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1. 发明申请

US20210003466A1 Sensor Device Including Sensor Unit for a Gaseous Medium 有权
公开(公告)号：US20210003466A1
公开(公告)日：2021-01-07
申请号：US17024228
申请日：2020-09-17
申请人： Infineon Technologies AG
发明人： Rainer Leuschner , Kerstin Kaemmer , Roland Meier , Marten Oldsen , Karolina Zogal
IPC分类号： G01L9/00 , G01N33/00
摘要： A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.

2. 发明申请

US20180127267A1 MEMS SENSOR PACKAGE SYSTEMS AND METHODS 审中-公开
公开(公告)号：US20180127267A1
公开(公告)日：2018-05-10
申请号：US15864787
申请日：2018-01-08
申请人： Infineon Technologies AG
发明人： Bernhard Winkler , Rainer Leuschner , Horst Theuss
IPC分类号： B81B7/00 , G01L19/14 , G01L9/00 , H01L29/84 , G01L15/00
CPC分类号： B81B7/0058 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81B2207/015 , B81C2203/0154 , G01L9/0054 , G01L15/00 , G01L19/141 , G01L19/148 , H01L29/84 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

3. 发明授权

US09917333B2 Lithium ion battery, integrated circuit and method of manufacturing a lithium ion battery 有权
公开(公告)号：US09917333B2
公开(公告)日：2018-03-13
申请号：US14230071
申请日：2014-03-31
申请人： Infineon Technologies AG
发明人： Vijaye Kumar Rajaraman , Kamil Karlovsky , Thomas Neidhart , Karl Mayer , Rainer Leuschner , Christine Moser , Ravi Keshav Joshi , Alexander Breymesser , Bernhard Goller , Francisco Javier Santos Rodriguez , Peter Zorn
IPC分类号： H01M14/00 , H01M10/42 , H01M2/02 , H01M2/08 , H01M10/04 , H01M2/04 , H01M2/06 , H01M10/052 , H01M6/40
CPC分类号： H01M10/4257 , H01M2/0202 , H01M2/024 , H01M2/0404 , H01M2/06 , H01M2/08 , H01M6/40 , H01M10/04 , H01M10/0436 , H01M10/052 , Y10T29/4911
摘要： A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.

4. 发明申请

US20160155680A1 Semiconductor Package and Method of Fabrication Thereof 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20160155680A1
公开(公告)日：2016-06-02
申请号：US14954145
申请日：2015-11-30
申请人： Infineon Technologies AG
发明人： Andreas Stueckjuergen , Rainer Leuschner , Daniel Porwol
IPC分类号： H01L23/31 , H01L21/56 , H01L21/78 , H01L23/00
CPC分类号： H01L21/78 , H01L21/561 , H01L21/568 , H01L23/3185 , H01L24/03 , H01L24/13 , H01L24/96 , H01L2224/02381 , H01L2224/04105 , H01L2224/1132 , H01L2224/11334 , H01L2224/12105 , H01L2224/13022 , H01L2224/13111 , H01L2224/14131 , H01L2224/94 , H01L2224/96 , H01L2924/182 , H01L2224/03 , H01L2224/11 , H01L2924/00014
摘要： A semiconductor package includes a semiconductor chip having a first main face and side faces, an encapsulation covering at least the side faces of the semiconductor chip, and an electrical redistribution structure arranged over the first main face of the semiconductor chip. A first main surface of the semiconductor package includes a surface of the electrical redistribution structure and a surface of the encapsulation.
摘要翻译：半导体封装包括具有第一主面和侧面的半导体芯片，至少覆盖半导体芯片的侧面的封装，以及布置在半导体芯片的第一主面上的电再分布结构。半导体封装的第一主表面包括电再分布结构的表面和封装的表面。

5. 发明申请

US20150147850A1 METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE 审中-公开
标题翻译：加工半导体工件的方法
公开(公告)号：US20150147850A1
公开(公告)日：2015-05-28
申请号：US14088523
申请日：2013-11-25
申请人： Infineon Technologies AG
发明人： Gudrun Stranzl , Martin Zgaga , Rainer Leuschner , Bernhard Goller , Bernhard Boche , Manfred Engelhardt , Hermann Wendt , Bernd Noehammer , Karl Mayer , Michael Roesner , Monika Cornelia Voerckel
IPC分类号： H01L21/82 , H01L21/283 , H01L21/265 , H01L23/00
CPC分类号： H01L21/6835 , H01L21/0331 , H01L21/283 , H01L21/2855 , H01L21/304 , H01L21/3065 , H01L21/3081 , H01L21/3086 , H01L21/6836 , H01L21/76895 , H01L21/78 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2924/12042 , H01L2924/13055 , H01L2924/0001
摘要： Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
摘要翻译：用于处理半导体工件的方法可以包括提供包括一个或多个切口区域的半导体工件; 通过从所述工件的第一侧移除来自所述一个或多个切割区域的材料，在所述工件中形成一个或多个沟槽; 将具有第一侧的工件安装到载体上; 从工件的第二侧使工件变薄; 以及在所述工件的第二侧上形成金属化层。

6. 发明申请

US20150028436A1 Apparatus Comprising and a Method for Manufacturing an Embedded MEMS Device 审中-公开
标题翻译：装置及其制造方法
公开(公告)号：US20150028436A1
公开(公告)日：2015-01-29
申请号：US14515304
申请日：2014-10-15
申请人： INFINEON TECHNOLOGIES AG
发明人： Edward Fuergut , Horst Theuss , Rainer Leuschner
IPC分类号： B81B7/00 , B81B3/00
CPC分类号： B81B7/0041 , B81B3/0021 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00253 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H04R19/005 , H04R31/006 , H04R2201/003 , H01L2924/00
摘要： A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.
摘要翻译：公开了一种用于形成封装的MEMS器件的系统和方法。在一个实施例中，封装的MEMS器件包括具有第一主表面的MEMS器件，第一主表面具有沿着第一方向的第一区域和第二方向，设置在MEMS器件的第一主表面上的膜和邻近膜的背板。封装的MEMS器件还包括封装MEMS器件并且限定后部体积的封装材料，后部体积具有沿第一方向和第二方向的第二区域，其中第一区域小于第二区域。

7. 发明授权

US11192777B2 MEMS sensor package systems and methods 有权
公开(公告)号：US11192777B2
公开(公告)日：2021-12-07
申请号：US15864787
申请日：2018-01-08
申请人： Infineon Technologies AG
发明人： Bernhard Winkler , Rainer Leuschner , Horst Theuss
IPC分类号： B81B7/00 , G01L9/00 , G01L15/00 , G01L19/14 , H01L29/84 , H01L23/31 , H01L21/56
摘要： Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

8. 发明授权

US09614256B2 Lithium ion battery, integrated circuit and method of manufacturing a lithium ion battery 有权
公开(公告)号：US09614256B2
公开(公告)日：2017-04-04
申请号：US14230086
申请日：2014-03-31
申请人： Infineon Technologies AG
发明人： Kamil Karlovsky , Rafael Janski , Michael Sorger , Magdalena Forster , Katharina Schmut , Vijaye Kumar Rajaraman , Rainer Leuschner , Bernhard Goller
IPC分类号： H01M10/42 , H01M2/02 , H01M10/04 , H01M2/04 , H01M2/36 , H01M4/38 , H01M4/66 , H01M10/0525 , H01M10/058
CPC分类号： H01M10/058 , H01M2/0202 , H01M2/0207 , H01M2/024 , H01M2/026 , H01M2/027 , H01M2/0285 , H01M2/0404 , H01M2/0486 , H01M2/08 , H01M2/361 , H01M4/134 , H01M4/386 , H01M4/66 , H01M10/04 , H01M10/0525 , H01M10/4257 , H01M2220/20 , H01M2220/30 , Y02E60/122 , Y02P70/54 , Y10T29/4911
摘要： A lithium ion battery includes a first substrate having a first main surface, and a lid including a conductive cover element, the lid being attached to the first main surface. A cavity is formed between the first substrate and the lid. The battery further includes an electrolyte disposed in the cavity. An anode of the battery includes a component made of a semiconductor material and is formed at the first substrate, and a cathode of the battery is formed at the lid.

9. 发明申请

US20150280289A1 Lithium Ion Battery, Integrated Circuit and Method of Manufacturing a Lithium Ion Battery 有权
标题翻译：锂离子电池，集成电路和制造锂离子电池的方法
公开(公告)号：US20150280289A1
公开(公告)日：2015-10-01
申请号：US14230086
申请日：2014-03-31
申请人： Infineon Technologies AG
发明人： Kamil Karlovsky , Rafael Janski , Michael Sorger , Magdalena Forster , Katharina Schmut , Vijaye Kumar Rajaraman , Rainer Leuschner , Bernhard Goller
IPC分类号： H01M10/42 , H01M10/04 , H01M2/02
CPC分类号： H01M10/058 , H01M2/0202 , H01M2/0207 , H01M2/024 , H01M2/026 , H01M2/027 , H01M2/0285 , H01M2/0404 , H01M2/0486 , H01M2/08 , H01M2/361 , H01M4/134 , H01M4/386 , H01M4/66 , H01M10/04 , H01M10/0525 , H01M10/4257 , H01M2220/20 , H01M2220/30 , Y02E60/122 , Y02P70/54 , Y10T29/4911
摘要： A lithium ion battery includes a first substrate having a first main surface, and a lid including a conductive cover element, the lid being attached to the first main surface. A cavity is formed between the first substrate and the lid. The battery further includes an electrolyte disposed in the cavity. An anode of the battery includes a component made of a semiconductor material and is formed at the first substrate, and a cathode of the battery is formed at the lid.
摘要翻译：锂离子电池包括具有第一主表面的第一基板和包括导电盖元件的盖，所述盖附接到第一主表面。在第一基板和盖之间形成空腔。电池还包括设置在空腔中的电解质。电池的阳极包括由半导体材料制成的部件，并且形成在第一基板上，并且电池的阴极形成在盖子上。

10. 发明申请

US20140310671A1 Electrical Measurement Based Circuit Wiring Layout Modification Method and System 有权
标题翻译：基于电气测量的电路布线修改方法和系统
公开(公告)号：US20140310671A1
公开(公告)日：2014-10-16
申请号：US13863740
申请日：2013-04-16
申请人： Infineon Technologies AG
发明人： Gottfried Beer , Dominic Maier , Gerhard Metzger-Brückl , Rainer Leuschner
IPC分类号： G06F17/50
CPC分类号： G06F17/5077 , G06F17/5081
摘要： The capacitance or inductance of electrical circuits is adjusted by measuring inductance or capacitance values of passive components fabricated on a first substrate, storing individual associations between the passive components and the respective measured values of the passive components, and determining electrical connections for the passive components based on the stored individual associations between the passive components and the respective measured values of the passive components. A corresponding system includes a tester operable to measure inductance or capacitance values of the passive components fabricated on the first substrate, a storage system operable to store the individual associations between the passive components and the respective measured values of the passive components, and a processing circuit operable to determine the electrical connections for the passive components based on the stored individual associations between the passive components and the respective measured values of the passive components.
摘要翻译：通过测量在第一基板上制造的无源部件的电感或电容值来调节电路的电容或电感，存储无源元件之间的各个关联以及无源元件的相应测量值，以及确定基于无源元件的电连接关于无源部件之间存储的各个关联以及被动部件的相应测量值。相应的系统包括可操作以测量制造在第一基板上的无源部件的电感或电容值的测试器，可操作以存储无源部件之间的各个关联和无源部件的相应测量值的存储系统，以及处理电路可操作以基于所存储的无源组件之间的各个关联和无源组件的相应测量值来确定无源组件的电连接。

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