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    • 2. 发明申请
    • Semiconductor light emitting diode and method of manufacturing the same
    • 半导体发光二极管及其制造方法
    • US20070267640A1
    • 2007-11-22
    • US11436651
    • 2006-05-19
    • Jae Hoon LeeHee Seok ChoiSeok Beom ChoiJeong Tak OhSu Yeol Lee
    • Jae Hoon LeeHee Seok ChoiSeok Beom ChoiJeong Tak OhSu Yeol Lee
    • H01L33/00
    • H01L33/14H01L33/22H01L33/32H01L33/42H01L2933/0083
    • The present invention relates to a semiconductor light emitting diode. The semiconductor light emitting diode includes a substrate; an n-type nitride semiconductor layer that is formed on the substrate; an active layer that is formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer that is formed on the active layer; a first undoped GaN layer that is formed on the p-type nitride semiconductor layer; an AlGaN layer that is formed on the first undoped GaN layer so as to provide a two-dimensional electron gas layer to the interface with the first undoped GaN layer; a second undoped GaN layer that is formed on the AlGaN layer and has irregularities such that the light generated in the active layer is not internally reflected toward the active layer; a p-type transparent electrode that is formed on the second undoped GaN layer; and an n-type electrode and p-type electrode that are formed to be respectively connected onto the n-type nitride semiconductor layer and the p-type transparent electrode.
    • 本发明涉及一种半导体发光二极管。 半导体发光二极管包括基板; 形成在所述基板上的n型氮化物半导体层; 形成在n型氮化物半导体层上的有源层; 形成在有源层上的p型氮化物半导体层; 在p型氮化物半导体层上形成的第一未掺杂GaN层; AlGaN层,形成在第一未掺杂的GaN层上,以便向与第一未掺杂GaN层的界面提供二维电子气层; 第二未掺杂的GaN层,其形成在AlGaN层上并且具有凹凸,使得在有源层中产生的光不向有源层内部反射; 形成在第二未掺杂GaN层上的p型透明电极; 以及形成为分别连接在n型氮化物半导体层和p型透明电极上的n型电极和p型电极。
    • 5. 发明授权
    • Vertical gallium-nitride based light emitting diode
    • 垂直氮化镓基发光二极管
    • US07573076B2
    • 2009-08-11
    • US11634112
    • 2006-12-06
    • Doo Go BaikBang Won OhSeok Beom ChoiSu Yeol Lee
    • Doo Go BaikBang Won OhSeok Beom ChoiSu Yeol Lee
    • H01L33/00
    • H01L33/14H01L33/02H01L33/32
    • A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.
    • 提供了一种垂直GaN基LED及其制造方法。 垂直GaN基LED可以防止与n型电极接触的n型GaN层的损坏,从而稳定地确保n电极的接触电阻。 垂直GaN基LED包括:支承层; 形成在支撑层上的p电极; 形成在p电极上的p型GaN层; 形成在p型GaN层上的有源层; 在有源层上形成用于n型电极接触的n型GaN层; 形成在所述n型GaN层上以暴露所述n型GaN层的一部分的蚀刻停止层; 以及形成在由蚀刻停止层露出的n型GaN层上的n电极。
    • 6. 发明授权
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US07012284B2
    • 2006-03-14
    • US10837780
    • 2004-05-04
    • Seok Beom ChoiBang Won OhHee Seok Choi
    • Seok Beom ChoiBang Won OhHee Seok Choi
    • H01L33/00
    • H01L33/32H01L33/025
    • Disclosed herein is a nitride semiconductor light emitting device. The nitride semiconductor light emitting device comprises an n-type nitride semiconductor layer on a substrate, an active layer formed on the n-type nitride semiconductor layer so that a portion of the n-type nitride semiconductor layer is exposed, a p-type nitride semiconductor layer formed on the active layer, a high-concentration dopant area on the p-type nitride semiconductor layer, a counter doping area on the high-concentration dopant areas, an n-side electrode formed on an exposed portion of the n-type nitride semiconductor layer, and a p-side electrode formed on the counter doping area. A satisfactory ohmic contact for the p-side electrode is provided by an ion implantation process and heat treatment.
    • 这里公开了一种氮化物半导体发光器件。 氮化物半导体发光器件包括在衬底上的n型氮化物半导体层,形成在n型氮化物半导体层上的有源层,以使n型氮化物半导体层的一部分露出,p型氮化物 形成在有源层上的半导体层,p型氮化物半导体层上的高浓度掺杂剂区域,高浓度掺杂剂区域上的相对掺杂区域,形成在n型氮化物半导体层的暴露部分上的n侧电极 氮化物半导体层和形成在反掺杂区域上的p侧电极。 通过离子注入工艺和热处理提供了用于p侧电极的令人满意的欧姆接触。
    • 7. 发明授权
    • Method of manufacturing vertical GaN-based light emitting diode
    • 制造垂直GaN基发光二极管的方法
    • US07361521B2
    • 2008-04-22
    • US11503944
    • 2006-08-15
    • Jeong Tak OhJae Hoon LeeSeok Beom Choi
    • Jeong Tak OhJae Hoon LeeSeok Beom Choi
    • H01L21/00
    • H01L33/0079H01L33/007
    • The present invention relates to a method of manufacturing a vertical GaN-based LED. The method includes forming an insulating pattern on a substrate to define LED regions having a predetermined size; sequentially stacking an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer on the substrate except for the insulating pattern to form a light emitting structure; removing the insulating pattern to divide the light emitting structure into LED sections having a predetermined size; forming p-electrodes on the LED sections, respectively; forming a structure support layer on the p-electrodes; removing the substrate to expose the divided n-type GaN-based semiconductor layer; and forming n-electrodes on the exposed n-type GaN-based semiconductor layer.
    • 本发明涉及一种制造垂直GaN基LED的方法。 该方法包括在基板上形成绝缘图案以限定具有预定尺寸的LED区域; 在除了绝缘图案之外的衬底上依次堆叠n型GaN基半导体层,有源层和p型GaN基半导体层以形成发光结构; 去除绝缘图案以将发光结构分成具有预定尺寸的LED部分; 分别在LED部分上形成p电极; 在p电极上形成结构支撑层; 去除衬底以暴露分开的n型GaN基半导体层; 在暴露的n型GaN基半导体层上形成n电极。