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1. 发明申请

US20060121258A1 Sol composition for dielectric ceramic, and dielectric ceramic and multilayered ceramic capacitor using the same 审中-公开
标题翻译：电介质陶瓷的溶胶组合物，以及使用其的介电陶瓷和多层陶瓷电容器
公开(公告)号：US20060121258A1
公开(公告)日：2006-06-08
申请号：US11052796
申请日：2005-02-09
申请人： Yong Kim , Hyo Shin , Hyoung Kim , Ho Choo , Jung Lee
发明人： Yong Kim , Hyo Shin , Hyoung Kim , Ho Choo , Jung Lee
IPC分类号： B32B18/00 , B32B15/04
CPC分类号： C04B35/624 , C04B35/468 , C04B35/62218 , C04B35/62615 , C04B35/6325 , C04B2235/449 , C04B2235/77 , C04B2235/79 , Y10T428/24926
摘要： Disclosed herein is a sol composition for ultrathin dielectric ceramic films, and dielectric ceramic and a multilayered ceramic capacitor manufactured using the same. The sol composition, composed of BaTiO3 as a main ingredient and an auxiliary ingredient, includes a polymeric sol having a metal precursor solution of BaTiO3 and an organic solvent, and an organic additive dissolved in the organic solvent to act as the auxiliary ingredient, in which the amount of the organic additive corresponds to the required amount of the auxiliary ingredient of the dielectric ceramic. Further, the ultrathin dielectric ceramic film, which is manufactured by a sol-gel process, includes the auxiliary ingredient, and hence, is advantageous in making low temperature sintering possible, and having a high dielectric constant, a high sintered density, and TCC characteristic meeting the X5R of EIA standard.
摘要翻译：本文公开了一种用于超薄介电陶瓷膜的溶胶组合物，以及使用其制造的介电陶瓷和多层陶瓷电容器。以BaTiO 3 3 +作为主要成分和辅助成分组成的溶胶组合物包括具有BaTiO 3 3金属前体溶液和有机溶剂的聚合物溶胶，和溶解在有机溶剂中的有机添加剂用作辅助成分，其中有机添加剂的量对应于所需量的电介质陶瓷的辅助成分。此外，通过溶胶 - 凝胶法制造的超薄介电陶瓷膜包括辅助成分，因此有利于低温烧结成为可能，并且具有高介电常数，高烧结密度和TCC特性符合EIA标准的X5R。

2. 发明申请

US20070251066A1 Multilayer chip capacitor and method for manufacturing the same 失效
标题翻译：多层片式电容器及其制造方法
公开(公告)号：US20070251066A1
公开(公告)日：2007-11-01
申请号：US11822189
申请日：2007-07-03
申请人： Hyoung Kim , Hyo Shin , Ho Choo
发明人： Hyoung Kim , Hyo Shin , Ho Choo
IPC分类号： H01G9/00
CPC分类号： H01G4/232 , H01G4/012 , Y10T29/413 , Y10T29/417 , Y10T29/435
摘要： A multilayer chip capacitor, and a method for manufacturing the same are Provided. The capacitor comprises a capacitor body having a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes formed on the dielectric layers, each of the internal electrodes including a main electrode portion and a lead portion, chip-protecting side members formed on both sides of the capacitor body to contact both sides of the first and second internal electrodes, and a pair of external electrodes formed on the outer surface of the capacitor body. The width of the main electrode portion is the same as that of the dielectric layers, and the width of the lead portion is smaller than that of the dielectric layers.
摘要翻译：提供了一种多层片状电容器及其制造方法。所述电容器包括电容体，所述电容体具有堆叠的多个电介质层，形成在所述电介质层上的多个第一和第二内部电极，每个所述内部电极包括主电极部分和引线部分，形成芯片保护侧部件在电容器本体的两侧接触第一和第二内部电极的两侧，以及形成在电容器本体的外表面上的一对外部电极。主电极部的宽度与电介质层的宽度相同，引线部的宽度小于电介质层的宽度。

3. 发明申请

US20050132548A1 Method for manufacturing multilayer ceramic capacitor 失效
标题翻译：多层陶瓷电容器制造方法
公开(公告)号：US20050132548A1
公开(公告)日：2005-06-23
申请号：US11002183
申请日：2004-12-03
申请人： Ho Choo , Seung Ra , Yong Kim , Jung Lee , Hyo Shin , Hyoung Kim
发明人： Ho Choo , Seung Ra , Yong Kim , Jung Lee , Hyo Shin , Hyoung Kim
IPC分类号： H01G4/005 , H01G4/12 , H01G4/232 , H01G4/30 , H01G9/00 , H01G4/06
CPC分类号： H01G4/005 , H01G4/12 , H01G4/30 , Y10T29/417
摘要： A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.
摘要翻译：一种制造多层陶瓷电容器的方法，其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度，从而允许多层陶瓷电容器具有高容量并且被最小化。该方法包括在每个电介质片上印刷内部电极，并叠放电介质片，其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度设置有内部电极，然后将吸收构件从表面分离，使得部分具有指定厚度的内部电极被去除，并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。

4. 发明申请

US20060139848A1 Multilayer chip capacitor and method for manufacturing the same 失效
标题翻译：多层片式电容器及其制造方法
公开(公告)号：US20060139848A1
公开(公告)日：2006-06-29
申请号：US11272893
申请日：2005-11-15
申请人： Hyoung Kim , Hyo Shin , Ho Choo
发明人： Hyoung Kim , Hyo Shin , Ho Choo
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/012 , Y10T29/413 , Y10T29/417 , Y10T29/435
摘要： A multilayer chip capacitor, and a method for manufacturing the same are Provided. The capacitor comprises a capacitor body having a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes formed on the dielectric layers, each of the internal electrodes including a main electrode portion and a lead portion, chip-protecting side members formed on both sides of the capacitor body to contact both sides of the first and second internal electrodes, and a pair of external electrodes formed on the outer surface of the capacitor body. The width of the main electrode portion is the same as that of the dielectric layers, and the width of the lead portion is smaller than that of the dielectric layers.
摘要翻译：提供了一种多层片状电容器及其制造方法。所述电容器包括电容体，所述电容体具有堆叠的多个电介质层，形成在所述电介质层上的多个第一和第二内部电极，每个所述内部电极包括主电极部分和引线部分，形成芯片保护侧部件在电容器本体的两侧接触第一和第二内部电极的两侧，以及形成在电容器本体的外表面上的一对外部电极。主电极部的宽度与电介质层的宽度相同，引线部的宽度小于电介质层的宽度。

5. 发明申请

US20050128680A1 Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor 失效
标题翻译：通过旋涂和多层陶瓷电容器制造多层陶瓷电容器的方法
公开(公告)号：US20050128680A1
公开(公告)日：2005-06-16
申请号：US11011092
申请日：2004-12-15
申请人： Hyo Shin , Seung Ra , Yong Kim , Hyoung Kim , Ho Choo , Jung Lee
发明人： Hyo Shin , Seung Ra , Yong Kim , Hyoung Kim , Ho Choo , Jung Lee
IPC分类号： H01G4/12 , C04B35/468 , H01G4/30 , H01G9/00 , H01G13/00 , H01G13/04
CPC分类号： H01G4/30 , H01G4/1227 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.
摘要翻译：本文公开了通过旋涂工艺制造多层陶瓷电容器的方法和通过上述方法获得的多层陶瓷电容器。本发明的方法提供了通过旋涂形成的多个电介质层，其中涂覆介电层的过程和印刷内电极的过程可以作为单一工艺提供。因此，在电介质层形成得较薄的同时容易控制电介质层的厚度。此外，由于电介质层和内部电极依次形成，所以可以省略介电层的分离和分层工艺以及压缩陶瓷多层体的工艺。因此，陶瓷多层体不需要被压缩，因此在多层陶瓷电容器中不会发生卷绕现象。

6. 发明申请

US20070212802A1 Method for manufacturing light emitting diode package 审中-公开
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20070212802A1
公开(公告)日：2007-09-13
申请号：US11708471
申请日：2007-02-21
申请人： Hai Lee , Jong Lee , Ho Choo , Myung Chang , Youn Park
发明人： Hai Lee , Jong Lee , Ho Choo , Myung Chang , Youn Park
IPC分类号： H01L21/00
CPC分类号： H01L33/54 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： A method of manufacturing an LED package with improved light extraction efficiency. A light-emitting resin part of an LED package is formed and laser beam is irradiated on a surface of the light-transmitting resin part of the LED package to roughen the surface thereof.
摘要翻译：一种制造具有改善的光提取效率的LED封装的方法。形成LED封装的发光树脂部分，并且在LED封装的透光树脂部分的表面上照射激光束以使其表面粗糙化。

7. 发明申请

US20060271682A1 Method of operating internet protocol address and subnet system using the same 有权
标题翻译：使用相同方式操作互联网协议地址和子网系统
公开(公告)号：US20060271682A1
公开(公告)日：2006-11-30
申请号：US11441981
申请日：2006-05-26
申请人： Ho Choo , Seok Jang
发明人： Ho Choo , Seok Jang
IPC分类号： G06F15/173
CPC分类号： H04L61/2007 , H04L29/12801 , H04L29/12915 , H04L29/12933 , H04L61/6004 , H04L61/6059 , H04L61/6068
摘要： A method of operating an Internet protocol (IP) address that effectively allocates, creates, and processes an interface identifier (ID) of an IP address area, and a subnet system using the same are provided. Allocation is done such that in the IP address area including a subnet prefix area and an Interface ID area, certain bits of the Interface ID area are used as an index area of a subnet gateway. In this case, the allocation is implemented in order from the higher layer to the lower layer so that the Interface ID area is sequentially allocated from the higher bits thereof for the index areas of the respective layers. The combination of the certain bits of the allocated Interface ID and the subnet prefix area of the IP address area is used as the subnet ID of the respective subnet layers. The lowest subnet gateway allocates the Interface ID to terminating equipment trying to access to the IP network based on a format of the IP address.
摘要翻译：提供了一种操作有效地分配，创建和处理IP地址区域的接口标识符（ID）的因特网协议（IP）地址的方法，以及使用其的子网系统。进行分配，使得在包括子网前缀区域和接口ID区域的IP地址区域中，接口ID区域的某些位被用作子网关的索引区域。在这种情况下，按照从较高层到较低层的顺序实施分配，从而从各个层的索引区域的较高位依次分配接口ID区域。分配的接口ID的某些位与IP地址区域的子网前缀区域的组合被用作相应子网层的子网ID。最低的子网关将接口ID分配给尝试根据IP地址格式访问IP网络的终端设备。

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