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    • 8. 发明授权
    • Oxide semiconductor thin-film transistor
    • 氧化物半导体薄膜晶体管
    • US08841663B2
    • 2014-09-23
    • US13080413
    • 2011-04-05
    • Je-Hun LeeJae-Woo ParkByung-Du AhnSei-Yong ParkJun-Hyun Park
    • Je-Hun LeeJae-Woo ParkByung-Du AhnSei-Yong ParkJun-Hyun Park
    • H01L29/10H01L29/12H01L29/786H01L29/45
    • H01L29/45H01L29/78618H01L29/7869H01L29/78696
    • A thin-film transistor includes a gate electrode, a source electrode, a drain electrode, a gate insulation layer and an oxide semiconductor pattern. The source and drain electrodes include a first metal element with a first oxide formation free energy. The oxide semiconductor pattern has a first surface making contact with the gate insulation layer and a second surface making contact with the source and drain electrodes to be positioned at an opposite side of the first surface. The oxide semiconductor pattern includes an added element having a second oxide formation free energy having an absolute value greater than or equal to an absolute value of the first oxide formation free energy, wherein an amount of the added element included in a portion near the first surface is zero or smaller than an amount of the added element included in a portion near the second surface.
    • 薄膜晶体管包括栅电极,源电极,漏电极,栅极绝缘层和氧化物半导体图案。 源极和漏极包括具有第一氧化物形成自由能的第一金属元件。 氧化物半导体图案具有与栅极绝缘层接触的第一表面和与源极和漏极电极接触以与第一表面相对的第二表面。 氧化物半导体图案包括具有绝对值大于或等于第一氧化物形成自由能的绝对值的第二氧化物形成自由能的添加元素,其中包括在第一表面附近的部分中的添加元素的量 为零或小于包含在靠近第二表面的部分中的添加元素的量。