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    • 8. 发明申请
    • III-V light emitting device
    • III-V发光装置
    • US20070069225A1
    • 2007-03-29
    • US11237215
    • 2005-09-27
    • Michael KramesNathan GardnerJohn Epler
    • Michael KramesNathan GardnerJohn Epler
    • H01L33/00H01L29/22
    • H01L21/2654H01L21/76254H01L33/0075H01L33/0079H01S5/32341H01S2304/12
    • A semiconductor structure includes an n-type region, a p-type region, and a III-nitride light emitting layer disposed between the n-type region and the p-type region. The III-nitride light emitting layer has a lattice constant greater than 3.19 Å. Such a semiconductor structure may be grown on a substrate including a host and a seed layer bonded to the host. In some embodiments, a bonding layer bonds the host to the seed layer. The seed layer may be thinner than a critical thickness for relaxation of strain in the semiconductor structure, such that strain in the semiconductor structure is relieved by dislocations formed in the seed layer, or by gliding between the seed layer and the bonding layer an interface between the two layers. In some embodiments, the host may be separated from the semiconductor structure and seed layer by etching away the bonding layer.
    • 半导体结构包括设置在n型区域和p型区域之间的n型区域,p型区域和III族氮化物发光层。 III族氮化物发光层的晶格常数大于3.19埃。 这样的半导体结构可以在包含与主体结合的主体和种子层的基板上生长。 在一些实施方案中,结合层将主体结合到种子层。 种子层可以比用于缓和半导体结构中的应变的临界厚度薄,使得半导体结构中的应变由种子层中形成的位错或通过在种子层和结合层之间滑动而消除, 两层。 在一些实施例中,可以通过蚀刻掉粘合层来将主体与半导体结构和种子层分离。