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1. 发明授权

US08480809B2 Methods for application of two-phase contaminant removal medium 有权
标题翻译：两相污染物去除介质的应用方法
公开(公告)号：US08480809B2
公开(公告)日：2013-07-09
申请号：US13351217
申请日：2012-01-16
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/00 , C11D11/00
CPC分类号： B08B3/02 , C11D3/2079 , C11D3/222 , C11D3/37 , C11D3/3707 , C11D3/3723 , C11D3/3753 , C11D3/3765 , C11D3/3773 , C11D3/378 , C11D3/43 , C11D7/265 , C11D7/268 , C11D7/5004 , C11D11/0047 , C11D17/0013 , C11D17/003 , Y10S134/902
摘要： A method is provided for receiving the wafer on a support, the support being configured for movement along a direction. While moving the wafer, dispensing a cleaning material to clean contaminants from the surface of the wafer, the dispensing applied as a film over a diameter length of the wafer. The cleaning material contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound. Each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, and wherein the polymers become soluble in the cleaning liquid and the solubilized polymers having long polymer chains that capture and entrap solid components and contaminants in the cleaning liquid. Then, rinsing the film off of the wafer with a rinsing meniscus. The rinsing meniscus applied along the diameter length of the wafer and the film is rinsed after the dispensing.
摘要翻译：提供了一种用于在支撑件上接收晶片的方法，所述支撑件被配置为沿着方向移动。在移动晶片时，分配清洁材料以清洁来自晶片表面的污染物，分配作为薄膜施加在晶片的直径长度上。清洁材料包含清洁液体，多种固体组分和聚合物的聚合物。多个固体组分和聚合物中的每一种都大于零且小于洗涤材料的3％，并且其中聚合物变得可溶于清洁液体，并且具有长的聚合物链的溶解聚合物捕获并捕获固体组分和污染物清洗液。然后，用冲洗弯液面从晶片上冲洗薄膜。沿着晶片的直径长度施加的冲洗弯月面，并且在分配之后冲洗薄膜。

2. 发明授权

US08601639B2 Apparatus for application of two-phase contaminant removal medium 有权
标题翻译：用于应用两相污染物去除介质的设备
公开(公告)号：US08601639B2
公开(公告)日：2013-12-10
申请号：US13351114
申请日：2012-01-16
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/02
CPC分类号： B08B3/02 , C11D3/2079 , C11D3/222 , C11D3/37 , C11D3/3707 , C11D3/3723 , C11D3/3753 , C11D3/3765 , C11D3/3773 , C11D3/378 , C11D3/43 , C11D7/265 , C11D7/268 , C11D7/5004 , C11D11/0047 , C11D17/0013 , C11D17/003 , Y10S134/902
摘要： An apparatus is provided that includes a substrate support assembly for holding the semiconductor substrate and a dispense head for applying a cleaning material to clean the contaminants from the substrate surface. The dispense head extends across a length of the semiconductor substrate and is positioned proximate to the substrate surface at a distance of between about 0.1 mm and about 4.5 mm. The proximate position enables application of a force to the cleaning material as it is applied to the substrate surface as a film, and the cleaning material provided through the dispense head contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound, each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, the plurality of solid components and the polymers are dispersed for application through the dispense head.
摘要翻译：提供了一种装置，其包括用于保持半导体基板的基板支撑组件和用于施加清洁材料以从基板表面清洁污染物的分配头。分配头延伸穿过半导体衬底的长度，并且以约0.1mm至约4.5mm的距离定位在衬底表面附近。靠近的位置使得当作为薄膜施加到基材表面时能够对清洁材料施加力，并且通过分配头提供的清洁材料含有清洁液体，多种固体组分和聚合物的聚合物多个固体组分和聚合物中的每一个都大于零且小于清洁材料的3％，多个固体组分和聚合物通过分散头分散以供施用。

3. 发明授权

US08227394B2 Composition of a cleaning material for particle removal 有权
标题翻译：用于除尘的清洁材料的组成
公开(公告)号：US08227394B2
公开(公告)日：2012-07-24
申请号：US12267345
申请日：2008-11-07
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： C11D3/26 , C11D3/37 , C11D3/43
CPC分类号： C11D7/5004 , C11D3/222 , C11D3/3765 , C11D3/3773 , C11D3/3776
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. To assist removing of particles from the wafer (or substrate) surfaces, the polymeric compound of the polymers can contain a polar functional group, which can establish polar-polar molecular interaction and hydrogen bonds with hydrolyzed particles on the wafer surface. The polymers of a polymeric compound(s) with a large molecular weight form long polymer chains and network. The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials. The polymeric compound(s) of the polymers may also include a functional group that carries charge in the cleaning solution. The charge of the functional group of the polymers improves the particle removal efficiency.
摘要翻译：本发明的实施例提供用于清洁具有精细特征的图案化衬底的改进材料。清洁材料在清洁具有精细特征的图案化基材上具有优点，而基本上不损坏特征。清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损坏降低在一起。为了帮助从晶片（或衬底）表面去除颗粒，聚合物的聚合物可以含有极性官能团，其可以与晶片表面上的水解颗粒建立极性极性的分子相互作用和氢键。具有大分子量的高分子化合物的聚合物形成长的聚合物链和网络。与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。聚合物的聚合物还可以包括在清洁溶液中携带电荷的官能团。聚合物官能团的电荷提高了颗粒去除效率。

4. 发明授权

US07967019B2 Method and apparatus for removing contaminants from substrate 有权
标题翻译：从基材去除污染物的方法和设备
公开(公告)号：US07967019B2
公开(公告)日：2011-06-28
申请号：US12212579
申请日：2008-09-17
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/00
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.
摘要翻译：将清洁材料施加到基板的表面。清洁材料包括用于捕获存在于基底表面上的污染物的一种或多种聚合物材料。冲洗流体以受控的速度施加到基底的表面，以从衬底的表面去除被清除材料和被污染的清洁材料中的污染物。洗涤流体的受控速度被设定为使得清洁材料在被冲洗流体冲击时以弹性方式表现，从而改善从基材表面去除污染物质。

5. 发明申请

US20100120647A1 COMPOSITION OF A CLEANING MATERIAL FOR PARTICLE REMOVAL 有权
标题翻译：用于颗粒去除的清洁材料的组成
公开(公告)号：US20100120647A1
公开(公告)日：2010-05-13
申请号：US12267345
申请日：2008-11-07
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： C11D3/37
CPC分类号： C11D7/5004 , C11D3/222 , C11D3/3765 , C11D3/3773 , C11D3/3776
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. To assist removing of particles from the wafer (or substrate) surfaces, the polymeric compound of the polymers can contain a polar functional group, which can establish polar-polar molecular interaction and hydrogen bonds with hydrolyzed particles on the wafer surface. The polymers of a polymeric compound(s) with a large molecular weight form long polymer chains and network. The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials. The polymeric compound(s) of the polymers may also include a functional group that carries charge in the cleaning solution. The charge of the functional group of the polymers improves the particle removal efficiency.
摘要翻译：本发明的实施例提供用于清洁具有精细特征的图案化衬底的改进材料。清洁材料在清洁具有精细特征的图案化基材上具有优点，而基本上不损坏特征。清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损坏降低在一起。为了帮助从晶片（或衬底）表面去除颗粒，聚合物的聚合物可以含有极性官能团，其可以与晶片表面上的水解颗粒建立极性极性的分子相互作用和氢键。具有大分子量的高分子化合物的聚合物形成长的聚合物链和网络。与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。聚合物的聚合物还可以包括在清洁溶液中携带电荷的官能团。聚合物官能团的电荷提高了颗粒去除效率。

6. 发明授权

US08758522B2 Method and apparatus for removing contaminants from substrate 有权
标题翻译：从基材去除污染物的方法和设备
公开(公告)号：US08758522B2
公开(公告)日：2014-06-24
申请号：US13115649
申请日：2011-05-25
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/02
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.
摘要翻译：将清洁材料施加到基板的表面。清洁材料包括用于捕获存在于基底表面上的污染物的一种或多种聚合材料。冲洗流体以受控的速度施加到基底的表面，以从衬底的表面去除被清除材料和被污染的清洁材料中的污染物。洗涤流体的受控速度被设定为使得清洁材料在被冲洗流体冲击时以弹性方式表现，从而改善从基材表面去除污染物质。

7. 发明申请

US20120125375A1 Method and Apparatus for Removing Contaminants from Substrate 有权
标题翻译：从基材去除污染物的方法和装置
公开(公告)号：US20120125375A1
公开(公告)日：2012-05-24
申请号：US13115649
申请日：2011-05-25
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/08 , B08B3/02 , B08B3/00
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.
摘要翻译：将清洁材料施加到基板的表面。清洁材料包括用于捕获存在于基底表面上的污染物的一种或多种聚合材料。冲洗流体以受控的速度施加到基底的表面，以从衬底的表面去除被清除材料和被污染的清洁材料中的污染物。洗涤流体的受控速度被设定为使得清洁材料在被冲洗流体冲击时以弹性方式表现，从而改善从基材表面去除污染物质。

8. 发明授权

US08105997B2 Composition and application of a two-phase contaminant removal medium 有权
标题翻译：两相污染物去除介质的组成和应用
公开(公告)号：US08105997B2
公开(公告)日：2012-01-31
申请号：US12267362
申请日：2008-11-07
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： C11D3/37
CPC分类号： B08B3/02 , C11D3/2079 , C11D3/222 , C11D3/37 , C11D3/3707 , C11D3/3723 , C11D3/3753 , C11D3/3765 , C11D3/3773 , C11D3/378 , C11D3/43 , C11D7/265 , C11D7/268 , C11D7/5004 , C11D11/0047 , C11D17/0013 , C11D17/003 , Y10S134/902
摘要： The embodiments provide substrate cleaning techniques to remove contaminants from the substrate surface to improve device yield. The substrate cleaning techniques utilize a cleaning material with solid components and polymers with a large molecular weight dispersed in a cleaning liquid to form the cleaning material, which is fluidic. The solid components remove contaminants on the substrate surface by making contact with the contaminants. The polymers with large molecular weight form polymer chains and a polymeric network that capture and entrap solids in the cleaning materials, which prevent solids from falling on the substrate surface. In addition, the polymers can also assist in removing contaminants form the substrate surface by making contacts with contaminants on the substrate surface. In one embodiment, the cleaning material glides around protruding features on the substrate surface without making a forceful impact on the protruding features to damage them. The present invention can be implemented in numerous ways, including a material (or solution), a method, a process, an apparatus, or a system.
摘要翻译：这些实施例提供了从衬底表面去除污染物以提高器件产量的衬底清洁技术。基板清洗技术利用具有固体组分的清洁材料和分散在清洁液体中的大分子量聚合物以形成流体性的清洁材料。固体组分通过与污染物接触来去除衬底表面上的污染物。具有大分子量的聚合物形成聚合物链和聚合物网络，其捕获并捕获清洁材料中的固体，从而防止固体落在基材表面上。此外，聚合物还可以通过与衬底表面上的污染物接触来帮助从衬底表面去除污染物。在一个实施例中，清洁材料围绕衬底表面上的突出特征滑动，而不会对突出特征造成有力的影响以损坏它们。本发明可以以多种方式实现，包括材料（或解决方案），方法，过程，装置或系统。

9. 发明申请

US20100116290A1 COMPOSITION AND APPLICATION OF A TWO-PHASE CONTAMINANT REMOVAL MEDIUM 有权
标题翻译：两相污染物去除介质的组成和应用
公开(公告)号：US20100116290A1
公开(公告)日：2010-05-13
申请号：US12267362
申请日：2008-11-07
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/08 , C11D17/00
CPC分类号： B08B3/02 , C11D3/2079 , C11D3/222 , C11D3/37 , C11D3/3707 , C11D3/3723 , C11D3/3753 , C11D3/3765 , C11D3/3773 , C11D3/378 , C11D3/43 , C11D7/265 , C11D7/268 , C11D7/5004 , C11D11/0047 , C11D17/0013 , C11D17/003 , Y10S134/902
摘要： The embodiments provide substrate cleaning techniques to remove contaminants from the substrate surface to improve device yield. The substrate cleaning techniques utilize a cleaning material with solid components and polymers with a large molecular weight dispersed in a cleaning liquid to form the cleaning material, which is fluidic. The solid components remove contaminants on the substrate surface by making contact with the contaminants. The polymers with large molecular weight form polymer chains and a polymeric network that capture and entrap solids in the cleaning materials, which prevent solids from falling on the substrate surface. In addition, the polymers can also assist in removing contaminants form the substrate surface by making contacts with contaminants on the substrate surface. In one embodiment, the cleaning material glides around protruding features on the substrate surface without making a forceful impact on the protruding features to damage them. The present invention can be implemented in numerous ways, including a material (or solution), a method, a process, an apparatus, or a system.
摘要翻译：这些实施例提供了从衬底表面去除污染物以提高器件产量的衬底清洁技术。基板清洗技术利用具有固体组分的清洁材料和分散在清洁液体中的大分子量聚合物以形成流体性的清洁材料。固体组分通过与污染物接触来去除衬底表面上的污染物。具有大分子量的聚合物形成聚合物链和聚合物网络，其捕获并捕获清洁材料中的固体，从而防止固体落在基材表面上。此外，聚合物还可以通过与衬底表面上的污染物接触来帮助从衬底表面去除污染物。在一个实施例中，清洁材料围绕衬底表面上的突出特征滑动，而不会对突出特征造成有力的影响以损坏它们。本发明可以以多种方式实现，包括材料（或解决方案），方法，过程，装置或系统。

10. 发明申请

US20090151754A1 Method and Apparatus for Removing Contaminants from Substrate 有权
标题翻译：从基材去除污染物的方法和装置
公开(公告)号：US20090151754A1
公开(公告)日：2009-06-18
申请号：US12212579
申请日：2008-09-17
申请人： Ji Zhu , Arjun Mendiratta , David Mui
发明人： Ji Zhu , Arjun Mendiratta , David Mui
IPC分类号： B08B3/08
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.
摘要翻译：将清洁材料施加到基板的表面。清洁材料包括用于捕获存在于基底表面上的污染物的一种或多种聚合物材料。冲洗流体以受控的速度施加到基底的表面，以从衬底的表面去除被清除材料和被污染的清洁材料中的污染物。洗涤流体的受控速度被设定为使得清洁材料在被冲洗流体冲击时以弹性方式表现，从而改善从基材表面去除污染物质。

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