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    • 1. 发明授权
    • Semiconductor device with selectively diffused regions
    • 具有选择性扩散区域的半导体器件
    • US06552414B1
    • 2003-04-22
    • US09331932
    • 1999-08-27
    • Jörg HorzelJozef SzlufcikMia HonoréJohan Nijs
    • Jörg HorzelJozef SzlufcikMia HonoréJohan Nijs
    • H01L29167
    • H01L21/67115H01L21/67109H01L31/022425H01L31/068H01L31/0684H01L31/1804Y02E10/547Y02P70/521
    • The present invention describes a method of manufacturing a semiconductor device, comprising a semiconductor substrate (2) in the shape of a slice, the method comprising the steps of: step 1) selectively applying a pattern of a solids-based dopant source to a first major surface of said semiconducting substrate (2); step 2) diffusing the dopant atoms from said solids-based dopant source into said substrate (2) by a controlled heat treatment step in a gaseous environment surrounding said semi-conducting substrate (2), the dopant from said solids-based dopant source diffusing directly into said substrate (2) to form a first diffusion region (12) and, at the time, diffusing said dopant from said solids-based dopant source indirectly via said gaseous environment into said substrate (2) to form a second diffusion region (15) in at least some areas of said substrate (2) not covered by said pattern; and step 3) forming a metal contact pattern (20) substantially in alignment with said first diffusion region (12) without having etched said second diffusion region (15) substantially.
    • 本发明描述了一种制造半导体器件的方法,包括半导体衬底(2),其形状为切片,该方法包括以下步骤:步骤1)选择性地将基于固体的掺杂剂源的图案施加到第一 所述半导体衬底(2)的主表面; 步骤2)通过在围绕所述半导体衬底(2)的气态环境中的受控热处理步骤将掺杂剂原子从所述基于固体的掺杂剂源扩散到所述衬底(2)中,所述基于固体的掺杂剂源扩散 直接进入所述衬底(2)以形成第一扩散区(12),并且此时将所述掺杂剂从所述固体基掺杂剂源经由所述气态环境间接扩散到所述衬底(2)中以形成第二扩散区( 15)在所述衬底(2)的至少一些未被所述图案覆盖的区域中; 和步骤3)形成基本上与所述第一扩散区域(12)对准的金属接触图案(20),而没有基本上蚀刻所述第二扩散区域(15)。
    • 2. 发明授权
    • Semiconductor device with selectively diffused regions
    • 半导体器件具有选择性扩散区域
    • US06825104B2
    • 2004-11-30
    • US10353261
    • 2003-01-27
    • Jörg HorzelJozef SzlufcikMia HonoréJohan Nijs
    • Jörg HorzelJozef SzlufcikMia HonoréJohan Nijs
    • H01L2122
    • H01L21/67115H01L21/67109H01L31/022425H01L31/068H01L31/0684H01L31/1804Y02E10/547Y02P70/521
    • The present invention describes a method of manufacturing a semiconductor device, comprising a semiconductor substrate in the shape of a slice, the method comprising the steps of: step 1) selectively applying a pattern of a solids-based dopant source to a first major surface of said semiconducting substrate; step 2) diffusing the dopant atoms from said solids-based dopant source into said substrate by a controlled heat treatment step in a gaseous environment surrounding said semi-conducting substrate, the dopant from said solids-based dopant source diffusing directly into said substrate to form a first diffusion region and, at the same time, diffusing said dopant from said solids-based dopant source indirectly via said gaseous environment into said substrate to form a second diffusion region in at least some areas of said substrate to form a second diffusion region in at least some areas of said substrate not covered by said pattern; and step 3) forming a metal contact pattern substantially in alignment with said first diffusion region without having etched said second diffusion region substantially.
    • 本发明描述了一种半导体器件的制造方法,包括半导体衬底形状,该方法包括以下步骤:步骤1)选择性地将基于固体的掺杂剂源的图案施加到第一主表面 所述半导体衬底; 步骤2)通过在围绕所述半导体衬底的气态环境中的受控热处理步骤将掺杂剂原子从所述基于固体的掺杂剂源扩散到所述衬底中,所述基于固体的掺杂剂源的掺杂剂直接扩散到所述衬底中以形成 第一扩散区域,并且同时将所述掺杂剂从所述基于固体的掺杂剂源经由所述气态环境扩散到所述衬底中,以在所述衬底的至少一些区域中形成第二扩散区域,以形成第二扩散区域 所述衬底的至少一些区域不被所述图案覆盖; 和步骤3)形成基本上与所述第一扩散区域对准的金属接触图案,而基本上没有蚀刻所述第二扩散区域。
    • 3. 发明授权
    • Furnace for continuous, high throughput diffusion processes from various diffusion sources
    • 用于来自各种扩散源的连续,高通量扩散过程的炉
    • US06251756B1
    • 2001-06-26
    • US09614643
    • 2000-07-12
    • Jörg HorzelJozef SzlufcikJohan Nijs
    • Jörg HorzelJozef SzlufcikJohan Nijs
    • H01L2104
    • H01L21/67173H01L21/67109H01L21/67115H01L21/67236Y10S438/907
    • An open apparatus is described for the processing of planar thin semiconductor substrates, particularly for the processing of solar cells. The apparatus includes a first zone for the drying and burn-out of organic components from solid or liquid based dopant sources pre-applied to the substrates. The zone is isolated from the remaining zones of the apparatus by an isolating section to prevent cross-contamination between burn-out zone and the remaining processing zones. All the zones of the apparatus may be formed from a quartz tube around which heaters are placed for raising the temperature inside the quartz tube. Each zone may be purged with a suitable mixture of gases, e.g. inert gases such as argon, as well as oxygen and nitrogen. The zones may also be provided with gaseous dopants such as POCl3 and the present invention includes the sequential diffusion of more than one dopant into the substrates. Some of the zones may be used for driving-in the dopants alternatively, for other processes, e.g. oxidation. The present invention also includes a method of operating the apparatus and the use of the apparatus in processing solar cells.
    • 描述了用于处理平面薄型半导体衬底,特别是用于太阳能电池的处理的开放式设备。 该装置包括用于从预先施加到基底的固体或液体基础的掺杂剂源干燥和燃尽有机成分的第一区域。 该区域通过隔离部分与设备的其余区域隔离,以防止燃尽区域和其余处理区域之间的交叉污染。 设备的所有区域可以由石英管形成,在该石英管周围放置加热器以提高石英管内部的温度。 每个区域可以用合适的气体混合物吹扫,例如, 惰性气体如氩气,以及氧气和氮气。 这些区域还可以设置有气体掺杂剂例如POCl 3,本发明包括多于一种掺杂剂顺序扩散到衬底中。 一些区域可以用于驱动掺杂剂,或者用于其它工艺,例如, 氧化。 本发明还包括操作该装置的方法以及该装置在处理太阳能电池中的用途。
    • 5. 发明授权
    • Furnace for continuous, high throughput diffusion processes from various
diffusion sources
    • 用于来自各种扩散源的连续,高通量扩散过程的炉
    • US6117266A
    • 2000-09-12
    • US64648
    • 1998-04-22
    • Jorg HorzelJozef SzlufcikJohan Nijs
    • Jorg HorzelJozef SzlufcikJohan Nijs
    • H01L21/00A23F1/02H05B3/02
    • H01L21/67173H01L21/67109H01L21/67115H01L21/67236Y10S438/907
    • An open apparatus is described for the processing of planar thin semiconductor substrates, particularly for the processing of solar cells. The apparatus includes a first zone for the drying and burn-out of organic components from solid or liquid based dopant sources pre-applied to the substrates. The zone is isolated from the remaining zones of the apparatus by an isolating section to prevent cross-contamination between burn-out zone and the remaining processing zones. All the zones of the apparatus may be formed from a quartz tube around which heaters are placed for raising the temperature inside the quartz tube. Each zone may be purged with a suitable mixture of gases, e.g. inert gases such as argon, as well as oxygen and nitrogen. The zones may also be provided with gaseous dopants such as POCl.sub.3 and the present invention includes the sequential diffusion of more than one dopant into the substrates. Some of the zones may be used for driving-in the dopants alternatively, for other processes, e.g. oxidation. The present invention also includes a method of operating the apparatus and the use of the apparatus in processing solar cells.
    • 描述了用于处理平面薄型半导体衬底,特别是用于太阳能电池的处理的开放式设备。 该装置包括用于从预先施加到基底的固体或液体基础的掺杂剂源干燥和燃尽有机成分的第一区域。 该区域通过隔离部分与设备的其余区域隔离,以防止燃尽区域和其余处理区域之间的交叉污染。 设备的所有区域可以由石英管形成,在该石英管周围放置加热器以提高石英管内的温度。 每个区域可以用合适的气体混合物吹扫,例如, 惰性气体如氩气,以及氧气和氮气。 这些区域还可以设置有气体掺杂剂例如POCl 3,本发明包括多于一种掺杂剂顺序扩散到衬底中。 一些区域可以用于驱动掺杂剂,或者用于其它工艺,例如, 氧化。 本发明还包括操作该装置的方法以及该装置在处理太阳能电池中的用途。