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1. 发明授权

US07338854B2 Method for manufacturing multilayer ceramic capacitor 失效
标题翻译：多层陶瓷电容器制造方法
公开(公告)号：US07338854B2
公开(公告)日：2008-03-04
申请号：US11002183
申请日：2004-12-03
申请人： Ho Sung Choo , Seung Hyun Ra , Yong Suk Kim , Jung Woo Lee , Hyo Soon Shin , Hyoung Ho Kim
发明人： Ho Sung Choo , Seung Hyun Ra , Yong Suk Kim , Jung Woo Lee , Hyo Soon Shin , Hyoung Ho Kim
IPC分类号： H01L21/8242
CPC分类号： H01G4/005 , H01G4/12 , H01G4/30 , Y10T29/417
摘要： A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.
摘要翻译：一种制造多层陶瓷电容器的方法，其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度，从而允许多层陶瓷电容器具有高容量并且被最小化。该方法包括在每个电介质片上印刷内部电极，并叠放电介质片，其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度设置有内部电极，然后将吸收构件从表面分离，使得部分具有指定厚度的内部电极被去除，并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。

2. 发明授权

US07203055B2 Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor 失效
标题翻译：通过旋涂和多层陶瓷电容器制造多层陶瓷电容器的方法
公开(公告)号：US07203055B2
公开(公告)日：2007-04-10
申请号：US11011092
申请日：2004-12-15
申请人： Hyo Soon Shin , Seung Hyun Ra , Yong Suk Kim , Hyoung Ho Kim , Ho Sung Choo , Jung Woo Lee
发明人： Hyo Soon Shin , Seung Hyun Ra , Yong Suk Kim , Hyoung Ho Kim , Ho Sung Choo , Jung Woo Lee
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/1227 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.
摘要翻译：本文公开了通过旋涂工艺制造多层陶瓷电容器的方法和通过上述方法获得的多层陶瓷电容器。本发明的方法提供了通过旋涂形成的多个电介质层，其中涂覆介电层的过程和印刷内电极的过程可以作为单一工艺提供。因此，在电介质层形成得较薄的同时容易控制电介质层的厚度。此外，由于电介质层和内部电极依次形成，所以可以省略介电层的分离和分层工艺以及压缩陶瓷多层体的工艺。因此，陶瓷多层体不需要被压缩，因此在多层陶瓷电容器中不会发生卷绕现象。

3. 发明授权

US08012778B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US08012778B2
公开(公告)日：2011-09-06
申请号：US12259576
申请日：2008-10-28
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

4. 发明授权

US07453093B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US07453093B2
公开(公告)日：2008-11-18
申请号：US11489578
申请日：2006-07-20
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L27/15 , H01L23/34
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

5. 发明授权

US07371603B2 Method of fabricating light emitting diode package 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US07371603B2
公开(公告)日：2008-05-13
申请号：US11439189
申请日：2006-05-24
申请人： Yong Suk Kim , Seog Moon Choi , Hyoung Ho Kim , Yong Sik Kim
发明人： Yong Suk Kim , Seog Moon Choi , Hyoung Ho Kim , Yong Sik Kim
IPC分类号： H01L21/00 , H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L33/52 , H01L2224/48091 , H01L2224/48227 , Y10S438/974 , H01L2924/00014
摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
摘要翻译：本发明涉及一种LED封装，并提出一种制造LED封装的方法，包括以下步骤：提供具有与LED连接的LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造至少形成将形成树脂成型部件的封装基板的预定表面积。该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图案电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

6. 发明授权

US09236172B2 Conductor pattern and coil parts having the same 有权
标题翻译：导体图案和具有相同的线圈部件
公开(公告)号：US09236172B2
公开(公告)日：2016-01-12
申请号：US13420540
申请日：2012-03-14
申请人： Sang Moon Lee , Yong Suk Kim , Jeong Bok Kwak , Young Seuck Yoo , Sung Kwon Wi
发明人： Sang Moon Lee , Yong Suk Kim , Jeong Bok Kwak , Young Seuck Yoo , Sung Kwon Wi
IPC分类号： H01F5/00 , H01F27/28
CPC分类号： H01F5/003
摘要： A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.
摘要翻译：在磁性基板上形成为螺旋状的线圈部的导体图案，其包括：主导体图案; 以及形成在主导体图案上的次级导体图案。主导体图案形成为具有电连接到第一水平部分的一个表面的端部的第一水平部分和第一垂直部分的纵向部分。次级导体图案形成为具有包括对应于第一水平部分的第二水平部分的纵向部分和与第二水平部分的一个表面的端部电连接的第二垂直部分。

7. 发明授权

US08704265B2 Light emitting device package and lighting apparatus using the same 有权
标题翻译：发光装置封装及使用其的照明装置
公开(公告)号：US08704265B2
公开(公告)日：2014-04-22
申请号：US12675582
申请日：2008-08-27
申请人： Bu Wan Seo , Sung Woo Kim , Hoon Hur , Yong Suk Kim
发明人： Bu Wan Seo , Sung Woo Kim , Hoon Hur , Yong Suk Kim
IPC分类号： H01L33/00 , H01L29/40 , H01L29/207 , H01L23/48
CPC分类号： H01L25/0753 , H01L33/50 , H01L2224/48137 , H01L2224/48227 , H05B33/0821 , H05B33/0857 , Y02B20/341 , H01L2224/48091 , H01L2924/00014
摘要： In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.
摘要翻译：在一个实施例中，发光器件封装包括封装主体，附接到封装体的电极以及电连接到电极的至少两个发光器件。每个发光装置发射与其他发光装置不同颜色的光。在至少两个发光器件上形成保护层，并且形成在保护层上方的荧光体层。其他实施例包括其他结构，例如每个发光器件上的各个荧光体层。并且，包括封装的光装置可以包括驱动封装的发光器件的单个驱动器。

8. 发明授权

US08568014B2 Back-light unit 有权
标题翻译：背光单元
公开(公告)号：US08568014B2
公开(公告)日：2013-10-29
申请号：US13003056
申请日：2008-11-18
申请人： Yong Suk Kim
发明人： Yong Suk Kim
IPC分类号： G09F13/10
CPC分类号： G02F1/133608 , G02F2201/54
摘要： A back-light unit is disclosed. An object of the present invention is to provide a back-light unit that is able to improve structural stability and mass-production efficiency. The back-light unit includes a circuit substrate comprising a plurality of light sources arranged thereon, an optical sheet positioned on the circuit substrate, a plurality of supporting parts arranged between the circuit substrate and the optical sheet to support the optical sheet, which are installed to the circuit substrate by using surface-mount technology (SMT).
摘要翻译：公开了背光单元。本发明的目的是提供能够提高结构稳定性和批量生产效率的背光单元。背光单元包括：电路基板，包括布置在其上的多个光源;位于电路基板上的光学片;布置在电路基板和光学片之间的多个支撑部件，用于支撑光学片，通过使用表面贴装技术（SMT）到电路基板。

9. 发明申请

US20130169399A1 THIN FILM-TYPE COIL COMPONENT AND METHOD OF FABRICATING THE SAME 有权
公开(公告)号：US20130169399A1
公开(公告)日：2013-07-04
申请号：US13417832
申请日：2012-03-12
申请人： Young Seuck YOO , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
发明人： Young Seuck YOO , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
IPC分类号： H01F27/28 , B05D5/12
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/29 , H01F41/042 , H01F2027/2809
摘要： There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.

10. 发明申请

US20120145211A1 THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：热电装置及其制造方法
公开(公告)号：US20120145211A1
公开(公告)日：2012-06-14
申请号：US13305251
申请日：2011-11-28
申请人： Sung Ho LEE , Dong Hyeok Choi , Yong Suk Kim
发明人： Sung Ho LEE , Dong Hyeok Choi , Yong Suk Kim
IPC分类号： H01L35/28 , H01L35/34
CPC分类号： H01L35/32 , H01L35/34
摘要： The present invention provides a thermoelectric device including: thermoelectric sheets made of a thermoelectric semiconductor and laminated in multi-layers; and a metal sheet interposed between the thermoelectric sheets, and a method of manufacturing the same.
摘要翻译：本发明提供一种热电装置，包括：由热电半导体制成的层叠多层的热电片; 以及置于热电板之间的金属片及其制造方法。

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