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1. 发明申请

US20150162097A1 Method for performing built-in self-tests and electronic circuit 有权
标题翻译：执行内置自检和电子电路的方法
公开(公告)号：US20150162097A1
公开(公告)日：2015-06-11
申请号：US14527352
申请日：2014-10-29
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Martin Eckert , Otto Torreiter , Christian Zoelin
IPC分类号： G11C29/12
CPC分类号： G11C29/12015 , G01R31/2856 , G01R31/3004 , G01R31/31701 , G01R31/31721 , G01R31/3187 , G06F1/3275 , G06F1/3287 , G06F11/1068 , G06F11/2236 , G06F11/27 , G11C29/26 , G11C29/50 , G11C2029/0401 , G11C2029/2602 , G11C2029/3202 , G11C2029/3602
摘要： The invention relates to a method for performing an array built-in self-test (ABIST) on an electronic circuit (100), the electronic circuit (100) comprising a memory (110) with at least two memory arrays (111-115) and at least two array built-in self-test engines (116-120), wherein each automatic built-in self-test engine (116-120) is associated with a different memory array (111-115) and wherein each array built-in self-test engine (116-120) is associated with a programmable delay unit (DU1-DU5), the method comprising the following steps:determine at least one delay value (dn), the delay value (dn) corresponding to an array built-in self-test engine (116-120) and the delay value (dn) depending on the execution time (tdn) for testing the memory array (111-115) associated with the array built-in self-test engine (116-120); provide the at least one delay value (dn) to the programmable delay unit (DU1-DU5); and delay the start of the array built-in self-test engine (116-120) depending on the respective delay value (dn).
摘要翻译：本发明涉及一种用于在电子电路（100）上执行阵列内置自检（ABIST）的方法，所述电子电路（100）包括具有至少两个存储器阵列（111-115）的存储器（110）和至少两个阵列内置自检引擎（116-120），其中每个自动内置自检引擎（116-120）与不同的存储器阵列（111-115）相关联，并且其中每个阵列被构建 - 自检引擎（116-120）与可编程延迟单元（DU1-DU5）相关联，所述方法包括以下步骤：确定至少一个延迟值（dn），对应于阵列内置自检引擎（116-120）和延迟值（dn），这取决于用于测试与阵列内置自检引擎相关联的存储器阵列（111-115）的执行时间（tdn） 116-120）; 向所述可编程延迟单元（DU1-DU5）提供所述至少一个延迟值（dn）; 并根据相应的延迟值（dn）延迟阵列内置自检引擎（116-120）的启动。

2. 发明授权

US09977053B2 Wafer probe alignment 有权
公开(公告)号：US09977053B2
公开(公告)日：2018-05-22
申请号：US15176681
申请日：2016-06-08
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Joerg G. Appinger , Eberhard Dengler , Roland Dieterle , Martin Eckert , Gabriele Kuczera , Siegfried Tomaschko , Otto Torreiter , Quintino Lorenzo Trianni
IPC分类号： G01R1/067 , G01R1/073 , G01R31/28
CPC分类号： G01R1/06794 , G01R1/07307 , G01R31/2887 , G01R31/2891
摘要： A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.

3. 发明授权

US09686895B2 Chip attach frame 有权
公开(公告)号：US09686895B2
公开(公告)日：2017-06-20
申请号：US14017311
申请日：2013-09-04
申请人： International Business Machines Corporation
发明人： Martin Eckert , Otto Torreiter , Quintino L. Trianni
IPC分类号： H05K13/04 , H01L23/00 , G01R1/04
CPC分类号： H01L24/75 , G01R1/0466 , G01R1/0483 , H01L21/4853 , H01L21/67144 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/75316 , H01L2224/75501 , H01L2224/757 , H01L2224/75754 , H01L2224/75756 , H01L2224/759 , H01L2224/81121 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H05K13/0413 , Y10T29/53178 , H01L2924/00014 , H01L2924/014 , H01L2924/00012
摘要： A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

4. 发明授权

US10056346B2 Chip attach frame 有权
公开(公告)号：US10056346B2
公开(公告)日：2018-08-21
申请号：US15437015
申请日：2017-02-20
申请人： International Business Machines Corporation
发明人： Martin Eckert , Otto Torreiter , Quintino L. Trianni
IPC分类号： H05K13/08 , H01L23/00 , H01L21/67 , H01L21/48 , G01R1/04
CPC分类号： H01L24/75 , G01R1/0466 , G01R1/0483 , H01L21/4853 , H01L21/67144 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/75316 , H01L2224/75501 , H01L2224/757 , H01L2224/75754 , H01L2224/75756 , H01L2224/759 , H01L2224/81121 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , Y10T29/53178 , H01L2924/00014 , H01L2924/014 , H01L2924/00012
摘要： A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

5. 发明授权

US09927463B2 Wafer probe alignment 有权
公开(公告)号：US09927463B2
公开(公告)日：2018-03-27
申请号：US14887510
申请日：2015-10-20
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Joerg G. Appinger , Eberhard Dengler , Roland Dieterle , Martin Eckert , Gabriele Kuczera , Siegfried Tomaschko , Otto Torreiter , Quintino Lorenzo Trianni
IPC分类号： G01R1/067 , G01R1/073 , G01R31/28
CPC分类号： G01R1/06794 , G01R1/07307 , G01R31/2887 , G01R31/2891
摘要： A water probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.

6. 发明申请

US20170162534A1 CHIP ATTACH FRAME 审中-公开
公开(公告)号：US20170162534A1
公开(公告)日：2017-06-08
申请号：US15437015
申请日：2017-02-20
申请人： International Business Machines Corporation
发明人： Martin Eckert , Otto Torreiter , Quintino L. Trianni
IPC分类号： H01L23/00 , H01L21/48 , H01L21/67
CPC分类号： H01L24/75 , G01R1/0466 , G01R1/0483 , H01L21/4853 , H01L21/67144 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/75316 , H01L2224/75501 , H01L2224/757 , H01L2224/75754 , H01L2224/75756 , H01L2224/759 , H01L2224/81121 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H05K13/0413 , Y10T29/53178 , H01L2924/00014 , H01L2924/014 , H01L2924/00012
摘要： A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

7. 发明申请

US20150201537A9 CHIP ATTACH FRAME 有权
公开(公告)号：US20150201537A9
公开(公告)日：2015-07-16
申请号：US14017311
申请日：2013-09-04
申请人： International Business Machines Corporation
发明人： Martin Eckert , Otto Torreiter , Quintino L. Trianni
IPC分类号： H05K13/04
CPC分类号： H01L24/75 , G01R1/0466 , G01R1/0483 , H01L21/4853 , H01L21/67144 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/75316 , H01L2224/75501 , H01L2224/757 , H01L2224/75754 , H01L2224/75756 , H01L2224/759 , H01L2224/81121 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H05K13/0413 , Y10T29/53178 , H01L2924/00014 , H01L2924/014 , H01L2924/00012
摘要： A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

8. 发明申请

US20150059166A1 CHIP ATTACH FRAME 有权
标题翻译：芯片连接框架
公开(公告)号：US20150059166A1
公开(公告)日：2015-03-05
申请号：US14017311
申请日：2013-09-04
申请人： International Business Machines Corporation
发明人： Martin Eckert , Otto Torreiter , Quintino L. Trianni
IPC分类号： H05K13/04
CPC分类号： H01L24/75 , G01R1/0466 , G01R1/0483 , H01L21/4853 , H01L21/67144 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/75316 , H01L2224/75501 , H01L2224/757 , H01L2224/75754 , H01L2224/75756 , H01L2224/759 , H01L2224/81121 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H05K13/0413 , Y10T29/53178 , H01L2924/00014 , H01L2924/014 , H01L2924/00012
摘要： A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.
摘要翻译：芯片连接框架用于将集成电路芯片的引脚与芯片载体上的焊盘对齐。框架块具有限定形成参考角的两个对齐边缘的套筒。芯片下降到插座中，芯片载体倾斜，同时支撑框架块和芯片，直到芯片在重力作用下移动到参考角。一旦位于参考角处，通过在x和y方向上移动框架块来仔细调整芯片位置，直到引脚与焊盘对准。框架块被弹簧偏压以防止在x和y方向上移动，并且使用指旋螺钉来调节框架块的位置。一旦引脚与焊盘对准，就可以使用柱塞机构来固定集成电路芯片与芯片载体的强制接合。

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