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    • 2. 发明申请
    • Multi-functional linear siloxane compound, a siloxane polymer prepared from the compound, and a process for forming a dielectric film by using the polymer
    • 多官能直链硅氧烷化合物,由该化合物制备的硅氧烷聚合物,以及通过使用聚合物形成电介质膜的方法
    • US20050131190A1
    • 2005-06-16
    • US10868222
    • 2004-06-16
    • Jae LeeJong SeonHyun JeongJin YimHyeon Shin
    • Jae LeeJong SeonHyun JeongJin YimHyeon Shin
    • C07B61/00C07F7/08C07F7/18C07F7/21C08G77/04C08G77/50C08G77/60G03F7/075H01L21/312
    • C08G77/50C07F7/0838C07F7/1804
    • A novel multi-functional linear siloxane compound, a siloxane polymer prepared from the siloxane compound, and a process for forming a dielectric film by using the siloxane polymer. The linear siloxane polymer has enhanced mechanical properties (e.g., modulus), superior thermal stability, a low carbon content and a low hygroscopicity and is prepared by the homopolymerization of the linear siloxane compound or the copolymerization of the linear siloxane compound with another monomer. A dielectric film can be produced by heat-curing a coating solution containing the siloxane polymer which is highly reactive. The siloxane polymer prepared from the siloxane compound not only has satisfactory mechanical properties, thermal stability and crack resistance, but also exhibits a low hygroscopicity and excellent compatibility with pore-forming materials, which leads to a low dielectric constant. Furthermore, the siloxane polymer retains a relatively low carbon content but a high SiO2 content, resulting in its improved applicability to semiconductor devices. Therefore, the siloxane polymer is advantageously used as a material for dielectric films of semiconductor devices.
    • 新型多功能直链硅氧烷化合物,由硅氧烷化合物制备的硅氧烷聚合物,以及通过使用硅氧烷聚合物形成电介质膜的方法。 线性硅氧烷聚合物具有增强的机械性能(例如模量),优异的热稳定性,低碳含量和低吸湿性,并且通过直链硅氧烷化合物的均聚或线性硅氧烷化合物与另一单体的共聚制备。 可以通过热固化含有高反应性的硅氧烷聚合物的涂布溶液来制造电介质膜。 由硅氧烷化合物制备的硅氧烷聚合物不仅具有令人满意的机械性能,热稳定性和抗裂性,而且具有低吸湿性和与成孔材料的优异相容性,导致低的介电常数。 此外,硅氧烷聚合物保持相对低的碳含量,但具有高的SiO 2含量,从而改善了对半导体器件的适用性。 因此,硅氧烷聚合物有利地用作半导体器件的介电膜的材料。
    • 5. 发明申请
    • Porous low-dielectric constant (k) thin film with controlled solvent diffusion
    • 具有受控溶剂扩散的多孔低介电常数(k)薄膜
    • US20060135633A1
    • 2006-06-22
    • US11263867
    • 2005-11-02
    • Kwang LeeJin Yim
    • Kwang LeeJin Yim
    • C08J9/00C08L63/00
    • C08J5/18C08J2383/04C08J2383/14H01B3/441
    • A porous low-dielectric constant thin film with controlled solvent diffusion into pores of the porous thin film. The porous thin film i s formed from a composition including a porogen containing at least one π-π interacting functional group, a thermostable matrix precursor, and a solvent dissolving the porogen and the matrix precursor. The porous thin film thus formed has mesopores not smaller than 10 nm in size and has a solvent diffusion rate not higher than 30 μm2/sec. Due to the presence of the large pores, the porous thin film can greatly inhibit solvent diffusion into the pores of the thin film, which is encountered during wet processes, without substantial changes in dielectric constant, elastic modulus and hardness depending on the porosity of the thin film.
    • 多孔低介电常数薄膜,其具有控制的溶剂扩散到多孔薄膜的孔中。 由包含至少一个π-π相互作用官能团的致孔剂的组合物形成多孔薄膜,热稳定性基质前体和溶解致孔剂和基质前体的溶剂。 由此形成的多孔薄膜的中孔的尺寸不小于10nm,溶剂扩散速率不高于30μm2 / sec。 由于存在大的孔,多孔薄膜可以极大地抑制在湿法中遇到的溶剂扩散到薄膜的孔中,而介电常数,弹性模量和硬度几乎不变,这取决于 薄膜。