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    • 2. 发明申请
    • Semiconductor light emitting diode and method of manufacturing the same
    • 半导体发光二极管及其制造方法
    • US20070267640A1
    • 2007-11-22
    • US11436651
    • 2006-05-19
    • Jae Hoon LeeHee Seok ChoiSeok Beom ChoiJeong Tak OhSu Yeol Lee
    • Jae Hoon LeeHee Seok ChoiSeok Beom ChoiJeong Tak OhSu Yeol Lee
    • H01L33/00
    • H01L33/14H01L33/22H01L33/32H01L33/42H01L2933/0083
    • The present invention relates to a semiconductor light emitting diode. The semiconductor light emitting diode includes a substrate; an n-type nitride semiconductor layer that is formed on the substrate; an active layer that is formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer that is formed on the active layer; a first undoped GaN layer that is formed on the p-type nitride semiconductor layer; an AlGaN layer that is formed on the first undoped GaN layer so as to provide a two-dimensional electron gas layer to the interface with the first undoped GaN layer; a second undoped GaN layer that is formed on the AlGaN layer and has irregularities such that the light generated in the active layer is not internally reflected toward the active layer; a p-type transparent electrode that is formed on the second undoped GaN layer; and an n-type electrode and p-type electrode that are formed to be respectively connected onto the n-type nitride semiconductor layer and the p-type transparent electrode.
    • 本发明涉及一种半导体发光二极管。 半导体发光二极管包括基板; 形成在所述基板上的n型氮化物半导体层; 形成在n型氮化物半导体层上的有源层; 形成在有源层上的p型氮化物半导体层; 在p型氮化物半导体层上形成的第一未掺杂GaN层; AlGaN层,形成在第一未掺杂的GaN层上,以便向与第一未掺杂GaN层的界面提供二维电子气层; 第二未掺杂的GaN层,其形成在AlGaN层上并且具有凹凸,使得在有源层中产生的光不向有源层内部反射; 形成在第二未掺杂GaN层上的p型透明电极; 以及形成为分别连接在n型氮化物半导体层和p型透明电极上的n型电极和p型电极。
    • 3. 发明授权
    • Method of manufacturing vertical GaN-based light emitting diode
    • 制造垂直GaN基发光二极管的方法
    • US07361521B2
    • 2008-04-22
    • US11503944
    • 2006-08-15
    • Jeong Tak OhJae Hoon LeeSeok Beom Choi
    • Jeong Tak OhJae Hoon LeeSeok Beom Choi
    • H01L21/00
    • H01L33/0079H01L33/007
    • The present invention relates to a method of manufacturing a vertical GaN-based LED. The method includes forming an insulating pattern on a substrate to define LED regions having a predetermined size; sequentially stacking an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer on the substrate except for the insulating pattern to form a light emitting structure; removing the insulating pattern to divide the light emitting structure into LED sections having a predetermined size; forming p-electrodes on the LED sections, respectively; forming a structure support layer on the p-electrodes; removing the substrate to expose the divided n-type GaN-based semiconductor layer; and forming n-electrodes on the exposed n-type GaN-based semiconductor layer.
    • 本发明涉及一种制造垂直GaN基LED的方法。 该方法包括在基板上形成绝缘图案以限定具有预定尺寸的LED区域; 在除了绝缘图案之外的衬底上依次堆叠n型GaN基半导体层,有源层和p型GaN基半导体层以形成发光结构; 去除绝缘图案以将发光结构分成具有预定尺寸的LED部分; 分别在LED部分上形成p电极; 在p电极上形成结构支撑层; 去除衬底以暴露分开的n型GaN基半导体层; 在暴露的n型GaN基半导体层上形成n电极。