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1. 发明授权

US07060595B2 Circuit substrate and fabrication method thereof 有权
标题翻译：电路基板及其制造方法
公开(公告)号：US07060595B2
公开(公告)日：2006-06-13
申请号：US10627609
申请日：2003-07-28
申请人： In-De Ou , Chih-Pin Hung , Chia-Shang Chen , Kuang-Hua Lin , Shin-Hua Chao
发明人： In-De Ou , Chih-Pin Hung , Chia-Shang Chen , Kuang-Hua Lin , Shin-Hua Chao
IPC分类号： H01L21/20 , H01L21/36
CPC分类号： H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/043 , H05K3/403 , H05K3/429 , H05K2201/09509 , H05K2201/09536 , H05K2201/0959 , H05K2201/09645 , H01L2924/00
摘要： A circuit substrate includes a board, a plurality of metal layers and an insulator. The board has a plurality of conductive traces layers and a via formed therein. The metal layers are formed on the inner wall of the via and each of the metal layers is electrically connected to its corresponding conductive traces layer. The via is filled with the insulator so that each of the metal layers is electrically isolated from each other. In addition, this invention also provides a fabrication method of the circuit substrate.
摘要翻译：电路基板包括板，多个金属层和绝缘体。该板具有多个导电迹线层和形成在其中的通孔。金属层形成在通孔的内壁上，并且每个金属层电连接到其对应的导电迹线层。通孔填充有绝缘体，使得每个金属层彼此电隔离。此外，本发明还提供了电路基板的制造方法。

2. 发明申请

US20050130431A1 Method for making a package substrate without etching metal layer on side walls of die-cavity 审中-公开
标题翻译：制造封装衬底而不在模腔侧壁上蚀刻金属层的方法
公开(公告)号：US20050130431A1
公开(公告)日：2005-06-16
申请号：US10733272
申请日：2003-12-12
申请人： Chia-Shang Chen , Kuang-Hua Lin , Chi-Jau Tzeng , Jian-Ming Jiang
发明人： Chia-Shang Chen , Kuang-Hua Lin , Chi-Jau Tzeng , Jian-Ming Jiang
IPC分类号： H01L21/311 , H01L21/48 , H01L23/498 , H05K1/18 , H05K3/06 , H05K3/40 , H05K3/42
CPC分类号： H05K3/403 , H01L21/4846 , H01L21/486 , H01L23/49805 , H01L24/48 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K1/182 , H05K3/064 , H05K3/427 , H05K2201/09127 , H05K2201/09981 , H05K2203/1394 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for making a package substrate without etching metal layer on side walls of a die-cavity is disclosed. At least a through slot is formed around a defined die-cavity region of a substrate so as to form a die-cavity portion in the die-cavity region. The through slot has side walls without cutting off the die-cavity portion. A metal layer is formed on the side walls inside the through slot. A dry film is attached on the substrate and the die-cavity portion so as to seal the side walls of the through slot. The metal layer on the side walls is reserved during etching. A die-cavity with metalized side walls is formed after removing the die-cavity portion.
摘要翻译：公开了一种制造封装衬底而不在模腔的侧壁上蚀刻金属层的方法。至少在基板的限定的模腔区域周围形成贯通槽，以在模腔区域中形成模腔部。通孔具有侧壁而不切断模腔部分。在通孔内的侧壁上形成金属层。将干膜附着在基板和模腔部分上，以密封通孔的侧壁。在蚀刻期间保留侧壁上的金属层。在去除模腔部分之后形成具有金属化侧壁的模腔。

3. 发明授权

US07229538B2 Microfluidic device with network micro channels 有权
标题翻译：具有网络微通道的微流控器件
公开(公告)号：US07229538B2
公开(公告)日：2007-06-12
申请号：US10661750
申请日：2003-09-11
申请人： Fan-Gang Tseng , Kuang-Hua Lin , Hui-Ting Hsu
发明人： Fan-Gang Tseng , Kuang-Hua Lin , Hui-Ting Hsu
IPC分类号： G01N27/327 , G01N27/333 , B01L3/00
CPC分类号： G01N27/3271 , B01L3/5027 , B81B1/002 , B81B2201/0214 , B81B2201/058
摘要： A microfluidic device has a plurality of H-shaped micro channels not connected to each other and formed on a substrate. Each of the H-shaped micro channels comprises two main channels separately placed on two opposite sides in parallel and a plurality of sub-channels perpendicularly connected to the two main channels. The present invention is designed in such a way that various reagents dropped into different H-shaped micro channels are immobilized on respective sub-channels because of the different widths of the main channel and sub-channel. Afterwards the reagents are coated with a layer of polymer. The polymer has a porous structure that allows the passage of any sample to be tested. Finally, a plurality of upper channels parallel to one another are directly fabricated in the polymer, or in another layer of polymer stacked on the previous polymer.
摘要翻译：微流体装置具有彼此不连接并形成在基板上的多个H形微通道。每个H形微通道包括分别放置在平行的两个相对侧上的两个主通道和垂直连接到两个主通道的多个子通道。本发明的设计使得由于主通道和子通道的宽度不同，滴入不同H形微通道的各种试剂固定在各个子通道上。之后，用一层聚合物涂覆试剂。聚合物具有允许待测样品通过的多孔结构。最后，彼此平行的多个上部通道直接制造在聚合物中，或者在堆叠在先前聚合物上的另一层聚合物中。

4. 发明申请

US20100195280A1 Heat-dissipation module and electronic device using the same 有权
标题翻译：散热模块和使用其的电子设备
公开(公告)号：US20100195280A1
公开(公告)日：2010-08-05
申请号：US12453608
申请日：2009-05-15
申请人： Lung-Chi Huang , Kuang-Hua Lin , Feng-Lin Hsu
发明人： Lung-Chi Huang , Kuang-Hua Lin , Feng-Lin Hsu
IPC分类号： H05K7/20 , G06F1/20 , F28D15/02
CPC分类号： G06F1/203 , F28D15/0266 , F28F1/24
摘要： A heat-dissipation module and an electronic device including a first heat source and the heat-dissipation module are provided. The heat-dissipation module includes a first heat pipe, a second heat pipe, a first set of heat fins, a second set of heat fins and a fan. One end of the first heat pipe and one end of the second heat pipe are respectively in contact with the first heat source. The first set of heat fins and the second set of heat fins are, respectively, in contact with the other end of the first heat pipe and the other end of the second heat pipe. Heat generated by the first heat source is transferred to the two sets of heat fins through the first and the second heat pipes. The fan is used for providing an air-flow blowing toward the two sets of heat fins to dissipate heat.
摘要翻译：提供一种散热模块和包括第一热源和散热模块的电子设备。散热模块包括第一热管，第二热管，第一组散热片，第二组散热片和风扇。第一热管的一端和第二热管的一端分别与第一热源接触。第一组散热片和第二组散热片分别与第一热管的另一端和第二热管的另一端接触。由第一热源产生的热量通过第一和第二热管传递到两组散热片。该风扇用于向两组散热片提供气流以散热。

5. 发明授权

US07965512B2 Heat-dissipation module and electronic device using the same 有权
标题翻译：散热模块和使用其的电子设备
公开(公告)号：US07965512B2
公开(公告)日：2011-06-21
申请号：US12453608
申请日：2009-05-15
申请人： Lung-Chi Huang , Kuang-Hua Lin , Feng-Lin Hsu
发明人： Lung-Chi Huang , Kuang-Hua Lin , Feng-Lin Hsu
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： G06F1/203 , F28D15/0266 , F28F1/24
摘要： A heat-dissipation module and an electronic device including a first heat source and the heat-dissipation module are provided. The heat-dissipation module includes a first heat pipe, a second heat pipe, a first set of heat fins, a second set of heat fins and a fan. One end of the first heat pipe and one end of the second heat pipe are respectively in contact with the first heat source. The first set of heat fins and the second set of heat fins are, respectively, in contact with the other end of the first heat pipe and the other end of the second heat pipe. Heat generated by the first heat source is transferred to the two sets of heat fins through the first and the second heat pipes. The fan is used for providing an air-flow blowing toward the two sets of heat fins to dissipate heat.
摘要翻译：提供一种散热模块和包括第一热源和散热模块的电子设备。散热模块包括第一热管，第二热管，第一组散热片，第二组散热片和风扇。第一热管的一端和第二热管的一端分别与第一热源接触。第一组散热片和第二组散热片分别与第一热管的另一端和第二热管的另一端接触。由第一热源产生的热量通过第一和第二热管传递到两组散热片。该风扇用于向两组散热片提供气流以散热。

6. 发明申请

US20090074580A1 RADIAL TURBINE WHEEL STRUCTURE 审中-公开
标题翻译：径向涡轮轮结构
公开(公告)号：US20090074580A1
公开(公告)日：2009-03-19
申请号：US11484734
申请日：2006-07-12
申请人： Jia-Ruey Wu , Kuang-Hua Lin , Shih-Tsao Huang , Chia-Wen Lee
发明人： Jia-Ruey Wu , Kuang-Hua Lin , Shih-Tsao Huang , Chia-Wen Lee
IPC分类号： F01D5/22
CPC分类号： F01D5/34 , F01D5/141
摘要： A radial turbine wheel structure comprises a wheel disc, a plurality of full blades and a plurality of splitting blades. The splitting blades are disposed equidistantly around the wheel disc and are alternately disposed with the full blades. Wherein each of inlet shrouds, outlet shrouds, inlet hubs and outlet hubs separately has an included angle to a meridian plane of the wheel disc, and the full blades are related to the splitting blades in length. Hence, the radial turbine wheel is applied to the gas turbine generator set to increase the electricity generation efficiency of the gas turbine generator.
摘要翻译：径向涡轮机叶轮结构包括轮盘，多个全叶片和多个分裂叶片。分裂叶片等距离地设置在轮盘周围，并且与全叶片交替地设置。其中入口罩，出口护罩，入口轮毂和出口轮毂中的每一个分开地具有与轮盘的子午线平面的夹角，并且完整的叶片与分割叶片的长度相关。因此，径向涡轮机叶轮被施加到燃气涡轮发电机组以增加燃气轮机发电机的发电效率。

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