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    • 2. 发明申请
    • EMI spring configuration
    • EMI弹簧配置
    • US20030128533A1
    • 2003-07-10
    • US10345769
    • 2003-01-16
    • International Business Machines Corporation
    • Dennis R. BarringerHarold M. Toffler
    • H05K007/14H05K007/18
    • H05K9/0062
    • An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.
    • 插入到印刷电路母板中的用于基于盒的印刷电路卡的电磁屏蔽系统包括卡片系统和板级系统,其在卡插入时电连接以提供更有效的EMI屏蔽系统。 即使卡片插入操作发生,卡片卡舌上的插销也提供连续的EMI屏蔽。 卡级和电路板级系统之间的主要连接由柔性屏蔽带提供,该屏蔽带与导电板加强件中的孔配合,并且不仅接触导电盒边框,而且还接触布置在印刷电路卡上的EMI屏蔽板 。
    • 6. 发明申请
    • Segmented architecture for wafer test & burn-in
    • 晶圆测试和老化的分段架构
    • US20010050567A1
    • 2001-12-13
    • US09887211
    • 2001-06-22
    • International Business Machines Corporation
    • Thomas W. BachelderDennis R. BarringerDennis R. ContiJames M. CraftsDavid L. GardellPaul M. GaschkeMark R. LaforceCharles H. PerryRoger R. SchmidtJoseph J. Van HornWade H. White
    • G01R031/02
    • G01R31/2863
    • An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burn-in to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation. Evacuation also provides atmospheric pressure augmentation of contact for connection between boards and contact to wafer. Probes for parallel testing of chips are arranged in crescent shaped stripes to significantly increase tester throughput as compared with probes arranged in an area array.
    • 用于在产品晶片上同时测试或燃烧大量集成电路芯片的装置包括安装在第一板上的探针和安装在第二板上的测试器芯片,连接两个板的电连接器。 测试器芯片用于向产品芯片分配电力或用于测试产品芯片。 其所附接的探针和薄膜布线被个性化以用于被探测的特定晶片的焊盘覆盖区。 第一板和第二板的基座对于产品系列中的所有晶片都保持不变。 使用两块板可以使测试仪芯片在老化期间保持在比产品芯片低得多的温度,以延长测试芯片的使用寿命。 间隙可以用作板之间的绝热,并将间隙密封并抽真空以进行进一步的隔热。 疏散还提供大气压力增加的接触,用于连接板和与晶片的接触。 用于平行测试芯片的探针被布置成月牙形条纹,以便与布置在区域阵列中的探针相比显着增加测试仪的吞吐量。
    • 8. 发明申请
    • DYNAMICALLY MOVEABLE EXHAUSTING EMC SEALING SYSTEM
    • 动态驱动EMC密封系统
    • US20030226676A1
    • 2003-12-11
    • US10161930
    • 2002-06-05
    • International Business Machines Corporation
    • Dennis R. BarringerEdward J. SeminaroHarold M. Toffler
    • H05K009/00
    • H05K9/0015
    • A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the EMC gasket therebetween.
    • 一种用于印刷电路板的对接装置,包括一个盒体,具有壳体基座,一个壳体盖和一个壳体壁,其中壳体基座和壳体壁相对于彼此设置,以便限定用于容纳印刷 电路卡,并且其中所述壳体壁包括布置成与所述壳体腔室连通的电缆开口,壳体边框,其相对于所述盒壳体设置成与所述电缆开口相关联,所述壳体边框包括外部边框,所述外部边框具有 第一多个开口和具有第二多个孔的内表圈,所述内边框与所述印刷电路卡电连通,其中所述壳体边框是可移除的,以及设置在所述外壳边框的外挡板和内挡板之间的EMC垫圈 ,所述EMC垫圈被配置为在电缆开口附近提供可移除的EMC密封,同时仍允许气流通过第一和第二多个 的孔之间具有EMC垫片。