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    • 4. 发明申请
    • Method for manufacturing multilayer ceramic capacitor
    • 多层陶瓷电容器制造方法
    • US20050132548A1
    • 2005-06-23
    • US11002183
    • 2004-12-03
    • Ho ChooSeung RaYong KimJung LeeHyo ShinHyoung Kim
    • Ho ChooSeung RaYong KimJung LeeHyo ShinHyoung Kim
    • H01G4/005H01G4/12H01G4/232H01G4/30H01G9/00H01G4/06
    • H01G4/005H01G4/12H01G4/30Y10T29/417
    • A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.
    • 一种制造多层陶瓷电容器的方法,其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度,从而允许多层陶瓷电容器具有高容量并且被最小化。 该方法包括在每个电介质片上印刷内部电极,并叠放电介质片,其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度 设置有内部电极,然后将吸收构件从表面分离,使得部分具有指定厚度的内部电极被去除,并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。