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1. 发明申请

US20080090372A1 Method of manufacturing coil 审中-公开
标题翻译：制造线圈的方法
公开(公告)号：US20080090372A1
公开(公告)日：2008-04-17
申请号：US11785146
申请日：2007-04-16
申请人： Hyun-ku Jeong , Seok-jin Kang , Seok-whan Chung
发明人： Hyun-ku Jeong , Seok-jin Kang , Seok-whan Chung
IPC分类号： H01L21/20
CPC分类号： H01L28/10 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing a coil for a micro-actuator. The method of manufacturing a coil for a micro-actuator includes preparing a substrate, forming a plurality of trenches for forming a coil on the substrate, covering portions on the substrate with a masking layer except for the plurality of trenches, electroplating the plurality of trenches with a conductive material, and forming a passivation layer on the substrate. Consistent with the method, variations in sections of a coil can be reduced by minimizing bending and warping of a wafer, and therefore a driving current applied to a coil and power consumption can be reduced.
摘要翻译：一种制造用于微致动器的线圈的方法。制造微致动器用线圈的方法包括：准备基板，在基板上形成多个用于形成线圈的沟槽，用除了多个沟槽之外的掩模层覆盖基板上的部分，对多个沟槽进行电镀具有导电材料，并在基底上形成钝化层。与该方法一致，可以通过使晶片的弯曲和翘曲最小化来减小线圈的截面的变化，因此可以降低施加到线圈的驱动电流和功率消耗。

2. 发明申请

US20070284964A1 MICRO-ELECTRO MECHANICAL SYSTEM DEVICE AND METHOD OF FORMING COMB ELECTRODES OF THE SAME 审中-公开
标题翻译：微电子机械系统装置及其组合电极的形成方法
公开(公告)号：US20070284964A1
公开(公告)日：2007-12-13
申请号：US11754414
申请日：2007-05-29
申请人： Seok-whan Chung , Seok-jin Kang , Hyung Choi , Hyun-ku Jeong
发明人： Seok-whan Chung , Seok-jin Kang , Hyung Choi , Hyun-ku Jeong
IPC分类号： H01G9/00 , H02N1/00
CPC分类号： G02B26/0841 , B81B3/0086 , B81B2203/0136 , B81C1/00698
摘要： A micro-electro mechanical system (MEMS) device and a method of forming comb electrodes of the MEMS device are provided. The method includes forming a plurality of parallel trenches at regular intervals in one side of a first silicon substrate so as to define alternating first and second regions at different heights on the one side of the first silicon substrate, oxidizing the first silicon substrate in order to form an oxide layer in the first and second regions having different heights, forming a polysilicon layer on the oxide layer to at least fill up the trenches so as to level the oxide layer having different heights, bonding a second silicon substrate directly to a top surface of the polysilicon layer, selectively etching the second silicon substrate and the polysilicon layer using a first mask so as to form upper comb electrodes vertically aligned with the first regions, selectively etching the first silicon substrate using a second mask so as to form lower comb electrodes vertically aligned with the second regions, and removing the oxide layer interposed between the upper comb electrodes and the lower comb electrodes.
摘要翻译：提供了微电子机械系统（MEMS）装置和形成MEMS装置的梳状电极的方法。该方法包括在第一硅衬底的一侧中以规则的间隔形成多个平行的沟槽，以便在第一硅衬底的一侧上限定不同高度的交替的第一和第二区域，氧化第一硅衬底，以便在具有不同高度的第一和第二区域中形成氧化物层，在氧化物层上形成多晶硅层以至少填充沟槽，以使具有不同高度的氧化物层平坦化，将第二硅衬底直接接合到顶表面使用第一掩模选择性地蚀刻第二硅衬底和多晶硅层，以形成与第一区域垂直对准的上梳状电极，使用第二掩模选择性地蚀刻第一硅衬底，从而形成下梳状电极与第二区域垂直对准，以及去除介于上梳状电极和上梳状电极之间的氧化物层下梳电极。

3. 发明授权

US07084073B2 Method of forming a via hole through a glass wafer 有权
标题翻译：通过玻璃晶片形成通孔的方法
公开(公告)号：US07084073B2
公开(公告)日：2006-08-01
申请号：US10681217
申请日：2003-10-09
申请人： Moon-chul Lee , Hyung Choi , Kyu-dong Jung , Mi Jang , Seog-woo Hong , Seok-whan Chung , Chan-bong Jun , Seok-jin Kang
发明人： Moon-chul Lee , Hyung Choi , Kyu-dong Jung , Mi Jang , Seog-woo Hong , Seok-whan Chung , Chan-bong Jun , Seok-jin Kang
IPC分类号： H01L21/302
CPC分类号： B81C1/00087 , H01L21/486 , H01L23/13 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a via hole through a glass wafer includes depositing a material layer on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer, forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole, eliminating any remaining patterning material used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole is etched to form a via hole having a smooth surface and extending through the glass wafer, and eliminating the material layer. The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.
摘要翻译：通过玻璃晶片形成通孔的方法包括在玻璃晶片的外表面上沉积材料层，该材料层的选择比率高于玻璃晶片的选择比，在玻璃晶片的一侧上形成通孔图案部分所述材料层进行蚀刻所述通路图案部分以形成预备通孔的第一蚀刻，消除在形成所述通路图案部分中使用的剩余图案材料，进行第二蚀刻，其中所述预通孔被蚀刻以形成具有光滑表面并延伸穿过玻璃晶片的通孔，并且消除材料层。根据本发明的方法能够通过玻璃晶片形成通孔，而不会形成底切或微小的裂缝，从而提高MEMS元件的成品率和可靠性。

4. 发明授权

US07172916B2 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 失效
标题翻译：将微机电系统真空安装在基板上的方法和装置
公开(公告)号：US07172916B2
公开(公告)日：2007-02-06
申请号：US10701552
申请日：2003-11-06
申请人： Kyu-dong Jung , Chan-Bong Jun , Hyung Choi , Seok-jin Kang , Seog-woo Hong , Seok-whan Chung , Moon-chul Lee , Eun-sung Lee
发明人： Kyu-dong Jung , Chan-Bong Jun , Hyung Choi , Seok-jin Kang , Seog-woo Hong , Seok-whan Chung , Moon-chul Lee , Eun-sung Lee
IPC分类号： H01L21/00
CPC分类号： B81C1/00285
摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.
摘要翻译：用于真空安装至少一个微机电系统（MEMS）在基板上的方法和装置包括用于将惰性气体注入真空室的气体注入部分; 用于对准半导体衬底和盖的衬底对准部分，所述盖具有形成在其中的空腔和附着到腔的内表面的吸气剂; 用于将半导体衬底和盖结合在一起的接合部分; 以及控制部分，用于控制衬底对准部分以对准半导体和盖子，用于控制气体注入部分以将惰性气体注入真空室中，并且用于控制接合部分将半导体衬底和盖子结合在一起，之后注入惰性气体。

5. 发明授权

US06835594B2 Metal wiring method for an undercut 有权
公开(公告)号：US06835594B2
公开(公告)日：2004-12-28
申请号：US10686769
申请日：2003-10-17
申请人： Ci-moo Shong , Seok-jin Kang , Seok-whan Chung , Moon-chul Lee , Kyu-dong Jung , Jong-seok Kim , Chan-bong Jun , Seog-woo Hong , Jung-ho Kang
发明人： Ci-moo Shong , Seok-jin Kang , Seok-whan Chung , Moon-chul Lee , Kyu-dong Jung , Jong-seok Kim , Chan-bong Jun , Seog-woo Hong , Jung-ho Kang
IPC分类号： H01L2144
CPC分类号： B81B7/0006 , H01L21/76877 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-mealing the deposited thin metal film. By the ion-mealing, the method is capable of connecting a metal wiring to a via hole having an undercut.

6. 发明授权

US08557044B2 Shadow mask, method of manufacturing the same and method of forming thin film using the same 有权
标题翻译：荫罩，其制造方法以及使用其形成薄膜的方法
公开(公告)号：US08557044B2
公开(公告)日：2013-10-15
申请号：US11730120
申请日：2007-03-29
申请人： Seok-whan Chung , Seok-jin Kang , Hyun-koo Jeong
发明人： Seok-whan Chung , Seok-jin Kang , Hyun-koo Jeong
IPC分类号： C23C16/50 , C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： B81C1/00396 , B81C2201/0198
摘要： A shadow mask, a method of manufacturing the shadow mask, and a method of forming a thin film using the shadow mask are provided. The shadow mask includes an upper layer and a lower layer. The upper layer includes a first opening. The lower layer is formed on a lower surface of the upper layer around the first opening and includes an opening having the same size as the first opening. When the thin film is formed using the shadow mask, the lower layer of the shadow mask is close to the edge of a cavity of a substrate, and a position on which the thin film may be formed as defined by the lower layer of the shadow mask. Therefore, the thickness of the thin film can be uniform.
摘要翻译：提供荫罩，荫罩的制造方法以及使用荫罩形成薄膜的方法。荫罩包括上层和下层。上层包括第一开口。下层形成在第一开口周围的上层的下表面上，并且包括具有与第一开口相同尺寸的开口。当使用荫罩形成薄膜时，荫罩的下层靠近基板的空腔的边缘，并且可以由薄膜的下层限定薄膜的位置面具。因此，薄膜的厚度可以是均匀的。

7. 发明申请

US20080088221A1 Shadow mask, method of manufacturing the same and method of forming thin film using the same 有权
标题翻译：荫罩，其制造方法以及使用其形成薄膜的方法
公开(公告)号：US20080088221A1
公开(公告)日：2008-04-17
申请号：US11730120
申请日：2007-03-29
申请人： Seok-whan Chung , Seok-jin Kang , Hyun-koo Jeong
发明人： Seok-whan Chung , Seok-jin Kang , Hyun-koo Jeong
IPC分类号： H01J29/80
CPC分类号： B81C1/00396 , B81C2201/0198
摘要： A shadow mask, a method of manufacturing the shadow mask, and a method of forming a thin film using the shadow mask are provided. The shadow mask includes an upper layer and a lower layer. The upper layer includes a first opening. The lower layer is formed on a lower surface of the upper layer around the first opening and includes an opening having the same size as the first opening. When the thin film is formed using the shadow mask, the lower layer of the shadow mask is close to the edge of a cavity of a substrate, and a position on which the thin film may be formed as defined by the lower layer of the shadow mask. Therefore, the thickness of the thin film can be uniform.
摘要翻译：提供荫罩，荫罩的制造方法以及使用荫罩形成薄膜的方法。荫罩包括上层和下层。上层包括第一开口。下层形成在第一开口周围的上层的下表面上，并且包括具有与第一开口相同尺寸的开口。当使用荫罩形成薄膜时，荫罩的下层靠近基板的空腔的边缘，并且可以由薄膜的下层限定薄膜的位置面具。因此，薄膜的厚度可以是均匀的。

8. 发明授权

US06952965B2 Vertical MEMS gyroscope by horizontal driving 有权
标题翻译：垂直MEMS陀螺仪通过水平驱动
公开(公告)号：US06952965B2
公开(公告)日：2005-10-11
申请号：US10744099
申请日：2003-12-24
申请人： Seok-jin Kang , Seok-whan Chung , Moon-chul Lee , Kyu-dong Jung , Seog-soo Hong
发明人： Seok-jin Kang , Seok-whan Chung , Moon-chul Lee , Kyu-dong Jung , Seog-soo Hong
IPC分类号： B81B7/00 , B81B3/00 , B81B5/00 , B81C1/00 , G01C19/56 , G01C19/5762 , G01C19/5769 , G01P9/04
CPC分类号： G01C19/5762 , B81B3/0059 , B81B2201/0242 , B81B2203/051 , B81B2203/053
摘要： A vertical MEMS gyroscope by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to an upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detecting structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detecting structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detecting structure in the vertical direction.
摘要翻译：通过水平驱动的垂直MEMS陀螺仪包括基板，固定在基板的区域的上表面上的支撑层，浮动在基板上方并具有固定到支撑层的上表面的部分的驱动结构，平行于固定部分，驱动结构具有能够在与基板平行的预定方向上振动的预定区域;检测结构，其在与驱动结构相同的平面上固定到驱动结构，并且具有能够振动的预定区域在相对于基板的垂直方向上，与位于驱动结构上方的基板接合的盖晶片和检测结构，以及形成在盖晶片的下侧的预定位置处的固定垂直位移检测电极，用于检测位移的检测结构。

9. 发明申请

US20080007376A1 Micro electro mechanical system device 失效
标题翻译：微机电系统装置
公开(公告)号：US20080007376A1
公开(公告)日：2008-01-10
申请号：US11711057
申请日：2007-02-27
申请人： Hee-moon Jeong , Seok-jin Kang , Jin-woo Cho , Young-chul KO , Hyun-ku Jeong
发明人： Hee-moon Jeong , Seok-jin Kang , Jin-woo Cho , Young-chul KO , Hyun-ku Jeong
IPC分类号： H01F7/08 , G01R27/26
CPC分类号： G02B26/085 , H01F7/066 , H01F2007/068
摘要： A micro electro mechanical system (MEMS) device is provided. The MEMS device includes: a stage which operates in a vibration mode; an axle which supports the stage and allows rotation of the stage; and a capacitive sensor which detects rotation of the stage. The capacitive sensor includes: a sensing arm which extends from the stage; driving combs which extend from the sensing arm and rotated together with the stage; fixed combs which are fixedly supported for engagement with the driving combs, the fixed combs including surfaces overlapping opposite surfaces of the driving combs in accordance with the rotation of the driving combs; and a capacitance sensing portion which detects a capacitance change of the driving combs and the fixed combs. Therefore, the MEMS device performs precise scanning by structurally preventing deformation of the stage having a light reflecting surface.
摘要翻译：提供了微机电系统（MEMS）装置。 MEMS器件包括：以振动模式操作的级; 支撑舞台并允许舞台旋转的轴; 以及检测台的旋转的电容式传感器。该电容传感器包括：从该台延伸的感测臂; 驱动梳子，其从感测臂延伸并与舞台一起旋转; 固定梳子，其被固定地支撑以与驱动梳状物接合，固定梳根据驱动梳的旋转包括与驱动梳的相对表面重叠的表面; 以及电容感测部，其检测驱动梳和固定梳的电容变化。因此，MEMS器件通过结构防止具有光反射表面的台的变形来执行精确的扫描。

10. 发明授权

US07750767B2 Micro electro mechanical system device 失效
标题翻译：微机电系统装置
公开(公告)号：US07750767B2
公开(公告)日：2010-07-06
申请号：US11711057
申请日：2007-02-27
申请人： Hee-moon Jeong , Seok-jin Kang , Jin-woo Cho , Young-chul Ko , Hyun-ku Jeong
发明人： Hee-moon Jeong , Seok-jin Kang , Jin-woo Cho , Young-chul Ko , Hyun-ku Jeong
IPC分类号： H01H51/22
CPC分类号： G02B26/085 , H01F7/066 , H01F2007/068
摘要： A micro electro mechanical system (MEMS) device is provided. The MEMS device includes: a stage which operates in a vibration mode; an axle which supports the stage and allows rotation of the stage; and a capacitive sensor which detects rotation of the stage. The capacitive sensor includes: a sensing arm which extends from the stage; driving combs which extend from the sensing arm and rotated together with the stage; fixed combs which are fixedly supported for engagement with the driving combs, the fixed combs including surfaces overlapping opposite surfaces of the driving combs in accordance with the rotation of the driving combs; and a capacitance sensing portion which detects a capacitance change of the driving combs and the fixed combs. Therefore, the MEMS device performs precise scanning by structurally preventing deformation of the stage having a light reflecting surface.
摘要翻译：提供了微机电系统（MEMS）装置。 MEMS器件包括：以振动模式操作的级; 支撑舞台并允许舞台旋转的轴; 以及检测台的旋转的电容式传感器。该电容传感器包括：从该台延伸的感测臂; 驱动梳子，其从感测臂延伸并与舞台一起旋转; 固定梳子，其被固定地支撑以与驱动梳状物接合，固定梳根据驱动梳的旋转包括与驱动梳的相对表面重叠的表面; 以及电容感测部，其检测驱动梳和固定梳的电容变化。因此，MEMS器件通过结构防止具有光反射表面的台的变形来执行精确的扫描。

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