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1. 发明申请

US20070120234A1 Side view light emitting diode package 审中-公开
标题翻译：侧视发光二极管封装
公开(公告)号：US20070120234A1
公开(公告)日：2007-05-31
申请号：US11603839
申请日：2006-11-24
申请人： Chang Kim , Yoon Han , Young Song , Byung Kim , Jae Roh , Seong Hong
发明人： Chang Kim , Yoon Han , Young Song , Byung Kim , Jae Roh , Seong Hong
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , G02B6/0073 , H01L33/483 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2224/48227 , H01L2224/4554
摘要： A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.
摘要翻译：一种用于背光单元的侧视图LED封装包括具有一倾斜内侧壁的空腔的封装主体，布置在封装主体中的第一和第二引线框架，该封装体的空腔暴露了第一和第二引线框架中的至少一个的一部分，第二引线框架放置在腔的底部到外部，安装在腔的底部上以电连接到第一引线框架和第二引线框架的发光二极管芯片，以及布置在围绕发光二极管的空腔中的透明密封剂芯片。空腔的深度大于发光二极管芯片的安装高度，不超过安装高度的六倍。侧壁的高度被缩短以改善发射光的束角特性，增加光量，并防止侧壁的模制缺陷。

2. 发明申请

US20070018191A1 Side view LED with improved arrangement of protection device 审中-公开
标题翻译：侧视LED具有改进的保护装置布置
公开(公告)号：US20070018191A1
公开(公告)日：2007-01-25
申请号：US11490233
申请日：2006-07-21
申请人： Jae Roh , Seong Hong , Chang Kim , Young Song , Yoon Han
发明人： Jae Roh , Seong Hong , Chang Kim , Young Song , Yoon Han
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , G02B6/0073 , H01L33/62 , H01L2224/48227 , H01L2224/48237 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： A side view LED includes an insulating substrate, and first and second metal layers each having first and second areas spaced apart from each other at a predetermined gap and disposed on top and underside surfaces of the insulating substrate, respectively. First and second electrical connectors are formed in a thickness direction of the insulating substrate, connecting the first area of the first metal layer to that of the second metal layer, and the second area of the first metal layer to that of the second metal layer. An LED chip is mounted on the first metal layer and electrically connected to the first and second areas. Also, a wall part is attached to the first metal layer to form an opened area around the LED chip. A protective device is mounted on an underside surface of the second metal layer and electrically connected to the first and second areas.
摘要翻译：侧视图LED包括绝缘基板，以及第一和第二金属层，每个第一和第二金属层分别具有以预定间隙彼此间隔开的第一和第二区域，并且分别设置在绝缘基板的顶表面和下表面上。第一和第二电连接器形成在绝缘基板的厚度方向上，将第一金属层的第一区域与第二金属层的第一区域连接，将第一金属层的第二区域连接到第二金属层的第二区域。 LED芯片安装在第一金属层上并电连接到第一和第二区域。此外，壁部附接到第一金属层以在LED芯片周围形成开放区域。保护装置安装在第二金属层的下表面上并电连接到第一和第二区域。

3. 发明申请

US20070171673A1 Side view LED package and backlight unit using the same 审中-公开
标题翻译：侧视LED封装和背光单元使用相同
公开(公告)号：US20070171673A1
公开(公告)日：2007-07-26
申请号：US11487966
申请日：2006-07-18
申请人： Young Song , Jae Roh , Seong Hong , Jong Baek , Chang Kim
发明人： Young Song , Jae Roh , Seong Hong , Jong Baek , Chang Kim
IPC分类号： F21V7/04
CPC分类号： G02F1/133615 , G02B6/0028 , G02B6/0031 , G02B6/0043 , G02B6/0055 , G02B6/0073 , G02F1/133603 , H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a side-emission type LED package capable of minimizing light loss to achieve high luminance and to a backlight unit using the same. The LED package includes a lead frame with an electrode formed thereon and a light emitting diode chip disposed on the lead frame. The LED package further includes a body made of molded material surrounding the light emitting diode chip disposed on the lead frame, the body having an asymmetrical shape; and a reflecting part extended from a side of the body to downwardly reflect light emitted from the light emitting diode chip. The reflecting part is extended from the upper edge of the body housing the LED chip to effectively block light from leaking outside, thereby achieving high-luminance emission.
摘要翻译：本发明涉及能够使光损耗最小化以实现高亮度的侧发射型LED封装以及使用其的背光单元。 LED封装包括其上形成有电极的引线框架和设置在引线框架上的发光二极管芯片。所述LED封装还包括由围绕设置在所述引线框架上的所述发光二极管芯片的模制材料制成的主体，所述主体具有不对称形状; 以及从主体的一侧延伸的反射部，向下反射从发光二极管芯片发出的光。反射部从容纳LED芯片的主体的上边缘延伸，以有效地阻挡外界泄漏的光，从而实现高亮度发射。

4. 发明申请

US20070008739A1 Light source-guide structure of backlight apparatus with LED light source inserted into light guide plate and backlight apparatus having the same 审中-公开
标题翻译：具有LED光源的背光装置的光源引导结构插入导光板和具有该导光板的背光装置
公开(公告)号：US20070008739A1
公开(公告)日：2007-01-11
申请号：US11476594
申请日：2006-06-29
申请人： Chang Kim , Jae Roh , Seong Hong , Young Song , Byuna Kim
发明人： Chang Kim , Jae Roh , Seong Hong , Young Song , Byuna Kim
IPC分类号： F21V7/04
CPC分类号： G02B6/0021 , G02B6/0055
摘要： The present invention relates to a light source-guide structure having an LED as a light source and a backlight apparatus having the same. The light source-guide structure includes a light guide plate with grooves formed in a peripheral side thereof and a light source having a transparent package fitted into the groove of the light guide plate with an LED chip inside the transparent package. The structure also includes a wiring substrate for seating the LED chip and reflecting the light from the LED chip to the light guide plate and a reflection layer attached on upper surfaces of the light source and the light guide plate. With the light source inserted into the light guide plate, the loss of light is minimized while the horizontal beam angle of light from the LED is increased, minimizing the peripheral area.
摘要翻译：本发明涉及具有LED作为光源的光源引导结构和具有该光源的引导结构。光源引导结构包括在其周边形成有沟槽的导光板和在透明封装内部具有LED芯片的导光板的槽中装有透明封装的光源。该结构还包括用于放置LED芯片并将来自LED芯片的光反射到导光板的布线基板和安装在光源和导光板的上表面上的反射层。当光源插入导光板中时，光的损失最小化，而来自LED的水平光束角度增加，使周边区域最小化。

5. 发明申请

US20060267040A1 High-brightness LED with protective function of electrostatic discharge damage 审中-公开
标题翻译：高亮度LED，具有静电放电损坏的保护功能
公开(公告)号：US20060267040A1
公开(公告)日：2006-11-30
申请号：US11442957
申请日：2006-05-31
申请人： Jong Baek , Je Park , Geun Ryo , Chang Kim , Jun Seo , Young Song
发明人： Jong Baek , Je Park , Geun Ryo , Chang Kim , Jun Seo , Young Song
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a high-brightness LED with a protective function of electrostatic discharge damage. The high-brightness LED with a protective function of electrostatic discharge damage includes a lead frame that is formed with a pair of anode and cathode leads; a package that is formed of synthetic resin and in which a portion of the lead frame is housed; an LED chip that is mounted on the upper surface of the lead frame inside the package; an electrostatic discharge damage protecting element that is mounted on the lower surface of the lead frame inside the package and is connected parallel to the LED chip through a wire; and a molding material that is filled in the package so as to protect the LED chip.
摘要翻译：本发明涉及具有静电放电损坏保护功能的高亮度LED。具有静电放电损坏保护功能的高亮度LED包括形成有一对阳极和阴极引线的引线框架; 由合成树脂形成并且容纳引线框架的一部分的封装; LED芯片，其安装在封装内的引线框架的上表面上; 静电放电损伤保护元件，其安装在封装内的引线框架的下表面上，并且通过导线平行于LED芯片连接; 以及填充在封装中以保护LED芯片的成型材料。

6. 发明申请

US20060170083A1 Side view LED package having lead frame structure designed to improve resin flow 有权
标题翻译：侧视图LED封装，其引线框结构设计用于改善树脂流动
公开(公告)号：US20060170083A1
公开(公告)日：2006-08-03
申请号：US11319100
申请日：2005-12-28
申请人： Chang Kim , Young Song
发明人： Chang Kim , Young Song
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a side view LED package in use with an LCD backlight unit. The side view LED package comprises: an LED chip; and a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof. The LED chip is mounted on a surface of the lead frame. An integral package body is made of resin, and includes a hollow front half having a cavity for housing the LED chip and a solid rear half divided from the front half by the lead frame. The toothed structure of the lead frame structure can improve resin flow in order to ensure stability even if the LED package is made extremely thin.
摘要翻译：本发明涉及一种与LCD背光单元一起使用的侧视LED封装。侧视LED封装包括：LED芯片; 以及具有形成在其侧边缘中的齿形结构的条形引线框架。 LED芯片安装在引线框架的表面上。一体的包装体由树脂制成，并且包括具有用于容纳LED芯片的空腔的中空前半部和由前框架通过引线框架分隔的实心后半部分。引线框架结构的齿形结构可以改善树脂流动，以确保即使LED封装非常薄的稳定性。

7. 发明申请

US20070158710A1 Low-noise image sensor and transistor for image sensor 审中-公开
标题翻译：低噪声图像传感器和图像传感器晶体管
公开(公告)号：US20070158710A1
公开(公告)日：2007-07-12
申请号：US11633887
申请日：2006-12-05
申请人： Bong Mheen , Mi Kim , Young Song
发明人： Bong Mheen , Mi Kim , Young Song
IPC分类号： H01L31/113 , H01L31/062
CPC分类号： H01L27/14614 , H01L27/14601 , H01L27/14603
摘要： Provided are a low-noise image sensor capable of improving the efficiency of charge transfer from a photodiode to a diffusion node region and effectively suppressing the generation of dark current, and a transistor for the image sensor. The image sensor includes: a photosensitive pixel having a transfer transistor formed in a structure which causes hole accumulation in a part or all regions of a gate oxide; and a sensing control part applying a negative offset potential to the gate during a part or whole of a turn-off period of the transfer transistor. When the transfer transistor is off, the image sensor may form a sufficient barrier and accumulate electrons in the photodiode, and when the transistor is on, the sensor sufficiently lowers a barrier, fully depletes the photodiode before the transfer transistor reaches a threshold voltage, and inactivates a trap in a predetermined region for a certain time, and thus the dark current can be reduced.
摘要翻译：提供了能够提高从光电二极管到扩散节点区域的电荷转移效率并有效抑制暗电流的产生的低噪声图像传感器，以及用于图像传感器的晶体管。图像传感器包括：具有转移晶体管的感光像素，该转移晶体管形成为在栅极氧化物的一部分或全部区域中引起空穴积累的结构; 以及在转移晶体管的关断周期的一部分或全部期间向栅极施加负偏移电位的感测控制部分。当转移晶体管截止时，图像传感器可能形成足够的势垒并在光电二极管中积聚电子，并且当晶体管导通时，传感器充分降低势垒，在转移晶体管达到阈值电压之前完全耗尽光电二极管，使预定区域中的陷阱钝化一定时间，从而可以减小暗电流。

8. 发明申请

US20050115946A1 Radical assisted oxidation apparatus 审中-公开
标题翻译：自由基辅助氧化装置
公开(公告)号：US20050115946A1
公开(公告)日：2005-06-02
申请号：US10817851
申请日：2004-04-06
申请人： Kyu Shim , Young Song , Sang Kim , Nae Lee , Jin Kang
发明人： Kyu Shim , Young Song , Sang Kim , Nae Lee , Jin Kang
IPC分类号： H01L21/205 , F27B5/14 , F27B17/00 , H01L21/00 , H01L21/316 , H01L21/44
CPC分类号： H01L21/67115 , F27B17/0025 , H01L21/02126 , H01L21/02178 , H01L21/02236 , H01L21/02255 , H01L21/02271 , H01L21/31662
摘要： Provided is a radical assisted oxidation apparatus comprising a gas supply system, a radical source, a growth chamber, a load lock chamber, and a vacuum system, whereby it is possible to manufacture a high quality oxide film at a low temperature and improve a low frequency noise (1/f).
摘要翻译：提供了一种自由基辅助氧化装置，其包括气体供给系统，自由基源，生长室，负载锁定室和真空系统，由此可以在低温下制造高质量的氧化物膜并且提高低频率噪声（1 / f）。

9. 发明申请

US20070145645A1 Injection-molding method and apparatus 审中-公开
标题翻译：注射成型方法和装置
公开(公告)号：US20070145645A1
公开(公告)日：2007-06-28
申请号：US11351146
申请日：2006-02-08
申请人： Young Song
发明人： Young Song
IPC分类号： B29C45/00
CPC分类号： B29C45/2673 , B29C45/076 , B29L2031/3437 , B29L2031/466
摘要： Injection-molding method and apparatus. The mold device is composed of a plurality of unit mold devices each of which comprises cassette type molds configured to allow their cores defining a molding space between them to be changed. The unit mold devices are arranged at regular intervals to be opened and closed in a horizontal direction to thereby allow the molded product to freely fall. The unit mold devices sequentially and respectively conduct a mold clamping process, an injection process, a cooling process and an ejection process under the control of control means. Injection means is moved above the unit mold devices in accordance with a preset cycle and time and raised and lowered to be brought into contact with the cores of the unit mold device having conducted the mold clamping process to then inject melted resin and finally obtain a molded product.
摘要翻译：注射成型方法和装置。模具装置由多个单元模具装置组成，每个单元模具装置包括盒型模具，其构造成允许其芯限定它们之间的模制空间。单元模具装置以规则的间隔布置以在水平方向上打开和关闭，从而允许模制品自由下落。单元模具装置在控制装置的控制下依次分别进行模具夹紧过程，注射过程，冷却过程和喷射过程。注射装置按照预设的循环和时间移动到单元模具装置上方，并升高和降低以与进行模具夹紧过程的单元模具装置的芯部接触，然后注入熔融树脂，最后获得模制产品。

10. 发明申请

US20070125616A1 Device for varying stroke of clutch pedal 有权
标题翻译：用于改变离合器踏板行程的装置
公开(公告)号：US20070125616A1
公开(公告)日：2007-06-07
申请号：US11305735
申请日：2005-12-15
申请人： Young Song
发明人： Young Song
IPC分类号： F16D23/12
CPC分类号： F16D25/088 , G05G1/46 , G05G5/04 , Y10T74/20528
摘要： The present invention relates to a device for varying a stroke of a clutch pedal. More particularly, the present invention relates to a device for varying a stroke of a clutch pedal applied to a pedal unit of a clutch system of a manual transmission and varying an effective stroke of a clutch pedal depending on a vehicle speed signal and an engine RPM signal thereby preventing energy collision noise of a driving system.
摘要翻译：本发明涉及一种改变离合器踏板行程的装置。更具体地，本发明涉及一种用于改变应用于手动变速器的离合器系统的踏板单元的离合器踏板的行程的装置，并且根据车速信号和发动机转速改变离合器踏板的有效行程信号，从而防止驱动系统的能量碰撞噪声。

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