专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08012778B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US08012778B2
公开(公告)日：2011-09-06
申请号：US12259576
申请日：2008-10-28
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

2. 发明授权

US07453093B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US07453093B2
公开(公告)日：2008-11-18
申请号：US11489578
申请日：2006-07-20
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L27/15 , H01L23/34
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

3. 发明授权

US07371603B2 Method of fabricating light emitting diode package 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US07371603B2
公开(公告)日：2008-05-13
申请号：US11439189
申请日：2006-05-24
申请人： Yong Suk Kim , Seog Moon Choi , Hyoung Ho Kim , Yong Sik Kim
发明人： Yong Suk Kim , Seog Moon Choi , Hyoung Ho Kim , Yong Sik Kim
IPC分类号： H01L21/00 , H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L33/52 , H01L2224/48091 , H01L2224/48227 , Y10S438/974 , H01L2924/00014
摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
摘要翻译：本发明涉及一种LED封装，并提出一种制造LED封装的方法，包括以下步骤：提供具有与LED连接的LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造至少形成将形成树脂成型部件的封装基板的预定表面积。该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图案电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

4. 发明授权

US07203055B2 Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor 失效
标题翻译：通过旋涂和多层陶瓷电容器制造多层陶瓷电容器的方法
公开(公告)号：US07203055B2
公开(公告)日：2007-04-10
申请号：US11011092
申请日：2004-12-15
申请人： Hyo Soon Shin , Seung Hyun Ra , Yong Suk Kim , Hyoung Ho Kim , Ho Sung Choo , Jung Woo Lee
发明人： Hyo Soon Shin , Seung Hyun Ra , Yong Suk Kim , Hyoung Ho Kim , Ho Sung Choo , Jung Woo Lee
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/1227 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.
摘要翻译：本文公开了通过旋涂工艺制造多层陶瓷电容器的方法和通过上述方法获得的多层陶瓷电容器。本发明的方法提供了通过旋涂形成的多个电介质层，其中涂覆介电层的过程和印刷内电极的过程可以作为单一工艺提供。因此，在电介质层形成得较薄的同时容易控制电介质层的厚度。此外，由于电介质层和内部电极依次形成，所以可以省略介电层的分离和分层工艺以及压缩陶瓷多层体的工艺。因此，陶瓷多层体不需要被压缩，因此在多层陶瓷电容器中不会发生卷绕现象。

5. 发明授权

US07338854B2 Method for manufacturing multilayer ceramic capacitor 失效
标题翻译：多层陶瓷电容器制造方法
公开(公告)号：US07338854B2
公开(公告)日：2008-03-04
申请号：US11002183
申请日：2004-12-03
申请人： Ho Sung Choo , Seung Hyun Ra , Yong Suk Kim , Jung Woo Lee , Hyo Soon Shin , Hyoung Ho Kim
发明人： Ho Sung Choo , Seung Hyun Ra , Yong Suk Kim , Jung Woo Lee , Hyo Soon Shin , Hyoung Ho Kim
IPC分类号： H01L21/8242
CPC分类号： H01G4/005 , H01G4/12 , H01G4/30 , Y10T29/417
摘要： A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.
摘要翻译：一种制造多层陶瓷电容器的方法，其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度，从而允许多层陶瓷电容器具有高容量并且被最小化。该方法包括在每个电介质片上印刷内部电极，并叠放电介质片，其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度设置有内部电极，然后将吸收构件从表面分离，使得部分具有指定厚度的内部电极被去除，并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。

6. 发明授权

US08753462B2 Method of manufacturing non-shrinking multilayer ceramic substrate 失效
标题翻译：制造非收缩多层陶瓷基板的方法
公开(公告)号：US08753462B2
公开(公告)日：2014-06-17
申请号：US12476216
申请日：2009-06-01
申请人： Beom Joon Cho , Eun Tae Park , Hyoung Ho Kim
发明人： Beom Joon Cho , Eun Tae Park , Hyoung Ho Kim
IPC分类号： C03B29/00
CPC分类号： H05K3/4611 , H01L21/4857 , H01L21/4867 , H01L23/15 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/1291 , H05K3/4629 , H05K2201/0209 , H05K2203/025 , H05K2203/1126 , H05K2203/1366 , H05K2203/308 , H01L2924/00
摘要： Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.
摘要翻译：公开了一种制造非闪烁多层陶瓷基板的方法。该方法包括在多个陶瓷生片中的至少一个中形成至少一个导电通孔和电极图案，层压陶瓷生片以形成陶瓷层压体，选择性地形成耐烧结粉末的收缩抑制薄膜在陶瓷层叠体的两个表面的至少一个表面中包括导电通孔及其周边的区域，使用气溶胶沉积，设置用于抑制陶瓷层压体在陶瓷层压体的两个表面中的至少一个上的收缩的收缩抑制生片包括用于形成非烧结多层陶瓷衬底的收缩抑制薄膜，以及烧结非烧结多层陶瓷衬底。

7. 发明授权

US07644480B2 Method for manufacturing multilayer chip capacitor 失效
标题翻译：多层片式电容器制造方法
公开(公告)号：US07644480B2
公开(公告)日：2010-01-12
申请号：US11822189
申请日：2007-07-03
申请人： Hyoung Ho Kim , Hyo Soon Shin , Ho Sung Choo
发明人： Hyoung Ho Kim , Hyo Soon Shin , Ho Sung Choo
IPC分类号： H01G4/005
CPC分类号： H01G4/232 , H01G4/012 , Y10T29/413 , Y10T29/417 , Y10T29/435
摘要： A method for manufacturing a multilayer chip capacitor includes: forming screen patterns on mother green sheets such that a widthwise margin is not formed on the mother green sheets, the screen patterns are spaced apart from each other in the width direction and the longitudinal direction, and a width of each screen pattern is greater than a spacing between the adjacent screen patterns; forming internal electrode patterns on the mother green sheets; forming a stack of the mother green sheets; forming a capacitor body having internal electrodes by cutting the stack of the mother green sheets along cutting lines arranged in the width direction and the longitudinal direction; forming chip-protecting side members on both sides of the capacitor body such that the chip-protecting side members contact both sides of the internal electrodes, respectively; and forming a pair of terminal electrodes on the outer surface of the capacitor body.
摘要翻译：一种多层片式电容器的制造方法，其特征在于，在母版本上形成屏幕图案，使得母版未形成宽度方向的边缘，屏幕图案在宽度方向和长度方向上彼此间隔开，每个屏幕图案的宽度大于相邻屏幕图案之间的间距; 在母板上形成内部电极图案; 形成一堆母亲的生页; 通过沿着宽度方向和长度方向布置的切割线切割母版本的叠层来形成具有内部电极的电容器体; 在电容器主体的两侧形成芯片保护侧部件，使得芯片保护侧部件分别接触内部电极的两侧; 以及在电容器主体的外表面上形成一对端子电极。

8. 发明申请

US20080317274A1 Apparatus for Necklace Type Radio Headset 审中-公开
标题翻译：用于项链类型无线电耳机的装置
公开(公告)号：US20080317274A1
公开(公告)日：2008-12-25
申请号：US11574348
申请日：2006-05-13
申请人： Hyoung Ho Kim
发明人： Hyoung Ho Kim
IPC分类号： H04R25/00
CPC分类号： H04R1/1058 , H04R1/1008 , H04R1/1016 , H04R1/105 , H04R5/033
摘要： Disclosed is a necklace type radio headset capable of overcoming problems of conventional headsets, in which cables connected between earphones of a headset easily get tangled with each other or with other objects in a storing place of the headset while the headset is not used. The headset according to the present invention includes casings connected via a cable and enclosing one or more Bluetooth modules and respective speakers therein, and the casings are detachably coupled to each other by a coupling means, so that a user can wear the headset around his or her neck like a necklace because the cable always maintains a ring shape. As the coupling means, one of the casings has a depression for receiving a speaker housing to be inserted into a user's ear, and the speaker housing is input in the depression while it is not used. Further, since either or both of the casings have respective permanent magnets, the casings are coupled by attractive magnetic force exerted between the permanent magnets. According to the present invention, cables of a headset do not easily get tangled with each other or do not easily get tangled with other objects. Further, since a user can carry the headset by putting the headset around his or her neck, the headset cannot easily be lost.
摘要翻译：公开了一种能够克服常规耳机问题的项链式无线电耳机，其中连接在耳机的耳机之间的电缆在头戴式耳机不被使用时容易彼此缠绕或与耳机的存放位置中的其它物体缠结。根据本发明的耳机包括通过电缆连接并且包围一个或多个蓝牙模块和其中的相应扬声器的壳体，并且壳体通过联接装置可拆卸地彼此耦合，使得用户可以将耳机佩戴在他或他的身体周围，她的脖子像一条项链，因为电缆总是保持环形。作为联接装置，壳体之一具有用于接收扬声器壳体以插入到用户耳朵中的凹部，并且扬声器壳体在不使用时被输入到凹部中。此外，由于壳体中的一个或两个都具有各自的永磁体，所以壳体通过施加在永磁体之间的有吸引力的磁力耦合。根据本发明，耳机的电缆不容易彼此缠结或不容易与其它物体缠结。此外，由于用户可以通过将耳机放置在他或她的脖子上来携带耳机，所以耳机不容易丢失。

9. 发明申请

US20090107616A1 MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE 审中-公开
标题翻译：多层陶瓷基板的制造方法
公开(公告)号：US20090107616A1
公开(公告)日：2009-04-30
申请号：US12262104
申请日：2008-10-30
申请人： Soo Hyun Lyoo , Jong Myeon Lee , Eun Tae Park , Hyoung Ho Kim
发明人： Soo Hyun Lyoo , Jong Myeon Lee , Eun Tae Park , Hyoung Ho Kim
IPC分类号： C03B29/00
CPC分类号： B32B18/00 , C04B2237/346 , C04B2237/56 , C04B2237/62 , H01L2224/16225 , H01L2924/09701 , H05K1/0231 , H05K1/0306 , H05K1/183 , H05K1/186 , H05K3/284 , H05K3/4611 , H05K3/4629 , H05K3/4697 , H05K2201/0187 , H05K2201/10636 , H05K2203/308 , Y02P70/611
摘要： Provided is a manufacturing method of a multi-layer ceramic substrate. The manufacturing method includes preparing an unsintered ceramic laminated body with a cavity, mounting a chip device within the cavity, filling the cavity, in which the chip device is mounted, with a ceramic slurry, attaching a constrained layer on top and/or bottom of the ceramic laminated body, and firing the ceramic laminated body. Accordingly, since the deformation of the cavity is prevented during the firing of the ceramic laminated body, the dimension precision and reliability of the multi-layer ceramic substrate can be improved.
摘要翻译：提供一种多层陶瓷基板的制造方法。该制造方法包括制备具有空腔的未烧结的陶瓷层叠体，在空腔内安装芯片装置，将其中安装有芯片装置的空腔填充到陶瓷浆料中，将约束层附着在顶部和/或底部上陶瓷层叠体，烧结陶瓷层叠体。因此，由于在烧结陶瓷层叠体期间防止了空腔的变形，因此可以提高多层陶瓷基板的尺寸精度和可靠性。

10. 发明授权

US07251119B2 Multilayer chip capacitor and method for manufacturing the same 失效
标题翻译：多层片式电容器及其制造方法
公开(公告)号：US07251119B2
公开(公告)日：2007-07-31
申请号：US11272893
申请日：2005-11-15
申请人： Hyoung Ho Kim , Hyo Soon Shin , Ho Sung Choo
发明人： Hyoung Ho Kim , Hyo Soon Shin , Ho Sung Choo
IPC分类号： H01G4/06 , H01G4/005
CPC分类号： H01G4/232 , H01G4/012 , Y10T29/413 , Y10T29/417 , Y10T29/435
摘要： A multilayer chip capacitor, and a method for manufacturing the same are provided. The capacitor includes a capacitor body having a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes formed on the dielectric layers, each of the internal electrodes including a main electrode portion and a lead portion, chip-protecting side members formed on both sides of the capacitor body to contact both sides of the first and second internal electrodes, and a pair of external electrodes formed on the outer surface of the capacitor body. The width of the main electrode portion is the same as that of the dielectric layers, and the width of the lead portion is smaller than that of the dielectric layers.
摘要翻译：提供了一种多层片状电容器及其制造方法。电容器包括：电容器体，其具有堆叠的多个电介质层;形成在电介质层上的多个第一和第二内部电极，每个内部电极包括主电极部分和引线部分，形成芯片保护侧部件在电容器本体的两侧接触第一和第二内部电极的两侧，以及形成在电容器本体的外表面上的一对外部电极。主电极部的宽度与电介质层的宽度相同，引线部的宽度小于电介质层的宽度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式