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    • 10. 发明授权
    • Multi-path, mono-polar co-fired hermetic electrical feedthroughs and methods of fabrication therfor
    • 多路,单极联合密封电馈电及其制造方法
    • US07164572B1
    • 2007-01-16
    • US11227523
    • 2005-09-15
    • Jeremy W. BurdonJoyce K. Yamamoto
    • Jeremy W. BurdonJoyce K. Yamamoto
    • H01G4/35
    • A61N1/3754H01G9/008
    • An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device (IMD) and/or or electrochemical cell. An IMD includes implantable pulse generators, cardioverter-defibrillators, physiologic sensors, drug-delivery systems, etc. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. In some forms of the invention, such assemblies are fabricated by using electrically common, multiply-interconnected electrical pathways including metallized vias and interlayer structures of conductive metallic material within bores and between ceramic layers. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one electrically common embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing electrical communication between internal IMD circuitry and active electrical components and/or circuitry coupled to the exterior of an IMD.
    • 根据本发明的电馈通组件可以用作可植入医疗装置(IMD)和/或电化学电池的组件。 IMD包括植入式脉冲发生器,心律转复除颤器,生理传感器,药物递送系统等。这些组件在施加的偏置电流或电压下需要生物相容性和抗降解性。 在本发明的某些形式中,通过使用电通常的,多重互连的电路径制造这种组件,所述电路径包括在孔内和陶瓷层之间的导电金属材料的金属化通孔和层间结构。 这些层堆叠在一起并烧结以形成具有延伸穿过该结构的至少一个电通常的嵌入金属化通路的基本上单片电介质结构。 金属化路径即使暴露于体液和组织也可靠地传导电信号,并提供内部IMD电路与耦合到IMD外部的有源电气部件和/或电路之间的电气通信。