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    • 6. 发明授权
    • Gate prespacers for high density, high performance DRAMs
    • 用于高密度,高性能DRAM的Gate Prepacers
    • US06326260B1
    • 2001-12-04
    • US09599703
    • 2000-06-22
    • Ramachandra DivakaruniJames William AdkissonMary Elizabeth WeybrightScott HalleJeffrey Peter GambinoHeon Lee
    • Ramachandra DivakaruniJames William AdkissonMary Elizabeth WeybrightScott HalleJeffrey Peter GambinoHeon Lee
    • H01L218242
    • H01L27/10894H01L21/823462H01L27/10873
    • A memory device structure is provided in which the array oxide layer has a thickness that is greater than the thickness of the support oxide layer. Specifically, the structure comprises a semiconductor substrate having a gate oxide layer formed thereon, said substrate including array regions and support regions, said array regions include at least one patterned gate conductor, said patterned gate conductor having a polysilicon layer formed on said gate oxide layer, a conductor material layer formed on said polysilicon layer, and a nitride cap layer formed on said conductor material layer, said nitride cap layer and said conductor material layer having spacers formed on sidewalls thereof and said polysilicon layer having an array oxide layer formed on sidewalls thereof, said spacers being substantially flush with the oxide sidewalls, said support regions include at least one patterned gate conductor, said patterned gate conductor having a polysilicon layer formed on said gate oxide layer, a conductor material layer formed on said polysilicon layer, and a nitride cap layer on said conductor material layer, said polysilicon layer having a support oxide layer formed on sidewalls thereof, wherein said array oxide layer has a thickness that is greater than said support oxide layer.
    • 提供了一种存储器件结构,其中阵列氧化物层的厚度大于支撑氧化物层的厚度。 具体地,该结构包括其上形成有栅极氧化层的半导体衬底,所述衬底包括阵列区域和支撑区域,所述阵列区域包括至少一个图案化栅极导体,所述图案化栅极导体具有形成在所述栅极氧化物层上的多晶硅层 形成在所述多晶硅层上的导体材料层和形成在所述导体材料层上的氮化物覆盖层,所述氮化物覆盖层和所述导体材料层具有形成在其侧壁上的隔离物,并且所述多晶硅层具有形成在侧壁上的阵列氧化物层 所述间隔件与氧化物侧壁基本齐平,所述支撑区域包括至少一个图案化栅极导体,所述图案化栅极导体具有形成在所述栅极氧化物层上的多晶硅层,形成在所述多晶硅层上的导体材料层,以及 所述多晶硅层在所述导体材料层上形成氮化物覆盖层 形成在其侧壁上的支撑氧化物层,其中所述阵列氧化物层的厚度大于所述支撑氧化物层。