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1. 发明授权

US08312774B2 Flow-through pressure sensor apparatus 有权
标题翻译：流通式压力传感器装置
公开(公告)号：US08312774B2
公开(公告)日：2012-11-20
申请号：US12389091
申请日：2009-02-19
申请人： Ian Bentley , Jim Cook , Lamar Floyd Ricks , Alistair David Bradley , Richard Wade
发明人： Ian Bentley , Jim Cook , Lamar Floyd Ricks , Alistair David Bradley , Richard Wade
IPC分类号： G01L7/00
CPC分类号： G01L19/0023
摘要： A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.
摘要翻译：一种流通压力传感器装置，其减少用于在压力感测管芯和流体之间提供流体连通并具有绝对最小捕集体积的流动管的死空间。具有两个模制端口的盖子（例如塑料）可以使用模制的焊接销添加到压力感测模具的一侧，以改善耐用性和刚度。温度和湿度传感器也可以安装在流路中的基板（例如陶瓷）上，并且可以使用安装销的夹子端或穿过基板外部的通孔连接到相对侧的可编程补偿集成电路一个加压区域。

2. 发明授权

US08322225B2 Sensor package assembly having an unconstrained sense die 有权
标题翻译：传感器封装组件具有无约束的感测管芯
公开(公告)号：US08322225B2
公开(公告)日：2012-12-04
申请号：US12828155
申请日：2010-06-30
申请人： Ian Bentley , Alistair David Bradley , Jim Cook
发明人： Ian Bentley , Alistair David Bradley , Jim Cook
IPC分类号： G01L9/00
CPC分类号： G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2224/73265 , H01L2924/10158 , H01L2924/1461 , H01L2924/15151 , H01L2924/00014 , H01L2924/00
摘要： A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate.
摘要翻译：一种压力检测机构，其具有可以利用具有最佳厚度的粘合剂直接附着在氧化铝基底层的表面上的压力感应模头。粘合剂可以是应力柔顺的并且可以是硅氧烷，硅氧烷 - 环氧树脂，环氧树脂或任何其它合适的粘合剂材料中的一种或多种。补偿和接口专用集成电路可以附接到封装衬底的表面。压力感应芯片可以用接合线电连接到集成电路。集成电路可以用接合线电连接到封装衬底上的迹线导体，并且迹线导体可以连接到应力柔性金属导体或引线，用于外部连接到诸如印刷电路板的安装表面。具有一个或多个压力端口或通风口的硬质塑料或类似材料的对称盖可以附着到基板的两侧。

3. 发明申请

US20110005326A1 SENSOR PACKAGE ASSEMBLY HAVING AN UNCONSTRAINED SENSE DIE 有权
标题翻译：传感器组件具有不受限制的感测模块
公开(公告)号：US20110005326A1
公开(公告)日：2011-01-13
申请号：US12828155
申请日：2010-06-30
申请人： Ian Bentley , Alistair David Bradley , Jim Cook
发明人： Ian Bentley , Alistair David Bradley , Jim Cook
IPC分类号： G01L9/00
CPC分类号： G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2224/73265 , H01L2924/10158 , H01L2924/1461 , H01L2924/15151 , H01L2924/00014 , H01L2924/00
摘要： A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate.
摘要翻译：一种压力检测机构，其具有可以利用具有最佳厚度的粘合剂直接附着在氧化铝基底层的表面上的压力感应模头。粘合剂可以是应力柔顺的并且可以是硅氧烷，硅氧烷 - 环氧树脂，环氧树脂或任何其它合适的粘合剂材料中的一种或多种。补偿和接口专用集成电路可以附接到封装衬底的表面。压力感应芯片可以用接合线电连接到集成电路。集成电路可以用接合线电连接到封装衬底上的迹线导体，并且迹线导体可以连接到应力柔性金属导体或引线，用于外部连接到诸如印刷电路板的安装表面。具有一个或多个压力端口或通风口的硬质塑料或类似材料的对称盖可以附着到基板的两侧。

4. 发明申请

US20100206046A1 FLOW-THROUGH PRESSURE SENSOR APPARATUS 有权
标题翻译：流量传感器设备
公开(公告)号：US20100206046A1
公开(公告)日：2010-08-19
申请号：US12389091
申请日：2009-02-19
申请人： Ian Bentley , Jim Cook , Lamar Floyd Ricks , Alistair David Bradley , Richard Wade
发明人： Ian Bentley , Jim Cook , Lamar Floyd Ricks , Alistair David Bradley , Richard Wade
IPC分类号： G01N19/10 , G01L7/00 , G01F1/68
CPC分类号： G01L19/0023
摘要： A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.
摘要翻译：一种流通压力传感器装置，其减少用于在压力感测管芯和流体之间提供流体连通并具有绝对最小捕集体积的流动管的死空间。具有两个模制端口的盖子（例如塑料）可以使用模制的焊接销添加到压力感测模具的一侧，以改善耐用性和刚度。温度和湿度传感器也可以安装在流路中的基板（例如陶瓷）上，并且可以使用安装销的夹子端或穿过基板外部的通孔连接到相对侧的可编程补偿集成电路一个加压区域。

5. 发明授权

US08327715B2 Force sensor apparatus 有权
标题翻译：力传感器装置
公开(公告)号：US08327715B2
公开(公告)日：2012-12-11
申请号：US12497299
申请日：2009-07-02
申请人： Alistair David Bradley , Todd Eckhardt , Ryan Jones , Richard Wade
发明人： Alistair David Bradley , Todd Eckhardt , Ryan Jones , Richard Wade
IPC分类号： G01B7/16 , G01L1/00
CPC分类号： G01L1/18 , G01L1/2231 , H01L2224/48091 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A force sensor apparatus and method of forming the same. The apparatus includes a force sense element that can be attached to a substrate. An actuator disposed in a hole formed within the cap is operably coupled to the force sense element for transferring force to the sense element in response to receiving a force from an external source. The force sense element is configured to sense the external force and generate an output signal representing the force. Preferably, one or more bond pads, associated with the force sense element and the substrate, can be electrically connected via wire bonding. A cover associated with an integrated flexible membrane can be mounted on the substrate in order to protect internal components associated with the force sensor apparatus from an external environment.
摘要翻译：力传感器装置及其形成方法。该装置包括可附接到基底的力感测元件。设置在形成在盖中的孔中的致动器可操作地联接到力感测元件，用于响应于接收来自外部源的力而将力传递到感测元件。力感测元件被配置为感测外力并产生表示力的输出信号。优选地，与力感测元件和衬底相关联的一个或多个接合焊盘可以经由引线接合电连接。与集成柔性膜相关联的盖可以安装在基板上，以便将与力传感器装置相关联的内部部件与外部环境保护起来。

6. 发明授权

US08375799B2 Increased sensor die adhesion 失效
标题翻译：增加传感器模具附着力
公开(公告)号：US08375799B2
公开(公告)日：2013-02-19
申请号：US12965469
申请日：2010-12-10
申请人： Alistair David Bradley , Lamar Floyd Ricks , Richard Alan Davis
发明人： Alistair David Bradley , Lamar Floyd Ricks , Richard Alan Davis
IPC分类号： G01L9/06
CPC分类号： G01L19/147 , H01L2224/48091 , H01L2224/48137 , H01L2924/10253 , Y10T29/49007 , H01L2924/00014 , H01L2924/00
摘要： Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.
摘要翻译：描述了用于将传感器管芯粘合到基底上的方法和装置。在一些情况下，传感器组件可以包括用粘合剂安装到基底的压力传感器模具。压力传感器芯片可以被制造成包括具有一个或多个粘合特征（例如凹部或凹陷）的背面，其增加与粘合剂接触的压力传感器模具的表面积，从而增加粘合力之间。在一些情况下，一个或多个粘合特征可以限定压力传感器管芯和粘合剂之间的非平面界面，在一些情况下，这可以减少粘合剂中裂纹的形成和/或传播，这也可能有助于增加其间的粘合力。

7. 发明授权

US08534130B2 Joint between a pressure sensor and a pressure port of a sensor assembly 有权
标题翻译：传感器组件的压力传感器和压力端口之间的接头
公开(公告)号：US08534130B2
公开(公告)日：2013-09-17
申请号：US13195818
申请日：2011-08-01
申请人： Todd Eckhardt , Alistair David Bradley , Sunil Job , Palani Thanigachalam , Jim Machir
发明人： Todd Eckhardt , Alistair David Bradley , Sunil Job , Palani Thanigachalam , Jim Machir
IPC分类号： G01L7/00
CPC分类号： G01L19/0007
摘要： The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some illustrative cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In one example, the sensor unit may include a carrier carrying a sense element, where the carrier may extend into a recess of the pressure port and may be secured to the pressure port at an internal side thereof through the use of an adhesive layer.
摘要翻译：本公开涉及包括压力传感器，湿度传感器，流量传感器等的传感器。在一些说明性情况下，传感器组件可以包括连接到传感器单元的压力端口，连接到传感器单元的电连接器和外壳压力端口，传感器单元和电连接器的至少一部分。在一个示例中，传感器单元可以包括承载感测元件的载体，其中载体可以延伸到压力端口的凹部中，并且可以通过使用粘合剂层在其内侧固定到压力端口。

8. 发明申请

US20130031986A1 JOINT BETWEEN A PRESSURE SENSOR AND A PRESSURE PORT OF A SENSOR ASSEMBLY 有权
标题翻译：传感器组件的压力传感器和压力端口之间的连接
公开(公告)号：US20130031986A1
公开(公告)日：2013-02-07
申请号：US13195818
申请日：2011-08-01
申请人： Todd Eckhardt , Alistair David Bradley , Sunil Job , Palani Thanigachalam , Jim Machir
发明人： Todd Eckhardt , Alistair David Bradley , Sunil Job , Palani Thanigachalam , Jim Machir
IPC分类号： G01L7/00
CPC分类号： G01L19/0007
摘要： The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some illustrative cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In one example, the sensor unit may include a carrier carrying a sense element, where the carrier may extend into a recess of the pressure port and may be secured to the pressure port at an internal side thereof through the use of an adhesive layer.
摘要翻译：本公开涉及包括压力传感器，湿度传感器，流量传感器等的传感器。在一些说明性情况下，传感器组件可以包括连接到传感器单元的压力端口，连接到传感器单元的电连接器和外壳压力端口，传感器单元和电连接器的至少一部分。在一个示例中，传感器单元可以包括承载感测元件的载体，其中载体可以延伸到压力端口的凹部中，并且可以通过使用粘合剂层在其内侧固定到压力端口。

9. 发明申请

US20110000318A1 FORCE SENSOR APPARATUS 有权
标题翻译：力传感器装置
公开(公告)号：US20110000318A1
公开(公告)日：2011-01-06
申请号：US12497299
申请日：2009-07-02
申请人： Alistair David Bradley , Todd Eckhardt , Ryan Jones , Richard Wade
发明人： Alistair David Bradley , Todd Eckhardt , Ryan Jones , Richard Wade
IPC分类号： G01L1/00 , H01L21/50
CPC分类号： G01L1/18 , G01L1/2231 , H01L2224/48091 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A force sensor apparatus and method of forming the same. The apparatus includes a force sense element that can be attached to a substrate. An actuator disposed in a hole formed within the cap is operably coupled to the force sense element for transferring force to the sense element in response to receiving a force from an external source. The force sense element is configured to sense the external force and generate an output signal representing the force. Preferably, one or more bond pads, associated with the force sense element and the substrate, can be electrically connected via wire bonding. A cover associated with an integrated flexible membrane can be mounted on the substrate in order to protect internal components associated with the force sensor apparatus from an external environment.
摘要翻译：力传感器装置及其形成方法。该装置包括可附接到基底的力感测元件。设置在形成在盖中的孔中的致动器可操作地联接到力感测元件，用于响应于接收来自外部源的力而将力传递到感测元件。力感测元件被配置为感测外力并产生表示力的输出信号。优选地，与力感测元件和衬底相关联的一个或多个接合焊盘可以经由引线接合电连接。与集成柔性膜相关联的盖可以安装在基板上，以便将与力传感器装置相关联的内部部件与外部环境保护起来。

10. 发明申请

US20120144921A1 INCREASED SENSOR DIE ADHESION 失效
标题翻译：增加传感器胶粘剂
公开(公告)号：US20120144921A1
公开(公告)日：2012-06-14
申请号：US12965469
申请日：2010-12-10
申请人： Alistair David Bradley , Lamar Floyd Ricks , Richard Alan Davis
发明人： Alistair David Bradley , Lamar Floyd Ricks , Richard Alan Davis
IPC分类号： G01L9/06 , G01R3/00
CPC分类号： G01L19/147 , H01L2224/48091 , H01L2224/48137 , H01L2924/10253 , Y10T29/49007 , H01L2924/00014 , H01L2924/00
摘要： Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.
摘要翻译：描述了用于将传感器管芯粘合到基底上的方法和装置。在一些情况下，传感器组件可以包括用粘合剂安装到基底的压力传感器模具。压力传感器芯片可以被制造成包括具有一个或多个粘合特征（例如凹部或凹陷）的背面，其增加与粘合剂接触的压力传感器模具的表面积，从而增加粘合力之间。在一些情况下，一个或多个粘合特征可以限定压力传感器管芯和粘合剂之间的非平面界面，在一些情况下，这可以减少粘合剂中裂纹的形成和/或传播，这也可能有助于增加其间的粘合力。

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