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    • 3. 发明申请
    • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20090246932A1
    • 2009-10-01
    • US12412962
    • 2009-03-27
    • Isao KAMIOKAJunichi SHIOZAWARyu KATOYoshio OZAWA
    • Isao KAMIOKAJunichi SHIOZAWARyu KATOYoshio OZAWA
    • H01L21/764H01L21/28
    • H01L29/7881H01L21/76208H01L27/11521H01L29/66825
    • A method of manufacturing a semiconductor device according to an embodiment of the present invention includes forming, on a surface of a semiconductor substrate, an isolation trench including sidewall parts and a bottom part, or a stepped structure including a first planar part, a second planar part, and a step part located at a boundary between the first planar part and the second planar part, and supplying oxidizing ions or nitriding ions contained in plasma generated by a microwave, a radio-frequency wave, or electron cyclotron resonance to the sidewall parts and the bottom part of the isolation trench or the first and second planar parts and the step part of the stepped structure by applying a predetermined voltage to the semiconductor substrate, to perform anisotropic oxidation or anisotropic nitridation of the sidewall parts and the bottom part of the isolation trench or the first and second planar parts and the step part of the stepped structure.
    • 根据本发明实施例的制造半导体器件的方法包括在半导体衬底的表面上形成包括侧壁部分和底部的隔离沟槽,或者包括第一平面部分,第二平面部分 部分和位于第一平面部分和第二平面部分之间的边界处的阶梯部分,并且将由微波产生的等离子体中产生的等离子体中的氧离子或氮化离子,射频波或电子回旋共振提供给侧壁部分 以及通过向半导体衬底施加预定电压来隔离沟槽的底部或第一和第二平面部分和台阶部分的台阶部分,以进行侧壁部分和底部部分的各向异性氧化或各向异性氮化 隔离沟槽或第一和第二平面部分以及台阶结构的阶梯部分。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20090261403A1
    • 2009-10-22
    • US12406841
    • 2009-03-18
    • Katsuyuki SEKINEYoshio OZAWA
    • Katsuyuki SEKINEYoshio OZAWA
    • H01L29/792H01L21/28
    • H01L29/792H01L21/28282H01L29/513H01L29/66833
    • A semiconductor device includes a memory cell transistor including a first lower insulating film provided on a semiconductor substrate, a first intermediate insulating film provided on the first lower insulating film, a first upper insulating film provided on the first intermediate insulating film, and a first gate electrode provided on the first upper insulating film, and a select transistor including a second lower insulating film provided on the semiconductor substrate, a second intermediate insulating film provided on the second lower insulating film, a second upper insulating film provided on the second intermediate insulating film, and a second gate electrode provided on the second upper insulating film, wherein trap density of the second intermediate insulating film is lower than that of the first intermediate insulating film.
    • 半导体器件包括存储单元晶体管,其包括设置在半导体衬底上的第一下绝缘膜,设置在第一下绝缘膜上的第一中间绝缘膜,设置在第一中间绝缘膜上的第一上绝缘膜和第一栅极 设置在第一上绝缘膜上的电极和设置在半导体衬底上的第二下绝缘膜的选择晶体管,设置在第二下绝缘膜上的第二中间绝缘膜,设置在第二中间绝缘膜上的第二上绝缘膜 以及设置在第二上绝缘膜上的第二栅电极,其中第二中间绝缘膜的阱密度低于第一中间绝缘膜的陷阱密度。
    • 7. 发明申请
    • NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    • 非易失性存储器件及其制造方法
    • US20110175048A1
    • 2011-07-21
    • US13004287
    • 2011-01-11
    • Katsuyuki SEKINERyota FUJITSUKAYoshio OZAWA
    • Katsuyuki SEKINERyota FUJITSUKAYoshio OZAWA
    • H01L45/00H01L21/02
    • H01L45/1273H01L27/2409H01L27/2481H01L45/08H01L45/1226H01L45/1233H01L45/146H01L45/16
    • According to one embodiment, a nonvolatile memory device includes first and second conductive layers, a resistance change layer, and a rectifying element. The first conductive layer has first and second major surfaces. The second conductive layer has third and fourth major surfaces, a side face, and a corner part. The third major surface faces the first major surface and includes a plane parallel to the first major face and is provided between the fourth and first major surfaces. The corner part is provided between the third major surface and the side face. The corner part has a curvature higher than that of the third major surface. The resistance change layer is provided between the first and second conductive layers. The rectifying element faces the second major surface of the first conductive layer. An area of the third major surface is smaller than that the second major surface.
    • 根据一个实施例,非易失性存储器件包括第一和第二导电层,电阻变化层和整流元件。 第一导电层具有第一和第二主表面。 第二导电层具有第三和第四主表面,侧面和拐角部分。 第三主表面面向第一主表面并且包括平行于第一主面的平面,并且设置在第四主表面和第一主表面之间。 角部设置在第三主表面和侧面之间。 角部具有高于第三主表面的曲率。 电阻变化层设置在第一和第二导电层之间。 整流元件面向第一导电层的第二主表面。 第三主表面的面积小于第二主表面的面积。