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    • 10. 发明申请
    • BIPOLAR DEVICE HAVING A MONOCRYSTALLINE SEMICONDUCTOR INTRINSIC BASE TO EXTRINSIC BASE LINK-UP REGION
    • 具有单晶半导体内部基极到极端基底连接区的双极器件
    • US20140361300A1
    • 2014-12-11
    • US13914707
    • 2013-06-11
    • International Business Machines Corporation
    • Renata A. Camillo-CastilloVibhor JainVikas K. KaushalMarwan H. Khater
    • H01L29/10H01L29/66H01L29/737
    • H01L29/1004H01L29/0653H01L29/66242H01L29/66272H01L29/732H01L29/7371
    • Disclosed are bipolar devices, which incorporate an entirely monocrystalline link-up region between the intrinsic and extrinsic base layers, and methods of forming the devices. In the methods, a selective epitaxial deposition process grows monocrystalline semiconductor material for the extrinsic base layer on an exposed edge portion of a monocrystalline section of an intrinsic base layer. This deposition process is continued to intentionally overgrow the monocrystalline semiconductor material until it grows laterally and essentially covers a dielectric landing pad on a center portion of that same monocrystalline section of the intrinsic base layer. Subsequently, an opening is formed through the extrinsic base layer to the dielectric landing pad and the dielectric landing pad is selectively removed, thereby exposing monocrystalline surfaces only of the intrinsic and extrinsic base layers. A semiconductor layer is then formed by epitaxial deposition on the exposed monocrystalline surfaces, thereby forming the entirely monocrystalline link-up region.
    • 公开了双极器件,其在内部和外部基极层之间并入完整的单晶连接区域,以及形成器件的方法。 在该方法中,选择性外延沉积工艺在本征基底层的单晶部分的暴露边缘部分上生长外部基极层的单晶半导体材料。 该沉积过程继续有意地过度生长单晶半导体材料,直到其横向生长并且基本上覆盖本征基层的相同单晶部分的中心部分上的电介质着陆焊盘。 随后,通过外部基极层形成开口到电介质接合焊盘,并且选择性地去除电介质着陆焊盘,从而仅暴露出本征和外部基极层的单晶表面。 然后通过外延沉积在暴露的单晶表面上形成半导体层,从而形成完全单晶连接区域。