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1. 发明申请

US20030017648A1 Panel structure with plurality of chip compartments for providing high volume of chip modules 失效
公开(公告)号：US20030017648A1
公开(公告)日：2003-01-23
申请号：US10246045
申请日：2002-09-17
申请人： International Business Machines Corporation
发明人： Mark V. Pierson
IPC分类号： H01L021/44 , H01L021/48 , H01L021/301
CPC分类号： H01L24/97 , H01L23/5385 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00
摘要： A method of forming a plurality of individual semiconductor chip modules wherein a plurality of chips are placed in a plurality of chip compartments formed by adhering a support panel to the first surface and a cover panel to the second surface of a stiffener panel having openings defining sidewalls of the chip compartments. The resulting laminated panel structure is then cut into a plurality of modules each having at least one compartment containing at least one chip. Each chip is electrically connected to interior conductive pads on the inner surface of the support panel, and these interior pads in turn are connected by conductive paths to exterior conductive terminals deposited on the outer surface of the support panel. The electrical connections between the chip and the interior conductive pads of the support panel may be encapsulated in a polymeric material before the cover panel is adhered to the stiffener panel.

2. 发明申请

US20030128518A1 Common heatsink for multiple chips and modules 有权
公开(公告)号：US20030128518A1
公开(公告)日：2003-07-10
申请号：US10040779
申请日：2002-01-07
申请人： International Business Machines Corporation
发明人： Michael A. Gaynes , Howard Victor Mahaney JR. , Mark V. Pierson
IPC分类号： H05K007/20
CPC分类号： H01L23/3675 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , Y10T29/4935
摘要： A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables positioning of a common heatsink for multiple chips and modules for electronic packages facilitating the formation of x, y and z-directional compliant thermal interfaces intermediate a plurality of chips and a common heatsink with minimized effects of package tolerances.

3. 发明申请

US20030127499A1 Low or no-force bump flattening structure and method 失效
标题翻译：低或无力凸起平整结构和方法
公开(公告)号：US20030127499A1
公开(公告)日：2003-07-10
申请号：US10040740
申请日：2002-01-07
申请人： International Business Machines Corporation
发明人： Mark V. Pierson , Ajit K. Trivedi
IPC分类号： B23K035/12
CPC分类号： H05K3/3436 , B23K26/0006 , B23K26/361 , B23K2101/42 , B23K2103/16 , H01L23/49816 , H01L24/81 , H01L2224/13111 , H01L2224/16 , H01L2224/81026 , H01L2224/81136 , H01L2224/81193 , H01L2224/814 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01076 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H05K3/3457 , H05K2201/09745 , H05K2201/10992 , H05K2203/0278 , H05K2203/048 , Y02P70/613 , H01L2924/00
摘要： Self-aligning combination of a substrate with a chip is provided, using reverse patterns of raised recesses and raised shapes on the respective substrate and chip surfaces. High-force contact bump production is avoided. Reliable contact between a chip and substrate is achieved, with minimized skewing after chip placement.
摘要翻译：提供了基板与芯片的自对准组合，在相应的基板和芯片表面上使用凸起凹槽和凸起形状的反向图案。避免了大力接触凸块生产。实现芯片和基板之间的可靠接触，并且在芯片放置之后使偏移最小化。

4. 发明申请

US20040217464A1 OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS 失效
标题翻译：用于发射和操纵光学光学的光学组件
公开(公告)号：US20040217464A1
公开(公告)日：2004-11-04
申请号：US10428960
申请日：2003-05-02
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Monty M. Denneau , Dinesh Gupta , Lisa J. Jimarez , Steven Ostrander , Brenda L. Peterson , Mark V. Pierson , Eugen Schenfeld , Subhash L. Shinde
IPC分类号： H01L023/10
CPC分类号： G02B6/3522 , G02B6/2817 , G02B6/3544 , G02B6/3574 , G02B6/3598 , G02B6/4214 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4249 , G02B6/4259 , G02B6/4269 , G02B6/4281 , G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

5. 发明申请

US20030127247A1 Z interconnect structure and method 失效
标题翻译： Z互连结构和方法
公开(公告)号：US20030127247A1
公开(公告)日：2003-07-10
申请号：US10041261
申请日：2002-01-08
申请人： International Business Machines Corporation
发明人： Lisa J. Jimarez , Mark V. Pierson
IPC分类号： H05K001/03
CPC分类号： H05K3/462 , H05K3/321 , H05K3/3463 , H05K3/3484 , H05K3/4623 , H05K2201/096
摘要： The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.
摘要翻译：本发明提供了一种附接多个芯的方法，其中芯具有导电表面的通孔以电连接到另一芯上的导电表面。该方法提供将冶金膏施加到导电表面，从糊料中去除一部分助熔剂并连接两个芯。本发明还提供了一种包括多个芯的结构，其中冶金膏将通孔与芯上的导电表面电连接到另一芯上的导电表面。

6. 发明申请

US20010018230A1 Flip chip C4 extension structure and process 有权
标题翻译：倒装芯片C4延伸结构和工艺
公开(公告)号：US20010018230A1
公开(公告)日：2001-08-30
申请号：US09782471
申请日：2001-02-12
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Miguel A. Jimarez , Cynthia S. Milkovich , Mark V. Pierson
IPC分类号： H01L021/44
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/42 , H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05671 , H01L2224/10126 , H01L2224/13022 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/81013 , H01L2224/81801 , H01L2224/81894 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/0032 , H05K3/3436 , H05K2201/0379 , H05K2201/10977 , H05K2201/10992 , H05K2203/0415 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , H01L2924/00 , H01L2224/29099 , H01L2924/00014
摘要： An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.
摘要翻译：一种电结构和相关制造方法，用于减少将第一衬底的第一导体与第二衬底的第二导电体（例如，芯片耦合到芯片载体;芯片载体）的结构中的热诱导应变到电路卡）。第一导电体的熔点超过第二导电体的熔点。第二导电体可以包括共晶铅锡合金，而第一导电体可以包括非共晶铅锡合金。第一导电体的一部分被不可焊接和不导电的材料涂覆或体积地包围。通过施加位于第一和第二导电体的熔点之间的温度，第一和第二导电体通过在第一导电体的未涂覆部分处的表面粘附机械和电连接。

7. 发明申请

US20020166697A1 Circuit board construction 审中-公开
标题翻译：电路板结构
公开(公告)号：US20020166697A1
公开(公告)日：2002-11-14
申请号：US09853506
申请日：2001-05-11
申请人： International Business Machines Corporation
发明人： Mark L. Janecek , John S. Kresge , Mark V. Pierson , Thurston B. Youngs JR.
IPC分类号： H05K001/14 , H05K003/36
CPC分类号： H05K3/462 , H05K3/321 , H05K3/4069 , H05K3/4641 , H05K2201/09536 , H05K2201/096 , Y10T29/49126
摘要： An improved circuit board construction featuring a multilayered, laminated structure having an intermediate power core layer having conductive adhesive-filled via through holes. The via through holes of the intermediate power core layer make electrical connection with metallic pads of conductive vias of adjacent outer signal core layers when the layers are laminated.
摘要翻译：一种改进的电路板结构，其特征在于具有中间电源芯层的多层叠层结构，其具有通过导电粘合剂填充的通孔。当层叠层叠时，中间功率核心层的通孔通孔与相邻的外部信号芯层的导电通孔的金属焊盘电连接。

8. 发明申请

US20040264861A1 Fiber optic attachment method, structure, and system 有权
标题翻译：光纤连接方法，结构和系统
公开(公告)号：US20040264861A1
公开(公告)日：2004-12-30
申请号：US10608057
申请日：2003-06-27
申请人： International Business Machines Corporation
发明人： Michael S. Lemmon , Mark V. Pierson
IPC分类号： G02B006/26
CPC分类号： G02B6/4202 , G02B6/2552
摘要： An attachment structure, and an associated method and system for forming the attachment structure. An end of an optical fiber is melted while the end is above, but not touching, an exposed surface of a substrate such that said end becomes molten. The optical fiber is substantially optically transparent to laser radiation of a given wavelength. The molten end is moved toward the exposed surface of the substrate until the end makes physical contact with the exposed surface of the substrate. The moving is performed sufficiently fast so that the end is still molten when the end initially makes the physical contact with the exposed surface of the substrate. The physical contact is maintained for a sufficient length of time to enable the end to bond to the exposed surface of the substrate with no intervening matter between the end and the exposed surface of the substrate.
摘要翻译：附件结构以及用于形成附接结构的相关联的方法和系统。光纤的端部熔化，而端部在基板的暴露表面上方但不接触，使得端部熔化。光纤对于给定波长的激光辐射基本上是光学透明的。熔融端朝向衬底的暴露表面移动，直到端部与衬底的暴露表面物理接触为止。移动足够快地进行，使得当端部最初与衬底的暴露表面物理接触时，端部仍然熔化。保持物理接触足够长的时间，以使端部能够在衬底的端部和暴露表面之间没有中间物质结合到衬底的暴露表面。

9. 发明申请

US20040218288A1 Optical communication assembly 失效
标题翻译：光通信组件
公开(公告)号：US20040218288A1
公开(公告)日：2004-11-04
申请号：US10428956
申请日：2003-05-02
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Mark V. Pierson , Eugen Schenfeld
IPC分类号： G02B007/02
CPC分类号： G02B6/43
摘要： An optical assembly comprising an optical cube. A first optical transmitter chip and a first optical receiver chip are mounted on one surface of the optical cube. A first continuous printed circuit board is soldered to electrical surfaces of the first optical transmitter chip and the first optical receiver chip opposite the optical cube. A second optical transmitter chip and a second optical receiver chip are mounted on an opposite surface of the optical cube. A second continuous printed circuit board is soldered to electrical surfaces of the second optical transmitter chip and the second optical receiver chip opposite the optical cube. The first optical transmitter chip is optically aligned with the second optical receiver chip through the optical cube. The second optical transmitter chip is optically aligned with the first optical receiver chip through the optical cube. The first and second printed circuit boards may be bent ninety degrees and soldered to another printed circuit board, or connected to an edge connector on another printed circuit board.
摘要翻译：一种包括光学立方体的光学组件。第一光发射机芯片和第一光接收芯片安装在光学立方体的一个表面上。将第一连续印刷电路板焊接到与光学立方体相对的第一光发射器芯片和第一光接收器芯片的电表面。第二光发射器芯片和第二光接收器芯片安装在光学立方体的相对表面上。将第二连续印刷电路板焊接到与光学立方体相对的第二光发射器芯片和第二光接收器芯片的电表面。第一光发射器芯片通过光学立方体与第二光接收器芯片光学对准。第二光发射器芯片通过光学立方体与第一光接收器芯片光学对准。第一和第二印刷电路板可以弯曲九十度并且焊接到另一个印刷电路板，或者连接到另一个印刷电路板上的边缘连接器。

10. 发明申请

US20040201917A1 System and method for capturing contaminants within a disk drive 失效
标题翻译：用于捕获磁盘驱动器内的污染物的系统和方法
公开(公告)号：US20040201917A1
公开(公告)日：2004-10-14
申请号：US10409748
申请日：2003-04-08
申请人： International Business Machines Corporation
发明人： Mark V. Pierson
IPC分类号： G11B033/14
CPC分类号： G11B25/043 , G11B33/1446
摘要： Under the present invention, a contaminant capturing material is positioned within a disk drive. Specifically, the contaminant capturing material is positioned on a suspension, adjacent a slider that hovers proximate a disk within the disk drive when the disk is in rotation. The contaminant capturing material will prevent contaminants from contacting the disk and thereby causing damage. In addition, a set of porous, open celled filters that are coated with the contaminant capturing material can also be provided. If used, the open celled filters are positioned adjacent the disk within an air stream created by a rotation of the disk.
摘要翻译：在本发明中，污染物捕获材料位于盘驱动器内。具体而言，当盘旋转时，污染物捕获材料位于悬挂件的附近，该盘片靠近磁盘驱动器内的磁盘。污染物捕获材料将防止污染物接触盘，从而造成损坏。此外，还可以提供涂覆有污染物捕获材料的一组多孔，开孔式过滤器。如果使用，开放式过滤器通过由盘的旋转产生的空气流中定位在盘附近。

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