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    • 8. 发明授权
    • Method for insulating patterns formed in a thin film of oxidizable semi-conducting material
    • 在可氧化半导体材料薄膜中形成绝缘图案的方法
    • US07473588B2
    • 2009-01-06
    • US11291918
    • 2005-12-02
    • Maud VinetJean-Charles BarbeBernard PrevitaliThierry Poiroux
    • Maud VinetJean-Charles BarbeBernard PrevitaliThierry Poiroux
    • H01L21/00
    • H01L21/76202
    • A method for insulating patterns formed in a thin film made of a first oxidizable semi-conducting material, with a thickness less than or equal to 20 nm and preferably less than or equal to 10 nm, successively comprises: formation, on the thin film, of a mask defining, in the thin film, free zones and zones covered by the mask designed to substantially form the patterns, selective formation, at the level of the free zones of the thin film, of an additional layer formed by an oxide of a second semi-conducting material, oxidization of the free zones of the thin film, removal of the mask so as to release the thin film patterned in the form of patterns insulated by oxidized zones. The first and second semi-conducting materials can be identical and the step of selective formation of the additional layer can be performed by selective epitaxial growth of the free zones of the thin film.
    • 一种绝缘图案,其形成在厚度小于或等于20nm,优选小于或等于10nm的第一可氧化半导电材料制成的薄膜中,依次包括:在薄膜上形成, 在薄膜中限定由掩模覆盖的自由区域和设置成基本上形成图案的区域,在薄膜的自由区域的选择性地形成由氧化物形成的附加层 第二半导体材料,氧化薄膜的自由区域,去除掩模,以便释放以氧化区形式绝缘的图案图案化的薄膜。 第一和第二半导体材料可以是相同的,并且选择性地形成附加层的步骤可以通过薄膜的自由区域的选择性外延生长来进行。