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1. 发明授权

US08312774B2 Flow-through pressure sensor apparatus 有权
标题翻译：流通式压力传感器装置
公开(公告)号：US08312774B2
公开(公告)日：2012-11-20
申请号：US12389091
申请日：2009-02-19
申请人： Ian Bentley , Jim Cook , Lamar Floyd Ricks , Alistair David Bradley , Richard Wade
发明人： Ian Bentley , Jim Cook , Lamar Floyd Ricks , Alistair David Bradley , Richard Wade
IPC分类号： G01L7/00
CPC分类号： G01L19/0023
摘要： A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.
摘要翻译：一种流通压力传感器装置，其减少用于在压力感测管芯和流体之间提供流体连通并具有绝对最小捕集体积的流动管的死空间。具有两个模制端口的盖子（例如塑料）可以使用模制的焊接销添加到压力感测模具的一侧，以改善耐用性和刚度。温度和湿度传感器也可以安装在流路中的基板（例如陶瓷）上，并且可以使用安装销的夹子端或穿过基板外部的通孔连接到相对侧的可编程补偿集成电路一个加压区域。

2. 发明申请

US20110005326A1 SENSOR PACKAGE ASSEMBLY HAVING AN UNCONSTRAINED SENSE DIE 有权
标题翻译：传感器组件具有不受限制的感测模块
公开(公告)号：US20110005326A1
公开(公告)日：2011-01-13
申请号：US12828155
申请日：2010-06-30
申请人： Ian Bentley , Alistair David Bradley , Jim Cook
发明人： Ian Bentley , Alistair David Bradley , Jim Cook
IPC分类号： G01L9/00
CPC分类号： G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2224/73265 , H01L2924/10158 , H01L2924/1461 , H01L2924/15151 , H01L2924/00014 , H01L2924/00
摘要： A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate.
摘要翻译：一种压力检测机构，其具有可以利用具有最佳厚度的粘合剂直接附着在氧化铝基底层的表面上的压力感应模头。粘合剂可以是应力柔顺的并且可以是硅氧烷，硅氧烷 - 环氧树脂，环氧树脂或任何其它合适的粘合剂材料中的一种或多种。补偿和接口专用集成电路可以附接到封装衬底的表面。压力感应芯片可以用接合线电连接到集成电路。集成电路可以用接合线电连接到封装衬底上的迹线导体，并且迹线导体可以连接到应力柔性金属导体或引线，用于外部连接到诸如印刷电路板的安装表面。具有一个或多个压力端口或通风口的硬质塑料或类似材料的对称盖可以附着到基板的两侧。

3. 发明申请

US20100206046A1 FLOW-THROUGH PRESSURE SENSOR APPARATUS 有权
标题翻译：流量传感器设备
公开(公告)号：US20100206046A1
公开(公告)日：2010-08-19
申请号：US12389091
申请日：2009-02-19
申请人： Ian Bentley , Jim Cook , Lamar Floyd Ricks , Alistair David Bradley , Richard Wade
发明人： Ian Bentley , Jim Cook , Lamar Floyd Ricks , Alistair David Bradley , Richard Wade
IPC分类号： G01N19/10 , G01L7/00 , G01F1/68
CPC分类号： G01L19/0023
摘要： A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.
摘要翻译：一种流通压力传感器装置，其减少用于在压力感测管芯和流体之间提供流体连通并具有绝对最小捕集体积的流动管的死空间。具有两个模制端口的盖子（例如塑料）可以使用模制的焊接销添加到压力感测模具的一侧，以改善耐用性和刚度。温度和湿度传感器也可以安装在流路中的基板（例如陶瓷）上，并且可以使用安装销的夹子端或穿过基板外部的通孔连接到相对侧的可编程补偿集成电路一个加压区域。

4. 发明授权

US08322225B2 Sensor package assembly having an unconstrained sense die 有权
标题翻译：传感器封装组件具有无约束的感测管芯
公开(公告)号：US08322225B2
公开(公告)日：2012-12-04
申请号：US12828155
申请日：2010-06-30
申请人： Ian Bentley , Alistair David Bradley , Jim Cook
发明人： Ian Bentley , Alistair David Bradley , Jim Cook
IPC分类号： G01L9/00
CPC分类号： G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2224/73265 , H01L2924/10158 , H01L2924/1461 , H01L2924/15151 , H01L2924/00014 , H01L2924/00
摘要： A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate.
摘要翻译：一种压力检测机构，其具有可以利用具有最佳厚度的粘合剂直接附着在氧化铝基底层的表面上的压力感应模头。粘合剂可以是应力柔顺的并且可以是硅氧烷，硅氧烷 - 环氧树脂，环氧树脂或任何其它合适的粘合剂材料中的一种或多种。补偿和接口专用集成电路可以附接到封装衬底的表面。压力感应芯片可以用接合线电连接到集成电路。集成电路可以用接合线电连接到封装衬底上的迹线导体，并且迹线导体可以连接到应力柔性金属导体或引线，用于外部连接到诸如印刷电路板的安装表面。具有一个或多个压力端口或通风口的硬质塑料或类似材料的对称盖可以附着到基板的两侧。

5. 发明授权

US08567254B2 Pressure sensor assembly 有权
标题翻译：压力传感器组件
公开(公告)号：US08567254B2
公开(公告)日：2013-10-29
申请号：US13305469
申请日：2011-11-28
申请人： Basavaraja M. Teli , Ian Bentley , Jim Cook
发明人： Basavaraja M. Teli , Ian Bentley , Jim Cook
IPC分类号： G01L15/00
CPC分类号： G01L19/143 , G01L19/0038 , G01L19/0084
摘要： The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.
摘要翻译：本公开涉及压力传感器。在一个说明性实施例中，压力传感器可以包括压力传感器组件，其在压力传感器组件的相对侧上具有压力端口。压力传感器可以包括保护壳体，其包括第一壳体构件和限定用于牢固地容纳压力传感器组件的空腔的第二壳体构件。保护壳体可以包括耦合到压力传感器组件的压力端口之一的第一端口和耦合到压力传感器组件的另一个压力端口的第二端口。在一些情况下，保护壳体可以包括一个或多个对准特征，一个或多个定位特征，以及在压力端口周围的空腔的每一侧上可以包括两个或更多个凸起的凸台。

6. 发明申请

US20120067132A1 PRESSURE SENSOR ASSEMBLY 有权
标题翻译：压力传感器总成
公开(公告)号：US20120067132A1
公开(公告)日：2012-03-22
申请号：US13305469
申请日：2011-11-28
申请人： Basavaraja M. Teli , Ian Bentley , Jim Cook
发明人： Basavaraja M. Teli , Ian Bentley , Jim Cook
IPC分类号： G01L7/08 , G01L7/00
CPC分类号： G01L19/143 , G01L19/0038 , G01L19/0084
摘要： The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.
摘要翻译：本公开涉及压力传感器。在一个说明性实施例中，压力传感器可以包括压力传感器组件，其在压力传感器组件的相对侧上具有压力端口。压力传感器可以包括保护壳体，其包括第一壳体构件和限定用于牢固地容纳压力传感器组件的空腔的第二壳体构件。保护壳体可以包括耦合到压力传感器组件的压力端口之一的第一端口和耦合到压力传感器组件的另一个压力端口的第二端口。在一些情况下，保护壳体可以包括一个或多个对准特征，一个或多个定位特征，以及在压力端口周围的空腔的每一侧上可以包括两个或更多个凸起的凸台。

7. 发明授权

US08082797B2 Pressure sensor assembly 有权
标题翻译：压力传感器组件
公开(公告)号：US08082797B2
公开(公告)日：2011-12-27
申请号：US12616623
申请日：2009-11-11
申请人： Basavaraja M. Teli , Ian Bentley , Jim Cook
发明人： Basavaraja M. Teli , Ian Bentley , Jim Cook
IPC分类号： G01L15/00
CPC分类号： G01L19/143 , G01L19/0038 , G01L19/0084
摘要： The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.
摘要翻译：本公开涉及压力传感器。在一个说明性实施例中，压力传感器可以包括压力传感器组件，其在压力传感器组件的相对侧上具有压力端口。压力传感器可以包括保护壳体，其包括第一壳体构件和限定用于牢固地容纳压力传感器组件的空腔的第二壳体构件。保护壳体可以包括耦合到压力传感器组件的压力端口之一的第一端口和耦合到压力传感器组件的另一个压力端口的第二端口。在一些情况下，保护壳体可以包括一个或多个对准特征，一个或多个定位特征，以及在压力端口周围的空腔的每一侧上可以包括两个或更多个凸起的凸台。

8. 发明申请

US20110107839A1 PRESSURE SENSOR ASSEMBLY 有权
标题翻译：压力传感器总成
公开(公告)号：US20110107839A1
公开(公告)日：2011-05-12
申请号：US12616623
申请日：2009-11-11
申请人： Basavaraja M. Teli , Ian Bentley , Jim Cook
发明人： Basavaraja M. Teli , Ian Bentley , Jim Cook
IPC分类号： G01L7/00
CPC分类号： G01L19/143 , G01L19/0038 , G01L19/0084
摘要： The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.
摘要翻译：本公开涉及压力传感器。在一个说明性实施例中，压力传感器可以包括压力传感器组件，其在压力传感器组件的相对侧上具有压力端口。压力传感器可以包括保护壳体，其包括第一壳体构件和限定用于牢固地容纳压力传感器组件的空腔的第二壳体构件。保护壳体可以包括耦合到压力传感器组件的压力端口之一的第一端口和耦合到压力传感器组件的另一个压力端口的第二端口。在一些情况下，保护壳体可以包括一个或多个对准特征，一个或多个定位特征，以及在压力端口周围的空腔的每一侧上可以包括两个或更多个凸起的凸台。

9. 发明授权

US08770034B2 Packaged sensor with multiple sensors elements 有权
标题翻译：具有多个传感器元件的封装传感器
公开(公告)号：US08770034B2
公开(公告)日：2014-07-08
申请号：US13226370
申请日：2011-09-06
申请人： Ian Bentley , Lamar Floyd Ricks
发明人： Ian Bentley , Lamar Floyd Ricks
IPC分类号： G01L9/06 , G01L7/00
CPC分类号： G01L13/025 , G01L9/0054 , G01L15/00 , G01L19/148
摘要： The present disclose relates to sensor including multiple sensor elements. In some cases, the multiple sensor elements may be mounted on a single substrate and each may be configured to sense a single parameter with different resolutions, sensitivities, and/or ranges, and/or the multiple parameters. In one example, multiple pressure sensing die may be mounted in a single package, and each may be configured as a differential pressure sensor, an absolute pressure sensor, and/or a gauge pressure sensor, as desired.
摘要翻译：本公开涉及包括多个传感器元件的传感器。在一些情况下，多个传感器元件可以安装在单个基板上，并且每个传感器元件可被配置为感测具有不同分辨率，灵敏度和/或范围和/或多个参数的单个参数。在一个示例中，多个压力感测模具可以安装在单个封装中，并且每个可以根据需要被配置为差压传感器，绝对压力传感器和/或表压传感器。

10. 发明申请

US20130033830A1 CONNECTOR ASSEMBLY FOR A SENSOR 有权
标题翻译：传感器连接器总成
公开(公告)号：US20130033830A1
公开(公告)日：2013-02-07
申请号：US13195770
申请日：2011-08-01
申请人： Todd Eckhardt , Paul Rozgo , Ian Bentley , Jim Machir , Ryan Jones
发明人： Todd Eckhardt , Paul Rozgo , Ian Bentley , Jim Machir , Ryan Jones
IPC分类号： H05K5/00 , H05K13/00
CPC分类号： G01L19/003 , G01L19/0038 , G01L19/0084 , G01L19/144 , G01L19/147 , G01L19/148
摘要： The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.
摘要翻译：本公开涉及包括压力传感器，湿度传感器，流量传感器等的传感器。在一些情况下，用于传感器组件的连接器组件可以包括电连接器，印刷电路板和导电外壳。电连接器可以包括机械连接器和暴露在机械连接器的第一端和第二端处的电端子。电连接器，印刷电路板和导电外壳可以彼此电连接。在一些情况下，可以设置具有不同的机械形状的第二端和类似形状的第一端的多个电连接器，从中可以选择一个电连接器用于连接器组件。

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