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    • 1. 发明授权
    • Method and apparatus to reduce footprint of ESD protection within an integrated circuit
    • 降低集成电路内ESD保护占地面积的方法和装置
    • US08134813B2
    • 2012-03-13
    • US12362471
    • 2009-01-29
    • James KarpRichard C. LiFu-Hing HoMohammed Fakhruddin
    • James KarpRichard C. LiFu-Hing HoMohammed Fakhruddin
    • H02H9/00
    • H01L27/0266
    • An input/output (“I/O”) circuit has a first N-channel metal-oxide semiconductor (“NMOS”) field-effect transistor (“FET”) coupled to the input pin with a silicide block. A first P-channel metal-oxide semiconductor (“PMOS”) FET is directly connected to the input pin, with its N-well electrically coupled to an ESD well bias circuit. An NMOS low-voltage differential signal (“LVDS”) driver is also directly connected to the input pin, and has cascaded NMOS FETs. The first NMOS FET of the LVDS driver is fabricated within a first P-tap guard ring electrically coupled to ground and an N-well guard ring coupled to the ESD well bias. The second NMOS FET of the LVDS driver is fabricated within a second P-tap guard ring electrically coupled to ground.
    • 输入/输出(“I / O”)电路具有用硅化物块耦合到输入引脚的第一N沟道金属氧化物半导体(“NMOS”)场效应晶体管(“FET”)。 第一P沟道金属氧化物半导体(“PMOS”)FET直接连接到输入引脚,其N阱电耦合到ESD阱偏置电路。 NMOS低压差分信号(“LVDS”)驱动器也直接连接到输入引脚,并具有级联的NMOS FET。 LVDS驱动器的第一个NMOS FET制造在电耦合到地的第一P抽头保护环和耦合到ESD阱偏置的N阱保护环上。 LVDS驱动器的第二个NMOS FET在与地耦合的第二个P分接保护环内制造。