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1. 发明授权

US07777329B2 Heatsink apparatus for applying a specified compressive force to an integrated circuit device 有权
标题翻译：用于向集成电路装置施加规定的压缩力的散热装置
公开(公告)号：US07777329B2
公开(公告)日：2010-08-17
申请号：US11460334
申请日：2006-07-27
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.
摘要翻译：提供一种装置，其具有布置在印刷电路板上的集成电路装置和集成电路装置上的散热装置。通过拧紧致动螺钉，弹簧板中的致动螺钉被推靠在散热装置的一部分上。可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且最小接触界面压力。此外，提供了一种方法，其中致动螺钉被紧固，但是防止超过机械约束被紧固。

2. 发明申请

US20090034198A1 APPARATUS AND METHOD FOR ATTACHING HEATSINKS 审中-公开
标题翻译：装置和连接热源的方法
公开(公告)号：US20090034198A1
公开(公告)日：2009-02-05
申请号：US11831135
申请日：2007-07-31
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate.
摘要翻译：一种用于将散热器附接到安装在电路卡组件上的电子模块的装置包括负载框架; 负载臂具有可枢转地联接到负载框架的一端的第一端和构造成容纳至少一部分负载螺钉的第二端; 弹簧板，设置在所述负载框架的一端的相对端，并且构造成螺纹地接收所述负载螺钉，所述弹簧板的相对端被保持，而螺纹接收所述负载螺钉的至少一部分的中间部分是允许向上朝向负载臂的相对端的底部向上弯曲; 以及设置在模块上的散热器。当负载螺钉与弹簧板螺纹接合时，与模块的中心区域对准的负载臂的中间部分将散热器朝向模块偏置。

3. 发明授权

US08456833B2 Fluid cooling system and associated fitting assembly for electronic component 有权
标题翻译：流体冷却系统和相关的电子部件配件组件
公开(公告)号：US08456833B2
公开(公告)日：2013-06-04
申请号：US12917977
申请日：2010-11-02
申请人： Jason R. Eagle
发明人： Jason R. Eagle
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , F28F9/0246 , F28F9/0251 , F28F9/0256 , G06F1/20 , H05K7/20272 , H05K7/20781
摘要： A fluid cooling system and associated fitting assembly for an electronic component such as a multi-processor computer offer easy and reliable connect and disconnect operations while doing so in a minimum amount of available space without damaging associated components of an electronic device, computer or cooling system. One exemplary fitting assembly includes a manifold mount with a port that is in fluid communication with a manifold tube. A fitting is sized and configured to mate with the port and is in fluid communication with associated cooling tubes of a cold plate. A latch is pivotally mounted to the manifold mount for movement to and between a first position in which the latch secures the fitting to the manifold mount and a second position in which the fitting is capable of being disconnected from the manifold mount.
摘要翻译：用于诸如多处理器计算机之类的电子部件的流体冷却系统和相关联的装配组件提供了容易且可靠的连接和断开操作，同时以最小量的可用空间进行，而不损坏电子设备，计算机或冷却系统的相关部件。一个示例性的装配组件包括具有与歧管管流体连通的端口的歧管安装座。配件的尺寸和构造适于与端口配合，并与冷板的相关冷却管流体连通。闩锁枢转地安装到歧管座，用于移动到第一位置和第二位置之间，在第一位置中，闩锁将配件固定到歧管座上，第二位置中配件能够与歧管座安装断开。

4. 发明授权

US07701720B2 Electronic assembly and techniques for installing a heatsink in an electronic assembly 有权
标题翻译：用于在散热器中安装电子组件的电子装配和技术
公开(公告)号：US07701720B2
公开(公告)日：2010-04-20
申请号：US11862848
申请日：2007-09-27
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译：用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。

5. 发明授权

US07488192B1 Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections 有权
标题翻译：在表面安装的互连中最小化尺寸不稳定性和焊料应力的装置和方法
公开(公告)号：US07488192B1
公开(公告)日：2009-02-10
申请号：US11972168
申请日：2008-01-10
申请人： Jason R. Eagle , Joseph P. Kuczynski , Christopher M. Marroquin , Amanda E. Mikhail
发明人： Jason R. Eagle , Joseph P. Kuczynski , Christopher M. Marroquin , Amanda E. Mikhail
IPC分类号： H01R13/62
CPC分类号： H01R43/0256 , H01R12/57 , H01R12/707 , H01R12/714 , H01R13/436 , H01R13/62988 , H05K3/3426 , H05K2201/09136 , H05K2201/10189 , Y02P70/613
摘要： A surface mounted apparatus for use with electrical component interconnections including a planar surface, a slide disposed proximate to the planar surface and being made of a material having a coefficient of thermal expansion (CTE) that is substantially matched to that of a material of the planar surface, the slide being further configured to accommodate solderable contact elements stitched therethrough and soldered to the planar surface, a connector body to support the slide in a cavity defined therein, the cavity being sufficiently large to allow the slide to float in accordance with thermal expansions and contractions of the slide and the planar surface, which respectively occur during solder reflow and subsequent cool-down of the connector assembly.
摘要翻译：一种用于电气部件互连的表面安装装置，包括平面表面，靠近平面表面设置的滑动件，并且由具有与平面材料的材料基本匹配的热膨胀系数（CTE）的材料制成所述滑动件进一步构造成容纳通过其穿过并焊接到所述平面表面的可焊接接触元件，连接器主体，用于将所述滑块支撑在限定在其中的空腔中，所述空腔足够大以允许所述滑块根据热膨胀以及分别在焊料回流和连接器组件的随后冷却期间发生的滑块和平面的收缩。

6. 发明申请

US20120120605A1 IN-LINE MEMORY AND CIRCUIT BOARD COOLING SYSTEM 有权
标题翻译：在线存储器和电路板冷却系统
公开(公告)号：US20120120605A1
公开(公告)日：2012-05-17
申请号：US12944680
申请日：2010-11-11
申请人： Amilcar Arvelo , Jason R. Eagle , Eric A. Eckberg , Gary F. Goth , Katie L. Pizzolato , Scott A. Shurson
发明人： Amilcar Arvelo , Jason R. Eagle , Eric A. Eckberg , Gary F. Goth , Katie L. Pizzolato , Scott A. Shurson
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , G06F1/20
摘要： A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board.
摘要翻译：从串行存储器模块和/或电路板去除热量的系统可以包括一个冷轨，用于接合直列式存储器模块可连接到电路板的位置的直列式存储器模块的每一端，用于从串行内存模块中移除热量的冷轨。该系统还可以包括连接到冷轨的冷板，电路板在冷板和冷轨之间，冷板用于从电路板去除热量。

7. 发明申请

US20090083972A1 Electronic Assembly and Techniques for Installing a Heatsink in an Electronic Assembly 有权
标题翻译：电子组装中安装散热器的电子组装和技术
公开(公告)号：US20090083972A1
公开(公告)日：2009-04-02
申请号：US11862848
申请日：2007-09-27
申请人： John L. Colbert , John S. Corbin, JR. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, JR. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： B23P15/26 , H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译：用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。

8. 发明授权

US08747122B2 Implementing connection of two large electronic boards utilizing LGA interconnect 失效
标题翻译：实现利用LGA互连的两个大型电子板的连接
公开(公告)号：US08747122B2
公开(公告)日：2014-06-10
申请号：US12821312
申请日：2010-06-23
申请人： Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
发明人： Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
IPC分类号： H01R12/00
CPC分类号： H05K3/36 , H01R43/205 , H05K1/141 , H05K3/301 , H05K3/368 , Y10T29/49126
摘要： A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.
摘要翻译：提供一种方法和装置，用于通过多个离散的陆地网格阵列（LGA）实现两个大电路卡的电连接。每个电路卡包括多个LGA位置。第一电路卡包括在第一电路卡的相应LGA位置局部排列的多个LGA插入器。将第二电路卡连接到第一电路卡的板对板连接硬件组件包括细长载体，其限定了容纳耦合到相关联的轴承座的多个负载弹簧的空腔，用于加载和保持LGA位置的平坦度。

9. 发明申请

US20140127915A1 IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LGA INTERCONNECT 失效
标题翻译：利用LGA互连实现两大电子板的连接
公开(公告)号：US20140127915A1
公开(公告)日：2014-05-08
申请号：US12821312
申请日：2010-06-23
申请人： Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
发明人： Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
IPC分类号： H01R12/52 , H05K3/36 , H01R43/20
CPC分类号： H05K3/36 , H01R43/205 , H05K1/141 , H05K3/301 , H05K3/368 , Y10T29/49126
摘要： A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.
摘要翻译：提供一种方法和装置，用于通过多个离散的陆地网格阵列（LGA）实现两个大电路卡的电连接。每个电路卡包括多个LGA位置。第一电路卡包括在第一电路卡的相应LGA位置局部排列的多个LGA插入器。将第二电路卡连接到第一电路卡的板对板连接硬件组件包括细长载体，其限定了容纳耦合到相关联的轴承座的多个负载弹簧的空腔，用于加载和保持LGA位置的平坦度。

10. 发明授权

US08363404B2 Implementing loading and heat removal for hub module assembly 失效
标题翻译：实现轮毂模块组装的加载和除热
公开(公告)号：US08363404B2
公开(公告)日：2013-01-29
申请号：US12967854
申请日：2010-12-14
申请人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
发明人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.
摘要翻译：提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。集线器模块组件包括集线器芯片和多个光学模块，其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金（TSM）LGA上的焊盘网阵列（LGA）组件连接。陶瓷基板通过底表面冶金（BSM）LGA组件连接到电路板。基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐，保持并使光学模块与集线器芯片之间的电连接。

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