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1. 发明授权

US09095072B2 Multi-die MEMS package 有权
标题翻译：多芯片MEMS封装
公开(公告)号：US09095072B2
公开(公告)日：2015-07-28
申请号：US13821609
申请日：2011-09-16
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： H05K7/00 , H05K1/18 , B81C1/00 , H01L23/48
CPC分类号： B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/07 , B81C1/0023 , H01L23/481 , H01L2224/131 , H01L2924/1461 , H05K1/18 , H01L2924/014 , H01L2924/00
摘要： This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.
摘要翻译：本文件涉及多模微机械系统（MEMS）封装。在一个示例中，多管芯MEMS封装可以包括被配置为耦合到电路板的控制器集成电路（IC），安装到控制器IC的第一侧的MEMS IC，穿过控制器IC的贯穿硅通孔控制器IC的第一侧和第二侧，与第一侧相对的第二侧，并且其中MEMS IC耦合到通过硅通孔。

2. 发明授权

US09856132B2 Sealed packaging for microelectromechanical systems 有权
公开(公告)号：US09856132B2
公开(公告)日：2018-01-02
申请号：US13821589
申请日：2011-09-18
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： B81B3/00 , H01L29/84 , B81C1/00 , B81B7/00
CPC分类号： B81B3/0021 , B81B3/0072 , B81B7/0016 , B81B7/0051 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/0785 , H01L29/84 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/32145 , H01L2224/32245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/15151 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.

3. 发明授权

US09006846B2 Through silicon via with reduced shunt capacitance 有权
标题翻译：通过硅通孔降低分流电容
公开(公告)号：US09006846B2
公开(公告)日：2015-04-14
申请号：US13821612
申请日：2011-09-20
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： H01L29/84 , B81B3/00 , B81B7/00 , H01G7/06
CPC分类号： B81B3/0086 , B81B7/007 , B81B2201/0235 , B81B2207/096 , H01G7/06
摘要： This document refers to apparatus and methods for a device layer of a microelectromechanical system (MEMS) sensor having vias with reduced shunt capacitance. In an example, a device layer can include a substrate having a pair of trenches separated in a horizontal direction by a portion of the substrate, wherein each trench of the pair of trenches includes first and second vertical layers including dielectric, the first and second vertical layers separated by a third vertical layer including polysilicon.
摘要翻译：本文件涉及具有减小的分流电容的通孔的微机电系统（MEMS）传感器的器件层的装置和方法。在一个示例中，器件层可以包括具有一对沟槽的衬底，该衬底具有沿着衬底的一部分在水平方向上分离的一对沟槽，其中该对沟槽的每个沟槽包括包括电介质的第一和第二垂直层，第一和第二垂直层由包括多晶硅的第三垂直层隔开。

4. 发明申请

US20130341737A1 PACKAGING TO REDUCE STRESS ON MICROELECTROMECHANICAL SYSTEMS 有权
标题翻译：包装减少微电子系统的应力
公开(公告)号：US20130341737A1
公开(公告)日：2013-12-26
申请号：US13821586
申请日：2011-09-18
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81B3/0021 , B81B3/0072 , B81B7/0016 , B81B7/0051 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/0785 , H01L29/84 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/32145 , H01L2224/32245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/15151 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit.
摘要翻译：一个示例包括集成电路，其包括设置在细长上的至少一个电互连，远离集成电路的主要部分延伸，以及包括振荡部分的微机电层，微机电层耦合到集成电路的主要部分。

5. 发明申请

US20130270660A1 SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS 有权
标题翻译：密封包装用于微电子系统
公开(公告)号：US20130270660A1
公开(公告)日：2013-10-17
申请号：US13821589
申请日：2011-09-18
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： H01L29/84
CPC分类号： B81B3/0021 , B81B3/0072 , B81B7/0016 , B81B7/0051 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/0785 , H01L29/84 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/32145 , H01L2224/32245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/15151 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.
摘要翻译：一个实例包括集成电路，其包括设置在细长上的至少一个电互连，远离集成电路的主要部分延伸，以及包括振荡部分的微机电层，微机电层耦合到集成电路的主要部分，其中微电子机械层包括一个包括一个延伸到集成电路的膜的盖子。

6. 发明授权

US09156673B2 Packaging to reduce stress on microelectromechanical systems 有权
标题翻译：包装以减轻微机电系统的压力
公开(公告)号：US09156673B2
公开(公告)日：2015-10-13
申请号：US13821586
申请日：2011-09-18
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： H01L23/495 , H01L21/00 , B81B3/00 , H01L29/84 , B81C1/00 , B81B7/00
CPC分类号： B81B3/0021 , B81B3/0072 , B81B7/0016 , B81B7/0051 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/0785 , H01L29/84 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/32145 , H01L2224/32245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/15151 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit.
摘要翻译：一个示例包括集成电路，其包括设置在细长上的至少一个电互连，远离集成电路的主要部分延伸，以及包括振荡部分的微机电层，微机电层耦合到集成电路的主要部分。

7. 发明申请

US20130277773A1 THROUGH SILCON VIA WITH REDUCED SHUNT CAPACITANCE 有权
标题翻译：通过SILCON通过减少分流电容
公开(公告)号：US20130277773A1
公开(公告)日：2013-10-24
申请号：US13821612
申请日：2011-09-20
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： B81B3/00
CPC分类号： B81B3/0086 , B81B7/007 , B81B2201/0235 , B81B2207/096 , H01G7/06
摘要： This document refers to apparatus and methods for a device layer of a microelectromechanical system (MEMS) sensor having vias with reduced shunt capacitance. In an example, a device layer can include a substrate having a pair of trenches separated in a horizontal direction by a portion of the substrate, wherein each trench of the pair of trenches includes first and second vertical layers including dielectric, the first and second vertical layers separated by a third vertical layer including polysilicon.
摘要翻译：本文件涉及具有减小的分流电容的通孔的微机电系统（MEMS）传感器的器件层的装置和方法。在一个示例中，器件层可以包括具有一对沟槽的衬底，该衬底具有沿着衬底的一部分在水平方向上分离的一对沟槽，其中该对沟槽的每个沟槽包括包括电介质的第一和第二垂直层，第一和第二垂直层由包括多晶硅的第三垂直层隔开。

8. 发明申请

US20130250532A1 MULTI-DIE MEMS PACKAGE 有权
公开(公告)号：US20130250532A1
公开(公告)日：2013-09-26
申请号：US13821609
申请日：2011-09-16
申请人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
发明人： Janusz Bryzek , John Gardner Bloomsburgh , Cenk Acar
IPC分类号： H05K1/18
CPC分类号： B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/07 , B81C1/0023 , H01L23/481 , H01L2224/131 , H01L2924/1461 , H05K1/18 , H01L2924/014 , H01L2924/00
摘要： This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.

9. 发明申请

US20130298671A1 FLEXURE BEARING TO REDUCE QUADRATURE FOR RESONATING MICROMACHINED DEVICES 有权
标题翻译：柔性轴承减少用于共振微型设备的平台
公开(公告)号：US20130298671A1
公开(公告)日：2013-11-14
申请号：US13813443
申请日：2011-09-16
申请人： Cenk Acar , John Gardner Bloomsburgh
发明人： Cenk Acar , John Gardner Bloomsburgh
IPC分类号： B81C1/00 , G01C19/56
CPC分类号： B81C1/00523 , G01C19/56 , G01C19/5712
摘要： An example include microelectromechanical die for sensing motion that includes a fixed portion, an anchor coupled to the fixed portion, a first nonlinear suspension member coupled to anchor on a side of the anchor, a second nonlinear suspension member coupled to the anchor on the same side of the anchor, the second nonlinear suspension member having a shape and location mirroring the first nonlinear suspension member about an anchor bisecting plane and a proof-mass that is planar, the proof mass suspended at least in part by the first nonlinear suspension member and the second nonlinear suspension member such that the proof-mass is rotable about the anchor and is slideable in a plane parallel to the fixed portion.
摘要翻译：一个例子包括用于感测运动的微机电模具，其包括固定部分，联接到固定部分的锚固件，联接到锚固件在锚固件侧面上的锚固件的第一非线性悬挂构件，在相同侧面上联接到锚固件的第二非线性悬挂构件所述第二非线性悬挂构件具有形状和位置，所述形状和位置使得所述第一非线性悬挂构件围绕锚平分截面平面化，并且所述第一非线性悬架构件是平面的，所述证明块至少部分地由所述第一非线性悬挂构件悬挂，第二非线性悬挂构件，使得证明物质可绕锚固件旋转，并且可在与固定部分平行的平面中滑动。

10. 发明授权

US09352961B2 Flexure bearing to reduce quadrature for resonating micromachined devices 有权
标题翻译：挠性轴承减少谐振微加工装置的正交
公开(公告)号：US09352961B2
公开(公告)日：2016-05-31
申请号：US13813443
申请日：2011-09-16
申请人： Cenk Acar , John Gardner Bloomsburgh
发明人： Cenk Acar , John Gardner Bloomsburgh
IPC分类号： G01C19/56 , G01C19/5712 , B81C1/00
CPC分类号： B81C1/00523 , G01C19/56 , G01C19/5712
摘要： An example include microelectromechanical die for sensing motion that includes a fixed portion, an anchor coupled to the fixed portion, a first nonlinear suspension member coupled to anchor on a side of the anchor, a second nonlinear suspension member coupled to the anchor on the same side of the anchor, the second nonlinear suspension member having a shape and location mirroring the first nonlinear suspension member about an anchor bisecting plane and a proof-mass that is planar, the proof mass suspended at least in part by the first nonlinear suspension member and the second nonlinear suspension member such that the proof-mass is rotable about the anchor and is slideable in a plane parallel to the fixed portion.
摘要翻译：一个例子包括用于感测运动的微机电模具，其包括固定部分，联接到固定部分的锚固件，联接到锚固件在锚固件侧面上的锚固件的第一非线性悬挂构件，在相同侧面上联接到锚固件的第二非线性悬挂构件所述第二非线性悬挂构件具有形状和位置，所述形状和位置使得所述第一非线性悬挂构件围绕锚平分截面平面化，并且所述第一非线性悬架构件是平面的，所述证明块至少部分地由所述第一非线性悬挂构件悬挂，第二非线性悬挂构件，使得证明物质可绕锚固件旋转，并且可在与固定部分平行的平面中滑动。

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