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1. 发明授权

US07735177B1 Brush core assembly 有权
标题翻译：刷芯组装
公开(公告)号：US07735177B1
公开(公告)日：2010-06-15
申请号：US11351567
申请日：2006-02-10
申请人： Jeffrey J. Farber , Christopher Pena , Edward Orbeta
发明人： Jeffrey J. Farber , Christopher Pena , Edward Orbeta
IPC分类号： H01L21/00
CPC分类号： H01L21/67046
摘要： A brush core for use in cleaning a substrate is provided. The brush core includes an elongated cylinder having a first end and a second end. The first end of the elongated cylinder is configured to receive a drive hub. The second end is configured to receive fluid into an inner cavity of the elongated cylinder. The inner cavity is configured to distribute fluid to a plurality of fluid channels having a first diameter. The plurality of fluid channels are configured to distribute the fluid to corresponding distribution holes having a second diameter. The brush core further including a plurality of non-fluid distributing pockets defined on the outer surface. The corresponding distribution holes and plurality of non-fluid distributing pockets are configured so that a thickness of a solid portion of the brush core is substantially similar. In one embodiment, the first diameter is less than the second diameter.
摘要翻译：提供了用于清洁基板的刷芯。刷芯包括具有第一端和第二端的细长圆筒。细长圆柱体的第一端构造成接收驱动毂。第二端构造成将流体接收到细长圆柱体的内腔中。内腔构造成将流体分配到具有第一直径的多个流体通道。多个流体通道被配置成将流体分配到具有第二直径的相应的分配孔。刷芯还包括限定在外表面上的多个非流体分配袋。相应的分配孔和多个非流体分配袋被构造成使得刷芯的实心部分的厚度基本相似。在一个实施例中，第一直径小于第二直径。

2. 发明授权

US06187684B1 Methods for cleaning substrate surfaces after etch operations 有权
标题翻译：在蚀刻操作之后清洁衬底表面的方法
公开(公告)号：US06187684B1
公开(公告)日：2001-02-13
申请号：US09458550
申请日：1999-12-09
申请人： Jeffrey J. Farber , Allan M. Radman , Helmuth W. Treichel
发明人： Jeffrey J. Farber , Allan M. Radman , Helmuth W. Treichel
IPC分类号： H01L21302
CPC分类号： H01L21/02063
摘要： A method for post plasma etch cleaning a semiconductor wafer is provided. The semiconductor wafer has a plurality of layers formed thereon, and one of the plurality of layers is an oxide layer that has an overlying photoresist mask. The method includes plasma etching a via feature in the oxide layer. The plasma etching is configured to generate a polymer film on sidewalls of the via feature. An ashing operation is then performed to remove the photoresist mask. The method then moves to brush scrubbing the oxide layer and the via feature defined in the oxide layer with first chemicals in a first brush station. Brush scrubbing the oxide layer and the via feature follows with DI water in the first brush station. Then, the oxide layer and the via feature are brush scrubbed with second chemicals in a second brush station. In the same second brush station, the oxide layer and the via feature are scrubbed with DI water. The brush scrubbing in the first and second brush stations is configured to remove the polymer film from the side walls of the via feature.
摘要翻译：提供了用于等离子体蚀刻清洗半导体晶片的方法。半导体晶片具有形成在其上的多个层，并且多个层中的一个层是具有上覆光致抗蚀剂掩模的氧化物层。该方法包括等离子体蚀刻氧化物层中的通孔特征。等离子体蚀刻被配置为在通孔特征的侧壁上产生聚合物膜。然后执行灰化操作以去除光致抗蚀剂掩模。然后该方法移动以在第一电刷站中用第一化学品擦洗在氧化物层中定义的氧化物层和通孔特征。擦洗氧化物层和通孔特征的刷子在第一电刷站中用去离子水进行。然后，氧化物层和通孔特征在第二个电刷站中用第二种化学物质刷洗。在相同的第二刷台中，氧化物层和通孔特征用去离子水洗涤。在第一和第二刷站中的刷洗被配置成从通孔特征的侧壁去除聚合物膜。

3. 发明授权

US08567421B2 Method and system for uniformly applying a multi-phase cleaning solution to a substrate 失效
标题翻译：将多相清洗液均匀地涂布在基材上的方法和系统
公开(公告)号：US08567421B2
公开(公告)日：2013-10-29
申请号：US13028091
申请日：2011-02-15
申请人： Jeffrey J. Farber , Ji Zhu , Carl Woods , John M. de Larios
发明人： Jeffrey J. Farber , Ji Zhu , Carl Woods , John M. de Larios
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , G03F7/423 , H01L21/67057 , Y10S134/902
摘要： An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.
摘要翻译：公开了一种用于向用于清洁表面污染物的基底处理清洁溶液提供力的装置。该装置包括一个施力器和一个门。力施加器构造成被调节到离开衬底表面的第一高度。门被定位成与施力器的拖尾点相邻，并且被配置成被调节到离开衬底表面的第二高度，以便当溶液移动到拖尾点时使清洁溶液平坦化。

4. 发明授权

US06405399B1 Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing 有权
标题翻译：化学机械抛光或等离子体处理后清洗晶片的方法和系统
公开(公告)号：US06405399B1
公开(公告)日：2002-06-18
申请号：US09344671
申请日：1999-06-25
申请人： Jeffrey J. Farber , Julia S. Svirchevski
发明人： Jeffrey J. Farber , Julia S. Svirchevski
IPC分类号： B08B302
CPC分类号： H01L21/67051 , H01L21/67046 , Y10S134/902
摘要： A method and system are provided for cleaning a surface of a semiconductor wafer following a fabrication operation. The system includes a brush box, which has a fluid manifold and at least one nozzle. The nozzle is connected to the fluid manifold by a flexible conduit. The nozzle is configured to spray a liquid onto the surface of the wafer at an application angle and at a fan angle. The application angle is defined between a plane of the surface of the wafer and a spraying plane of the liquid. The fan angle and the application angle are configured such that the spraying liquid covers the surface of the wafer in a quiescent manner.
摘要翻译：提供了用于在制造操作之后清洁半导体晶片的表面的方法和系统。该系统包括具有流体歧管和至少一个喷嘴的刷盒。喷嘴通过柔性导管连接到流体歧管。喷嘴构造成以施加角度和风扇角度将液体喷射到晶片的表面上。应用角度限定在晶片表面的平面和液体的喷射平面之间。风扇角度和施加角度被构造成使得喷射液体以静止的方式覆盖晶片的表面。

5. 发明授权

US07913703B1 Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate 有权
标题翻译：用于均匀地将多相清洗溶液施加到基底的方法和装置
公开(公告)号：US07913703B1
公开(公告)日：2011-03-29
申请号：US11395851
申请日：2006-03-30
申请人： Jeffrey J. Farber , Ji Zhu , Carl Woods , John M. de Larios
发明人： Jeffrey J. Farber , Ji Zhu , Carl Woods , John M. de Larios
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , G03F7/423 , H01L21/67057 , Y10S134/902
摘要： An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.
摘要翻译：公开了一种用于向用于清洁表面污染物的基底处理清洁溶液提供力的装置。该装置包括一个施力器和一个门。力施加器构造成被调节到离开衬底表面的第一高度。门被定位成与施力器的拖尾点相邻，并且被配置成被调节到离开衬底表面的第二高度，以便当溶液移动到拖尾点时使清洁溶液平坦化。

6. 发明申请

US20100294742A1 Modifications to Surface Topography of Proximity Head 审中-公开
标题翻译：接近头表面形貌的修改
公开(公告)号：US20100294742A1
公开(公告)日：2010-11-25
申请号：US12471169
申请日：2009-05-22
申请人： Enrico Magni , Robert J. O'Donnell , Jeffrey J. Farber
发明人： Enrico Magni , Robert J. O'Donnell , Jeffrey J. Farber
IPC分类号： B44C1/22 , H01L21/306
CPC分类号： H01L21/67051 , H01L21/6708
摘要： In an example embodiment, a wet system includes a proximity head and a holder for substrate (e.g., a semiconductor wafer). The proximity head is configured to cause a flow of an aqueous fluid in a meniscus across a surface of the proximity head. The surface of the proximity head interfaces with a surface of a substrate through the flow. The surface of the head is composed of a non-reactive material (e.g., thermoplastic) with modifications as to surface topography that confine, maintain, and/or facilitate the flow. The modifications as to surface topography might be inscribed on the surface with a conical scribe (e.g., with a diamond or SiC tip) or melt printed on the surface using a template. These modifications might produce hemi-wicking or superhydrophobicity. The holder exposes the surface of the substrate to the flow.
摘要翻译：在示例性实施例中，湿式系统包括接近头和用于衬底的保持器（例如，半导体晶片）。邻近头部构造成使得弯液面中的水性流体流过邻近头部的表面。邻近头部的表面通过流动与衬底的表面接合。头部的表面由非反应性材料（例如热塑性材料）组成，其具有限制，维持和/或促进流动的表面形貌的修改。关于表面形貌的修改可以用圆锥划线（例如，用金刚石或SiC尖端）刻在表面上，或者使用模板在表面上熔化印刷。这些修饰可能产生半吸收或超疏水性。保持器将基板的表面暴露于流动。

7. 发明授权

US07452408B2 System and method for producing bubble free liquids for nanometer scale semiconductor processing 有权
标题翻译：用于生产纳米级半导体加工用无气泡液体的系统和方法
公开(公告)号：US07452408B2
公开(公告)日：2008-11-18
申请号：US11173132
申请日：2005-06-30
申请人： Jeffrey J. Farber , Carl Woods
发明人： Jeffrey J. Farber , Carl Woods
IPC分类号： B01D19/00
CPC分类号： B01D19/0068 , B01D19/0042
摘要： A system for producing bubble free liquid includes a continuous liquid source and a de-bubbling chamber. The de-bubbling chamber includes an outlet and an inlet. The inlet coupled to an outlet of the continuous liquid source by a supply pipe. The de-bubbling chamber also includes at least one port in a sidewall of the de-bubbling chamber. The at least one port being at least a length L from the inlet of the de-bubbling chamber. A method for producing bubble free liquid is also described.
摘要翻译：用于生产无气泡液体的系统包括连续液体源和去气泡室。去气室包括出口和入口。入口通过供应管连接到连续液体源的出口。除泡室还包括在除泡室的侧壁中的至少一个端口。所述至少一个端口至少距离去气室的入口长度为L。还描述了一种生产无气泡液体的方法。

8. 发明申请

US20110132400A1 Method and System for Uniformly Applying a Multi-Phase Cleaning Solution to a Substrate 失效
标题翻译：将多相清洗液均匀地涂布在基材上的方法和系统
公开(公告)号：US20110132400A1
公开(公告)日：2011-06-09
申请号：US13028091
申请日：2011-02-15
申请人： Jeffrey J. Farber , Ji Zhu , Carl Woods , John M. de Larios
发明人： Jeffrey J. Farber , Ji Zhu , Carl Woods , John M. de Larios
IPC分类号： B08B7/00 , B08B3/00
CPC分类号： H01L21/67051 , G03F7/423 , H01L21/67057 , Y10S134/902
摘要： An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height to off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.
摘要翻译：公开了一种用于向用于清洁表面污染物的基底处理清洁溶液提供力的装置。该装置包括一个施力器和一个门。力施加器构造成被调节到第一高度以离开衬底的表面。门被定位成与施力器的拖尾点相邻，并且被配置成被调整到离开衬底的表面的第二高度，以便当溶液移动到拖尾点时使清洁溶液平坦化。

9. 发明授权

US07811424B1 Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials 有权
标题翻译：在半导体材料的小体积加工中减少机械共振和改善流体分布
公开(公告)号：US07811424B1
公开(公告)日：2010-10-12
申请号：US11205532
申请日：2005-08-16
申请人： Carl Woods , Jeffrey J. Farber
发明人： Carl Woods , Jeffrey J. Farber
IPC分类号： C25D21/00
CPC分类号： C25D5/06 , C25D17/001
摘要： An apparatus for processing a substrate is provided. The apparatus includes a plating head configured to plate a surface of the substrate with a layer of a material using a fluid meniscus between the plating head and a surface of the substrate. The apparatus also includes a fluid meniscus stabilizing apparatus configured to apply a pre-processing fluid to the surface of the substrate before the fluid meniscus is applied to the surface.
摘要翻译：提供了一种用于处理衬底的设备。所述装置包括电镀头，其被配置为使用在所述电镀头和所述衬底的表面之间的流体弯液面的材料层对所述衬底的表面进行平板化。该装置还包括流体弯液面稳定装置，其配置为在流体弯液面施加到表面之前将预处理流体施加到基板的表面。

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