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1. 发明申请

US20040150976A1 Connection device 审中-公开
标题翻译：连接设备
公开(公告)号：US20040150976A1
公开(公告)日：2004-08-05
申请号：US10763737
申请日：2004-01-22
发明人： Lien-Wen Chang , Ko-Hsien Lee , Chien-Ming Li
IPC分类号： H05K007/02 , H05K007/04
CPC分类号： F16B5/065 , F16B5/0664 , F16B19/1081
摘要： The present invention provides a connection device connecting a first shell of a first electronic product to a second shell of a second electronic product. The connection device includes a rivet pin having a first part and a second part, a bolt head between them, and a rivet body for engaging with the second shell. The first part of the rivet pin is provided with threads for gripping the wall of the first shell. The rivet body is provided with a slot allowing the second part of the rivet pin to pass through and engage with the rivet body to connect the second shell to the first shell.
摘要翻译：本发明提供一种将第一电子产品的第一壳与第二电子产品的第二壳连接的连接装置。连接装置包括具有第一部分和第二部分的铆钉销，它们之间的螺栓头和用于与第二壳体接合的铆钉体。铆钉的第一部分提供有用于夹紧第一壳的壁的螺纹。铆钉体设置有允许铆钉的第二部分穿过并与铆钉体接合以将第二壳体连接到第一壳体的槽。

2. 发明申请

US20040150975A1 Image sensor having a frame layer formed with a venthole 审中-公开
标题翻译：图像传感器具有形成有通气孔的框架层
公开(公告)号：US20040150975A1
公开(公告)日：2004-08-05
申请号：US10356757
申请日：2003-01-30
发明人： Jackson Hsieh , Jichen Wu , Bruce Chen , Sam Hiew , Jian-Hsian Lu , Wen-Yang Chang
IPC分类号： H05K007/02 , H05K007/04
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An improved structure of an image sensor includes a substrate, a frame layer on the substrate to form a chamber together with the substrate, a photosensitive chip arranged on the substrate and within the chamber, a plurality of wires, a transparent layer placed on the frame layer, and a filling medium. The frame layer is formed with at least one venthole communicating with the chamber. The wires electrically connect the chip to the substrate. The filling medium is filled into the venthole of the frame layer to seal the chamber. Accordingly, the air pressure within the chamber generated when the transparent layer is fixed to the frame layer may be released through the venthole, and the transparent layer may be firmly fixed to the frame layer.
摘要翻译：图像传感器的改进的结构包括基板，基板上的框架层，与基板一起形成室，布置在基板上和室内的感光芯片，多根导线，放置在框架上的透明层层和填充介质。框架层形成有与腔室连通的至少一个通气孔。电线将芯片电连接到基板。将填充介质填充到框架层的通气孔中以密封室。因此，当透明层固定到框架层时产生的室内的空气压力可以通过通气孔释放，并且透明层可以牢固地固定到框架层。

3. 发明申请

US20040136170A1 Capacitor device and fabricating method thereof 失效
标题翻译：电容器件及其制造方法
公开(公告)号：US20040136170A1
公开(公告)日：2004-07-15
申请号：US10734290
申请日：2003-12-15
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Minoru Tsunezaki , Tsuyoshi Yoshino
IPC分类号： H05K007/02 , H05K007/04
CPC分类号： H01G2/04 , H05K3/301 , H05K7/12 , H05K2201/10015 , H05K2201/10606 , Y10T29/4913
摘要： The invention relates to a capacitor device comprising the combination of a cylindrical capacitor and a holder for holding the capacitor in a sideways position. The holder includes a capacitor holding part that has an opening at the top and is arc-shaped in cross section, and a mounting part for mounting the holder itself to another device. The capacitor is held in a sideways position in the holding part of the holder with a heat shrinking resin tube interposed therebetween. Accordingly, the height of the capacitor device is reduced, so that the size of the capacitor device can be reduced. In addition, the connection distance between the capacitor device and another electronic device is shortened, so that the inductance can be made smaller.
摘要翻译：本发明涉及一种电容器装置，其包括圆柱形电容器和用于将电容器保持在侧面位置的保持器的组合。保持器包括电容器保持部分，其在顶部具有开口并且具有横截面的弧形，以及用于将保持器本身安装到另一装置的安装部。电容器被保持在保持器的保持部分的侧向位置，其间插有热收缩树脂管。因此，电容器器件的高度减小，从而可以减小电容器器件的尺寸。此外，电容器装置与另一电子装置之间的连接距离缩短，使得可以使电感更小。

4. 发明申请

US20030210534A1 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 有权
标题翻译：集成电路管芯和具有三维互连方案的电子组件
公开(公告)号：US20030210534A1
公开(公告)日：2003-11-13
申请号：US10112961
申请日：2002-03-28
发明人： Johanna M. Swan , Bala Natarajan , Chien Chiang , Greg Atwood , Valluri R. Rao
IPC分类号： H05K007/04 , H05K007/02
CPC分类号： H01L25/0657 , H01L21/76898 , H01L23/481 , H01L25/50 , H01L2224/16 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , Y10T29/49155 , Y10T29/49165
摘要： An electronic assembly is assembled by stacking two or more integrated circuit dies on top of one another. Prior to singulation, an opening is laser-drilled into an upper die, and subsequently filled with a conductive member. The conductive member is located on a lower die and interconnects integrated circuits of the upper and lower dies. Laser-drilling allows for faster throughput when compared to, for example, etching, especially if a small number of openings has to be formed. The opening is laser-drilled from an upper surface of the upper die all the way through the die, which allows for the use of alignment marks on an upper surface of the upper die.
摘要翻译：通过将两个或更多个集成电路管芯堆叠在一起而组装电子组件。在分割之前，将开口激光钻到上模中，随后填充导电构件。导电构件位于下模上并互连上模和下模的集成电路。当与例如蚀刻相比时，激光钻孔允许更快的生产量，特别是如果必须形成少量的开口。该开口从上模的上表面一直穿过模具被激光钻孔，这允许在上模的上表面上使用对准标记。

5. 发明申请

US20030147229A1 Integrated circuit component carrier with angled supporting and retaining surfaces 失效
标题翻译：集成电路组件载体，具有成角度的支撑和保持面
公开(公告)号：US20030147229A1
公开(公告)日：2003-08-07
申请号：US10140089
申请日：2002-05-07
发明人： Song Ping Chen , Ru Zheng Liu , Joo Yam Lau
IPC分类号： H05K007/02 , H05K007/04
CPC分类号： H01L21/67333 , H01L2221/68313
摘要： A carrier for handling integrated circuit components during storage and shipping includes a plurality of pocket portions each for supporting an individual component. The pocket portions include a base surface and a plurality of sidewalls defining the pocket generally. The sidewalls include support surfaces arranged at a first, oblique angle relative to the base surface. A plurality of retainer surfaces are associated with at least some of the support surfaces. The retainer surfaces extend at a second angle relative to the base surface. The retainer surfaces cooperate with the support surfaces to maintain the integrated circuit components within the pockets in a desired alignment throughout handling. One example includes guide surfaces that facilitate inserting the components into the pockets.
摘要翻译：用于在存储和运输期间处理集成电路部件的载体包括多个用于支撑单个部件的袋部。袋部分包括基部表面和大体上限定袋的多个侧壁。侧壁包括相对于基面以第一倾斜角布置的支撑表面。多个保持器表面与至少一些支撑表面相关联。保持器表面相对于基面以第二角度延伸。保持器表面与支撑表面配合，以便在整个处理期间将集成电路部件保持在凹槽内期望的对准。一个例子包括便于将部件插入袋中的引导表面。

6. 发明申请

US20020181212A1 Mounting system for circuit board 审中-公开
公开(公告)号：US20020181212A1
公开(公告)日：2002-12-05
申请号：US10200839
申请日：2002-07-22
发明人： David M. Paquin , Carl E. Davis , George Megason
IPC分类号： H05K005/00 , H05K005/04 , H05K005/06 , H05K007/02 , H05K007/04
CPC分类号： H05K7/142
摘要： A system for facilitating the mounting of circuit boards within an enclosure. The system includes one or more standoffs that are each received through appropriately formed corresponding openings through a printed circuit board. A flexible clip is attached to the printed circuit board proximate each opening. Each clip includes a retainer portion designed to receive the head of the standoff. Thus, the printed circuit board may be attached to the standoffs simply by placing the circuit board openings over the standoffs and moving the printed circuit board laterally until the clips and standoffs are engaged.

7. 发明申请

US20020006035A1 Compact electronic circuit unit having circulator, manufactured with high productivity 失效
标题翻译：具有循环器的紧凑型电子电路单元，生产率高
公开(公告)号：US20020006035A1
公开(公告)日：2002-01-17
申请号：US09904950
申请日：2001-07-12
申请人： Alps Electric Co., Ltd
发明人： Yuichi Shimizu , Nobuhiko Suzuki
IPC分类号： H05K007/02 , H05K007/04 , H05K007/10 , H05K007/12
CPC分类号： H01P1/387 , H05K1/095 , H05K1/165 , H05K1/182 , H05K3/4611 , H05K2201/0187 , H05K2201/086 , H05K2201/09254 , H05K2201/10416 , H05K2203/0545
摘要： An electronic circuit unit having a circulator is formed of a circuit board made by laminating a plurality of dielectric substrates; first, second, and third central conductors disposed at intervals of 120 degrees on a plurality of dielectric substrates and partially intersecting in the upper and lower directions; a magnet and a ferrite member disposed above and below the intersection of the central conductors; a first yoke 10 covering the outside of the magnet; and a second yoke 11 covering the outside of the ferrite member. One end of each of the central conductors serves as an input and output terminal, and the ends are disposed at intervals of 120 degrees. Adjacent input and output terminals are connected by inductive elements.
摘要翻译：具有循环器的电子电路单元由层叠多个电介质基板而制成的电路基板形成，第一中心导体，第二中心导体和第三中心导体，其设置在多个电介质基板上的120度的间隔，并且在上下方向上部分相交; 设置在所述中心导体的交叉点的上方和下方的磁体和铁氧体部件; 覆盖磁体外部的第一磁轭10; 以及覆盖铁氧体部件外侧的第二磁轭11。每个中心导体的一端用作输入和输出端子，并且端部以120度的间隔设置。相邻的输入和输出端子通过电感元件连接。

8. 发明申请

US20040257785A1 Assembly for supporting expansion card motherboard 有权
标题翻译：组装支持扩展卡主板
公开(公告)号：US20040257785A1
公开(公告)日：2004-12-23
申请号：US10600440
申请日：2003-06-23
申请人： INVENTEC CORPORATION
发明人： Kuei-Hua Chen
IPC分类号： H05K007/02 , H05K007/04
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , H05K7/142
摘要： The present invention is to provide a support assembly for holding up an expansion card on a motherboard of an electronic device, which comprises a pedestal having a pivotal carrier pivotably coupled to an upper part thereof and comprising a horizontal trough adjacent a top. In response to an insertion of the expansion card into an expansion slot of the motherboard by means of a dummy adapter, an edge of the expansion card is urged on a bottom distal end of a trough in the dummy adapter, and the edge of the expansion card is adapted to cling into the trough for fastening by turning the pivotal carrier.
摘要翻译：本发明提供一种用于在电子设备的母板上夹住扩展卡的支撑组件，该支撑组件包括具有可枢转地联接到其上部并且包括与顶部相邻的水平槽的枢转托架的基座。响应于通过虚拟适配器将扩展卡插入主板的扩展槽中，扩展卡的边缘被迫在虚拟适配器中的槽的底部远端上，并且扩展的边缘卡适于通过转动枢转托架来紧固到槽中以进行紧固。

9. 发明申请

US20040252473A1 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US20040252473A1
公开(公告)日：2004-12-16
申请号：US10863351
申请日：2004-06-09
申请人： MITSUBISHI DENKI KABUSHIKI KAISHA
发明人： Amane Mitani
IPC分类号： H01H009/04 , H01H019/04 , H01H021/06 , H01H013/10 , H01H019/08 , H01H009/02 , H01H013/04 , H01H021/04 , H01H021/10 , H01H009/06 , H01H013/08 , H01H021/12 , H05K007/02 , H05K007/04
CPC分类号： H01H1/5805 , H01H2003/026 , H05K1/0271 , H05K1/18 , H05K2201/09127
摘要： A chassis built in a panel is provided with a supporter for supporting a printed wiring board mounted with an electronic component, and the printed wiring board is provided with a board-opening portion in the proximity of this supporter. When a load F applied on a knob from a predetermined direction, the printed wiring board can be ruptured from the board-opening portion to get detached from the supporter, thereby lowering the height of the outward projection of the knob from the panel.
摘要翻译：设置在面板中的底盘设置有用于支撑安装有电子部件的印刷线路板的支撑件，并且印刷线路板在该支撑件附近设置有板开口部。当从预定方向施加在旋钮上的负载F时，印刷布线板可以从板开口部分破裂以从支撑件脱离，从而降低旋钮与面板的向外突出的高度。

10. 发明申请

US20040184254A1 Placement structure of an integrated motherboard for small form factor computer 有权
标题翻译：小型计算机集成主板的放置结构
公开(公告)号：US20040184254A1
公开(公告)日：2004-09-23
申请号：US10631462
申请日：2003-07-31
发明人： Kuo Yi-Lung
IPC分类号： H05K007/02 , H05K007/04
CPC分类号： G06F1/20 , G06F1/18 , H05K1/14 , H05K1/18
摘要： An integrated motherboard for a small form factor computer comprises a CPU socket located in a central region of the motherboard. A south bridge/north bridge chipset is located next to the CPU socket towards the front of the motherboard, and a memory module is located next to the south bridge/north bridge chipset towards the front of the motherboard. One or more PCI slots are located on one side of the CPU socket, and a power module is located on the other side of the CPU socket.
摘要翻译：用于小型计算机的集成主板包括位于母板中心区域的CPU插座。南桥/北桥芯片组位于靠近主板前部的CPU插座旁边，并且内置模块位于南桥/北桥芯片组旁边，朝向主板前方。一个或多个PCI插槽位于CPU插槽的一侧，电源模块位于CPU插槽的另一侧。

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