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1. 发明申请

US20140003765A1 WAVEGUIDE INTEGRATION ON LASER FOR ALIGNMENT-TOLERANT ASSEMBLY 有权
标题翻译：用于对准耐压组件的激光波形整合
公开(公告)号：US20140003765A1
公开(公告)日：2014-01-02
申请号：US13536329
申请日：2012-06-28
申请人： Jia-Hung Tseng , Peter L. Chang , Miriam R. Reshotko , Ibrahim Ban , Mauro J. Kobrinsky , Brian Corbett , Roberto Pagano
发明人： Jia-Hung Tseng , Peter L. Chang , Miriam R. Reshotko , Ibrahim Ban , Mauro J. Kobrinsky , Brian Corbett , Roberto Pagano
IPC分类号： G02B6/12 , H01L21/50
CPC分类号： G02B6/12004 , H01L23/48 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2223/6627 , H01L2224/131 , H01L2224/13101 , H01L2224/16145 , H01L2224/16225 , H01L2224/81815 , H01L2225/06513 , H01L2225/06534 , H01L2924/12042 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a substrate, a laser device formed on the substrate, the laser device including an active layer configured to emit light, and a mode-expander waveguide disposed on the substrate and butt-coupled with the active layer to receive and route the light to a waveguide formed on another substrate. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供光学连接技术和配置。在一个实施例中，一种装置包括：基板，形成在基板上的激光装置，激光装置包括被配置为发光的有源层;以及设置在基板上的模式扩展器波导，并与有源层对接以接收并将光线导向形成在另一基板上的波导。可以描述和/或要求保护其他实施例。

2. 发明授权

US08731346B2 Waveguide integration on laser for alignment-tolerant assembly 有权
标题翻译：激光器上的波导集成用于对准容限组装
公开(公告)号：US08731346B2
公开(公告)日：2014-05-20
申请号：US13536329
申请日：2012-06-28
申请人： Jia-Hung Tseng , Peter L. Chang , Miriam R. Reshotko , Ibrahim Ban , Mauro J. Kobrinsky , Brian Corbett , Roberto Pagano
发明人： Jia-Hung Tseng , Peter L. Chang , Miriam R. Reshotko , Ibrahim Ban , Mauro J. Kobrinsky , Brian Corbett , Roberto Pagano
IPC分类号： G02B6/12
CPC分类号： G02B6/12004 , H01L23/48 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2223/6627 , H01L2224/131 , H01L2224/13101 , H01L2224/16145 , H01L2224/16225 , H01L2224/81815 , H01L2225/06513 , H01L2225/06534 , H01L2924/12042 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a substrate, a laser device formed on the substrate, the laser device including an active layer configured to emit light, and a mode-expander waveguide disposed on the substrate and butt-coupled with the active layer to receive and route the light to a waveguide formed on another substrate. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供光学连接技术和配置。在一个实施例中，一种装置包括：基板，形成在基板上的激光装置，激光装置包括被配置为发光的有源层;以及设置在基板上的模式扩展器波导，并与有源层对接以接收并将光线导向形成在另一基板上的波导。可以描述和/或要求保护其他实施例。

3. 发明申请

US20130279845A1 FABRICATION OF PLANAR LIGHT-WAVE CIRCUITS (PLCS) FOR OPTICAL I/O 有权
标题翻译：用于光I / O的平面光波导电路（PLCS）的制造
公开(公告)号：US20130279845A1
公开(公告)日：2013-10-24
申请号：US13976910
申请日：2011-12-21
申请人： Mauro J. Kobrinsky , Miriam R. Reshotko , Ibrahim Ban , Bruce A. Block , Peter L. Chang
发明人： Mauro J. Kobrinsky , Miriam R. Reshotko , Ibrahim Ban , Bruce A. Block , Peter L. Chang
IPC分类号： G02B6/12 , G02B6/13
CPC分类号： G02B6/12 , G02B6/0033 , G02B6/0045 , G02B6/12004 , G02B6/13 , G02B6/136 , G02B6/138 , G02B6/4206 , G02B6/421 , G02B6/4214 , G02B6/4244 , G02B6/4245 , G02B2006/12166 , G02B2006/12173 , G02B2006/12176
摘要： PLC architectures and fabrication techniques for providing electrical and photonic integration of a photonic components with a semiconductor substrate. In the exemplary embodiment, the PLC is to accommodate optical input and/or output (I/O) as well as electrically couple to a microelectronic chip. One or more photonic chip or optical fiber terminal may be coupled to an optical I/O of the PLC. In embodiments the PLC includes a light modulator, photodetector and coupling regions supporting the optical I/O. Spin-on electro-optic polymer (EOP) may be utilized for the modulator while a photodefinable material is employed for a mode expander in the coupling region.
摘要翻译： PLC架构和制造技术，用于提供光子部件与半导体衬底的电和光子集成。在示例性实施例中，PLC适应光输入和/或输出（I / O）以及电耦合到微电子芯片。一个或多个光子芯片或光纤终端可以耦合到PLC的光学I / O。在实施例中，PLC包括支持光学I / O的光调制器，光电检测器和耦合区域。旋转电光聚合物（EOP）可以用于调制器，而可光限定材料用于耦合区域中的模式扩展器。

4. 发明授权

US09182544B2 Fabrication of planar light-wave circuits (PLCS) for optical I/O 有权
标题翻译：用于光学I / O的平面光波电路（PLCS）的制造
公开(公告)号：US09182544B2
公开(公告)日：2015-11-10
申请号：US13976910
申请日：2011-12-21
申请人： Mauro J. Kobrinsky , Miriam R. Reshotko , Ibrahim Ban , Bruce A. Block , Peter L. Chang
发明人： Mauro J. Kobrinsky , Miriam R. Reshotko , Ibrahim Ban , Bruce A. Block , Peter L. Chang
IPC分类号： G02B6/12 , G02B6/136 , G02B6/138 , G02B6/13 , G02B6/42 , F21V8/00
CPC分类号： G02B6/12 , G02B6/0033 , G02B6/0045 , G02B6/12004 , G02B6/13 , G02B6/136 , G02B6/138 , G02B6/4206 , G02B6/421 , G02B6/4214 , G02B6/4244 , G02B6/4245 , G02B2006/12166 , G02B2006/12173 , G02B2006/12176
摘要： PLC architectures and fabrication techniques for providing electrical and photonic integration of a photonic components with a semiconductor substrate. In the exemplary embodiment, the PLC is to accommodate optical input and/or output (I/O) as well as electrically couple to a microelectronic chip. One or more photonic chip or optical fiber terminal may be coupled to an optical I/O of the PLC. In embodiments the PLC includes a light modulator, photodetector and coupling regions supporting the optical I/O. Spin-on electro-optic polymer (EOP) may be utilized for the modulator while a photodefinable material is employed for a mode expander in the coupling region.
摘要翻译： PLC架构和制造技术，用于提供光子部件与半导体衬底的电和光子集成。在示例性实施例中，PLC适应光输入和/或输出（I / O）以及电耦合到微电子芯片。一个或多个光子芯片或光纤终端可以耦合到PLC的光学I / O。在实施例中，PLC包括支持光学I / O的光调制器，光电检测器和耦合区域。旋转电光聚合物（EOP）可以用于调制器，而可光限定材料用于耦合区域中的模式扩展器。

5. 发明授权

US09507086B2 Optical I/O system using planar light-wave integrated circuit 有权
标题翻译：光I / O系统采用平面光波集成电路
公开(公告)号：US09507086B2
公开(公告)日：2016-11-29
申请号：US13996531
申请日：2011-12-30
申请人： Mauro J. Kobrinsky , Henning Braunisch , Shawna M. Liff , Peter L. Chang , Bruce A. Block , Johanna M. Swan
发明人： Mauro J. Kobrinsky , Henning Braunisch , Shawna M. Liff , Peter L. Chang , Bruce A. Block , Johanna M. Swan
IPC分类号： H04B10/25 , G02B6/12 , G02B6/42 , G02B6/30
CPC分类号： G02B6/12004 , G02B6/12 , G02B6/30 , G02B6/4214 , G02B6/4257 , G02B6/428 , G02B2006/12061 , G02B2006/12121 , G02B2006/12123 , H01L21/563 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/167 , H01L2224/13025 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/81011 , H01L2224/81024 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/83048 , H01L2224/83102 , H01L2224/83986 , H01L2224/92125 , H01L2924/12042 , H01L2924/12043 , H01L2924/1431 , H01L2924/1432 , H01L2924/15311 , H01L2924/15312 , H04B10/25 , H04B10/40 , H04B10/801 , H01L2924/00014 , H01L2924/014
摘要： Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.
摘要翻译：光子元件放置在处理器封装上，使光信号靠近处理器管芯。处理器封装包括处理器管芯耦合到其上的基板，并且允许处理器管芯连接到印刷电路板。处理器封装还包括收发器逻辑，电光转换电路和光耦合器。电光转换电路可以包括激光器，调制器和用于发射和接收光信号的光电检测器。耦合器连接到从处理器封装延伸的光纤。多个光纤可以被带到处理器封装，允许与处理器的可扩展的高速，高带宽互连。

6. 发明授权

US09036954B2 Optical waveguide structure 有权
标题翻译：光波导结构
公开(公告)号：US09036954B2
公开(公告)日：2015-05-19
申请号：US13078210
申请日：2011-04-01
申请人： Mauro J. Kobrinsky , Bruce A. Block , Peter L. Chang
发明人： Mauro J. Kobrinsky , Bruce A. Block , Peter L. Chang
IPC分类号： G02F1/035 , G02F1/025 , G02F1/065 , G02F1/225
CPC分类号： G02F1/035 , G02F1/025 , G02F1/065 , G02F1/225 , G02F2201/18
摘要： Embodiments of the invention describe a multi-segment optical waveguide that enables an optical modulator to be low-power and athermal by decreasing the device length needed for a given waveguide length. Embodiments of the invention describe an optical waveguide that is folded onto itself, and thus includes at least two sections. Thus, embodiments of the invention may decrease the device size of a modulator by at least around a factor of two if the device is folded twofold (device size may be further reduced if the modulator is folded threefold, four-fold, five-fold, etc.).Embodiments of the invention further enable the electrode length required to create the desired electro-optic effect for the multi-segment optical waveguide to be reduced. In embodiments of the invention, certain electrodes may be “shared” amongst the different segments of the waveguide, thereby reducing the power requirement and capacitance of a device having a waveguide of a given length.
摘要翻译：本发明的实施例描述了一种多段光波导，其通过减小给定波导长度所需的器件长度，使光调制器能够实现低功率和无热性。本发明的实施例描述了折叠到其自身上的光波导，因此包括至少两个部分。因此，如果将器件折叠两倍，则本发明的实施例可以将调制器的器件尺寸减小至少约二分之一（如果调制器折叠三倍，四倍，五倍，等等。）。本发明的实施例还使得能够减少为多分段光波导产生期望的电光效应所需的电极长度。在本发明的实施例中，某些电极可以在波导的不同部分之间“共享”，由此降低具有给定长度的波导的器件的功率需求和电容。

7. 发明申请

US20140203175A1 OPTICAL I/O SYSTEM USING PLANAR LIGHT-WAVE INTEGRATED CIRCUIT 有权
标题翻译：使用平面光波集成电路的光学I / O系统
公开(公告)号：US20140203175A1
公开(公告)日：2014-07-24
申请号：US13996531
申请日：2011-12-30
申请人： Mauro J. Kobrinsky , Henning Braunisch , Shawna M. Liff , Peter L. Chang , Bruce A. Block , Johanna M. Swan
发明人： Mauro J. Kobrinsky , Henning Braunisch , Shawna M. Liff , Peter L. Chang , Bruce A. Block , Johanna M. Swan
IPC分类号： H04B10/25 , G02B6/12
CPC分类号： G02B6/12004 , G02B6/12 , G02B6/30 , G02B6/4214 , G02B6/4257 , G02B6/428 , G02B2006/12061 , G02B2006/12121 , G02B2006/12123 , H01L21/563 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/167 , H01L2224/13025 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/81011 , H01L2224/81024 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/83048 , H01L2224/83102 , H01L2224/83986 , H01L2224/92125 , H01L2924/12042 , H01L2924/12043 , H01L2924/1431 , H01L2924/1432 , H01L2924/15311 , H01L2924/15312 , H04B10/25 , H04B10/40 , H04B10/801 , H01L2924/00014 , H01L2924/014
摘要： Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.
摘要翻译：光子元件放置在处理器封装上，使光信号靠近处理器管芯。处理器封装包括处理器管芯耦合到其上的基板，并且允许处理器管芯连接到印刷电路板。处理器封装还包括收发器逻辑，电光转换电路和光耦合器。电光转换电路可以包括激光器，调制器和用于发射和接收光信号的光电检测器。耦合器连接到从处理器封装延伸的光纤。多个光纤可以被带到处理器封装，允许与处理器的可扩展的高速，高带宽互连。

8. 发明申请

US20170278733A1 MICRO PICK AND BOND ASSEMBLY 审中-公开
公开(公告)号：US20170278733A1
公开(公告)日：2017-09-28
申请号：US15512342
申请日：2014-10-17
申请人： Peter L. Chang , Chytra Pawashe , Michael C. Mayberry , Jia-Hung Tseng
发明人： Peter L. Chang , Chytra Pawashe , Michael C. Mayberry , Jia-Hung Tseng
IPC分类号： H01L21/67 , H01L25/075 , H01L33/44 , H01L21/683 , H01L33/36 , H01L33/62 , H01L33/00
CPC分类号： H01L21/67144 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L33/0079 , H01L33/0095 , H01L33/36 , H01L33/44 , H01L33/62 , H01L2224/95 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066
摘要： Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

9. 发明授权

US09025926B2 Slotted Y-coupling waveguide for slotted waveguide modulator device 有权
标题翻译：用于槽波导调制器的开槽Y耦合波导
公开(公告)号：US09025926B2
公开(公告)日：2015-05-05
申请号：US13581720
申请日：2011-09-22
申请人： Peter L. Chang , Jia-Hung Tseng
发明人： Peter L. Chang , Jia-Hung Tseng
IPC分类号： G02B6/10 , G02B6/136 , G02F1/313 , G02B6/122 , G02B6/125 , G02F1/025 , G02F1/065
CPC分类号： G02F1/3133 , G02B6/1221 , G02B6/125 , G02B6/136 , G02F1/025 , G02F1/065
摘要： Embodiments of the present disclosure describe techniques and configurations for decreasing optical loss in a waveguide of a modulator device. In one embodiment, an apparatus includes a substrate, and a waveguide of a modulator device formed on the substrate, the waveguide having a first portion that is configured to receive light for propagation along the waveguide, a second portion that includes two slots formed in the waveguide that merge into a single slot, the second portion being coupled with the first portion, a third portion that includes the single slot formed in the waveguide, the third portion being coupled with the second portion, a fourth portion that includes another two slots formed in the waveguide, the another two slots branching from the single slot, the fourth portion being coupled with the third portion, and a fifth portion that is configured to output the propagated light, the fifth portion being coupled with the fourth portion. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例描述了用于减少调制器装置的波导中的光损耗的技术和配置。在一个实施例中，一种装置包括衬底和形成在衬底上的调制器装置的波导，该波导具有构造成接收用于沿着波导传播的光的第一部分，第二部分包括形成在波导，其合并成单个槽，所述第二部分与所述第一部分耦合;第三部分，其包括形成在所述波导中的所述单个槽，所述第三部分与所述第二部分联接;第四部分，包括形成的另外两个槽; 在波导中，另外两个狭槽从单个槽分支，第四部分与第三部分耦合，第五部分被配置为输出传播的光，第五部分与第四部分耦合。可以描述和/或要求保护其他实施例。

10. 发明申请

US20140199015A1 SLOTTED Y-COUPLING WAVEGUIDE FOR SLOTTED WAVEGUIDE MODULATOR DEVICE 有权
标题翻译：用于插槽式波导调制器装置的插槽式Y型联轴器
公开(公告)号：US20140199015A1
公开(公告)日：2014-07-17
申请号：US13581720
申请日：2011-09-22
申请人： Peter L. Chang , Jia-Hung Tseng
发明人： Peter L. Chang , Jia-Hung Tseng
IPC分类号： G02F1/313 , G02B6/136 , G02B6/125
CPC分类号： G02F1/3133 , G02B6/1221 , G02B6/125 , G02B6/136 , G02F1/025 , G02F1/065
摘要： Embodiments of the present disclosure describe techniques and configurations for decreasing optical loss in a wave-guide of a modulator device. In one embodiment, an apparatus includes a substrate, and a waveguide of a modulator device formed on the substrate, the waveguide having a first portion that is configured to receive light for propagation along the waveguide, a second portion that includes two slots formed in the waveguide that merge into a single slot, the second portion being coupled with the first portion, a third portion that includes the single slot formed in the waveguide, the third portion being coupled with the second portion, a fourth portion that includes another two slots formed in the waveguide, the another two slots branching from the single slot, the fourth portion being coupled with the third portion, and a fifth portion that is configured to output the propagated light, the fifth portion being coupled with the fourth portion. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例描述了用于减少调制器装置的波导中的光损耗的技术和配置。在一个实施例中，一种装置包括衬底和形成在衬底上的调制器装置的波导，该波导具有构造成接收用于沿着波导传播的光的第一部分，第二部分包括形成在波导，其合并成单个槽，所述第二部分与所述第一部分耦合;第三部分，其包括形成在所述波导中的所述单个槽，所述第三部分与所述第二部分联接;第四部分，包括形成的另外两个槽; 在波导中，另外两个狭槽从单个槽分支，第四部分与第三部分耦合，第五部分被配置为输出传播的光，第五部分与第四部分耦合。可以描述和/或要求保护其他实施例。

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