alfred Barry
发明人： Jianhong Wang , Wenming Yang , Alfred Barry
IPC分类号： A47B88/00
CPC分类号： H05K7/1489 , A47B88/40 , A47B2210/0032 , A47B2210/0035 , A47B2210/004 , A47B2210/0059
摘要： A bearing drawer slide (10) has an inner slide member (16) which is slidably extensible from within an outer slide member (14). Captives bearings (28) have elongate bodies (29) for locating in fixed relation to a rearward end (20) of the inner slide member (16), disposed within the bearing spaces (48) between the inner slide member (16) and the outer slide member (14), with sides (31, 33) of the elongate bodies (29) fitting against bearing races (36, 46) of the outer and inner slide members (14, 16). The captive bearings (28) are moveable with the inner slide member (16) relative to the outer slide member (14), and prevent movement of the rearward end (20) of the inner slide member (16) relative to the outer slide member (14) in directions which are transverse to the directions in which inner slide member (14) extends relative to the outer slide member (16), particularly when the inner slide member (14) is fully retracted within the outer slide member (16).
摘要翻译：轴承抽屉滑动件（10）具有内滑动构件（16），其从外滑动构件（14）中可滑动地延伸。护圈轴承（28）具有细长体（29），用于与内部滑动构件（16）的后端（20）固定地定位，设置在内部滑动构件（16）和外滑动构件（14），其中细长体（29）的侧面（31,33）与外滑动构件（14）和内滑动构件（14,16）的轴承座（36,46）相配合。固定轴承（28）能够相对于外部滑动构件（14）与内部滑动构件（16）相互运动，并且防止内侧滑动构件（16）的后端（20）相对于外侧滑动构件（14）在与内滑动构件（14）相对于外滑动构件（16）延伸的方向横向的方向上，特别是当内滑动构件（14）完全缩回到外滑动构件（16）内时，。

10. 外观设计

USD1044323S1 Pot cover rack 有权
公开(公告)号：USD1044323S1
公开(公告)日：2024-10-01
申请号：US29888572
申请日：2023-04-03
申请人： Jianhong Wang
设计人： Jianhong Wang
摘要： FIG. 1 is a front perspective and top perspective view of a pot cover rack, showing my new design;
FIG. 2 is a front perspective and bottom perspective view thereof;
FIG. 3 is a rear perspective and top perspective view thereof;
FIG. 4 is a rear perspective and bottom perspective view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a left side view thereof;
FIG. 8 is a right side view thereof;
FIG. 9 is a top plan view thereof; and,
FIG. 10 is a bottom plan view thereof.
The broken lines in the figures are for the purposes of illustrating portions of the pot cover rack and form no part of the claimed design.

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