专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050110085A1 Dual gate finfet 有权
标题翻译：双门finfet
公开(公告)号：US20050110085A1
公开(公告)日：2005-05-26
申请号：US10717737
申请日：2003-11-20
申请人： Huilong Zhu , Jochen Beintner , Bruce Doris , Ying Zhang
发明人： Huilong Zhu , Jochen Beintner , Bruce Doris , Ying Zhang
IPC分类号： H01L21/336 , H01L21/84 , H01L27/01 , H01L27/12 , H01L29/78 , H01L29/786
CPC分类号： H01L29/785 , H01L29/66795 , H01L29/7856
摘要： A field effect transistor (FET), integrated circuit (IC) chip including the FETs and a method of forming the FETS. Each FET includes a device gate along one side of a semiconductor (e.g., silicon) fin and a back bias gate along an opposite of the fin. Back bias gate dielectric differs from the device gate dielectric either in its material and/or thickness. Device thresholds can be adjusted by adjusting back bias gate voltage.
摘要翻译：包括FET的场效应晶体管（FET），集成电路（IC）芯片和形成FET的方法。每个FET包括沿半导体（例如，硅）翅片的一侧的器件栅极和沿鳍片相对的背偏置栅极。背偏置栅极电介质的不同之处在于器件栅极电介质的材料和/或厚度。可以通过调整背偏置栅极电压来调整器件阈值。

2. 发明申请

US20070181930A1 Structure and method of making double-gated self-aligned finfet having gates of different lengths 有权
标题翻译：制作具有不同长度的门的双门控自对准finfet的结构和方法
公开(公告)号：US20070181930A1
公开(公告)日：2007-08-09
申请号：US10711182
申请日：2004-08-31
申请人： Huilong Zhu , Bruce Doris , Xinlin Wang , Jochen Beintner , Ying Zhang , Philip Oldiges
发明人： Huilong Zhu , Bruce Doris , Xinlin Wang , Jochen Beintner , Ying Zhang , Philip Oldiges
IPC分类号： H01L27/108
CPC分类号： H01L29/785 , H01L29/66795 , H01L29/7855 , H01L29/7856
摘要： A gated semiconductor device is provided, in which the body has a first dimension extending in a lateral direction parallel to a major surface of a substrate, and second dimension extending in a direction at least substantially vertical and at least substantially perpendicular to the major surface, the body having a first side and a second side opposite the first side. The gated semiconductor device includes a first gate overlying the first side, and having a first gate length in the lateral direction. The gated semiconductor device further includes a second gate overlying the second side, the second gate having a second gate length in the lateral direction which is different from, and preferably shorter than the first gate length. In one embodiment, the first gate and the second gate being electrically isolated from each other. In another embodiment the first gate consists essentially of polycrystalline silicon germanium and the second gate consists essentially of polysilicon.
摘要翻译：提供了门控半导体器件，其中主体具有在平行于衬底的主表面的横向方向上延伸的第一尺寸，以及在至少基本上垂直且至少基本垂直于主表面的方向上延伸的第二尺寸，所述主体具有与所述第一侧相对的第一侧和第二侧。门控半导体器件包括覆盖第一侧的第一栅极，并且在横向上具有第一栅极长度。门控半导体器件还包括覆盖第二侧的第二栅极，第二栅极在横向上具有不同于第一栅极长度的第二栅极长度，并且优选地短于第一栅极长度。在一个实施例中，第一栅极和第二栅极彼此电隔离。在另一个实施例中，第一栅极主要由多晶硅锗组成，第二栅极主要由多晶硅组成。

3. 发明申请

US20080176365A1 Method of making double-gated self-aligned finFET having gates of different lengths 失效
标题翻译：制造具有不同长度的栅极的双门控自对准finFET的方法
公开(公告)号：US20080176365A1
公开(公告)日：2008-07-24
申请号：US12077973
申请日：2008-03-24
申请人： Huilong Zhu , Bruce B. Doris , Xinlin Wang , Jochen Beintner , Ying Zhang , Philip J. Oldiges
发明人： Huilong Zhu , Bruce B. Doris , Xinlin Wang , Jochen Beintner , Ying Zhang , Philip J. Oldiges
IPC分类号： H01L21/336
CPC分类号： H01L29/785 , H01L29/66795 , H01L29/7855 , H01L29/7856
摘要： A method is provided of making a gated semiconductor device. Such method can include patterning a single-crystal semiconductor region of a substrate to extend in a lateral direction parallel to a major surface of a substrate and to extend in a direction at least substantially vertical and at least substantially perpendicular to the major surface, the semiconductor region having a first side and a second side opposite, e.g., remote from the first side. A first gate may be formed overlying the first side, the first gate having a first gate length in the lateral direction. A second gate may be formed overlying the second side, the second gate having a second gate length in the lateral direction which is different from the first gate length. In one embodiment, the second gate length may be shorter than the first gate length. In one embodiment, the first gate may consist essentially of polycrystalline silicon germanium and the second gate may consist essentially of polysilicon.
摘要翻译：提供了一种制造门控半导体器件的方法。这种方法可以包括图案化衬底的单晶半导体区域，以在与衬底的主表面平行的横向方向上延伸并且沿至少基本上垂直且至少基本垂直于主表面的方向延伸，半导体区域具有第一侧和第二侧，例如远离第一侧。第一栅极可以形成在第一侧上，第一栅极在横向上具有第一栅极长度。第二栅极可以形成在第二侧上，第二栅极在横向上具有与第一栅极长度不同的第二栅极长度。在一个实施例中，第二栅极长度可以比第一栅极长度短。在一个实施例中，第一栅极可以主要由多晶硅锗组成，第二栅极可以由多晶硅组成。

4. 发明授权

US07785944B2 Method of making double-gated self-aligned finFET having gates of different lengths 失效
标题翻译：制造具有不同长度的栅极的双门控自对准finFET的方法
公开(公告)号：US07785944B2
公开(公告)日：2010-08-31
申请号：US12077973
申请日：2008-03-24
申请人： Huilong Zhu , Bruce B. Doris , Xinlin Wang , Jochen Beintner , Ying Zhang , Philip J. Oldiges
发明人： Huilong Zhu , Bruce B. Doris , Xinlin Wang , Jochen Beintner , Ying Zhang , Philip J. Oldiges
IPC分类号： H01L21/84
CPC分类号： H01L29/785 , H01L29/66795 , H01L29/7855 , H01L29/7856
摘要： A method is provided of making a gated semiconductor device. Such method can include patterning a single-crystal semiconductor region of a substrate to extend in a lateral direction parallel to a major surface of a substrate and to extend in a direction at least substantially vertical and at least substantially perpendicular to the major surface, the semiconductor region having a first side and a second side opposite, e.g., remote from the first side. A first gate may be formed overlying the first side, the first gate having a first gate length in the lateral direction. A second gate may be formed overlying the second side, the second gate having a second gate length in the lateral direction which is different from the first gate length. In one embodiment, the second gate length may be shorter than the first gate length. In one embodiment, the first gate may consist essentially of polycrystalline silicon germanium and the second gate may consist essentially of polysilicon.
摘要翻译：提供了一种制造门控半导体器件的方法。这种方法可以包括图案化衬底的单晶半导体区域，以在与衬底的主表面平行的横向方向上延伸并且沿至少基本上垂直且至少基本垂直于主表面的方向延伸，半导体区域具有第一侧和第二侧，例如远离第一侧。第一栅极可以形成在第一侧上，第一栅极在横向上具有第一栅极长度。第二栅极可以形成在第二侧上，第二栅极在横向上具有与第一栅极长度不同的第二栅极长度。在一个实施例中，第二栅极长度可以比第一栅极长度短。在一个实施例中，第一栅极可以主要由多晶硅锗组成，第二栅极可以由多晶硅组成。

5. 发明授权

US07348641B2 Structure and method of making double-gated self-aligned finFET having gates of different lengths 有权
标题翻译：制造具有不同长度的栅极的双门控自对准finFET的结构和方法
公开(公告)号：US07348641B2
公开(公告)日：2008-03-25
申请号：US10711182
申请日：2004-08-31
申请人： Huilong Zhu , Bruce B. Doris , Xinlin Wang , Jochen Beintner , Ying Zhang , Philip J. Oldiges
发明人： Huilong Zhu , Bruce B. Doris , Xinlin Wang , Jochen Beintner , Ying Zhang , Philip J. Oldiges
IPC分类号： H01L29/94
CPC分类号： H01L29/785 , H01L29/66795 , H01L29/7855 , H01L29/7856
摘要： A gated semiconductor device is provided, in which the body has a first dimension extending in a lateral direction parallel to a major surface of a substrate, and second dimension extending in a direction at least substantially vertical and at least substantially perpendicular to the major surface, the body having a first side and a second side opposite the first side. The gated semiconductor device includes a first gate overlying the first side, and having a first gate length in the lateral direction. The gated semiconductor device further includes a second gate overlying the second side, the second gate having a second gate length in the lateral direction which is different from, and preferably shorter than the first gate length. In one embodiment, the first gate and the second gate being electrically isolated from each other. In another embodiment the first gate consists essentially of polycrystalline silicon germanium and the second gate consists essentially of polysilicon.
摘要翻译：提供了门控半导体器件，其中主体具有在平行于衬底的主表面的横向方向上延伸的第一尺寸，以及在至少基本上垂直且至少基本垂直于主表面的方向上延伸的第二尺寸，所述主体具有与所述第一侧相对的第一侧和第二侧。门控半导体器件包括覆盖第一侧的第一栅极，并且在横向上具有第一栅极长度。门控半导体器件还包括覆盖第二侧的第二栅极，第二栅极在横向上具有不同于第一栅极长度的第二栅极长度，并且优选地短于第一栅极长度。在一个实施例中，第一栅极和第二栅极彼此电隔离。在另一个实施例中，第一栅极主要由多晶硅锗组成，第二栅极主要由多晶硅组成。

6. 发明授权

US07091566B2 Dual gate FinFet 有权
标题翻译：双门FinFet
公开(公告)号：US07091566B2
公开(公告)日：2006-08-15
申请号：US10717737
申请日：2003-11-20
申请人： Huilong Zhu , Jochen Beintner , Bruce B. Doris , Ying Zhang
发明人： Huilong Zhu , Jochen Beintner , Bruce B. Doris , Ying Zhang
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L29/785 , H01L29/66795 , H01L29/7856
摘要： A field effect transistor (FET), integrated circuit (IC) chip including the FETs and a method of forming the FETS. Each FET includes a device gate along one side of a semiconductor (e.g., silicon) fin and a back bias gate along an opposite of the fin. Back bias gate dielectric differs from the device gate dielectric either in its material and/or thickness. Device thresholds can be adjusted by adjusting back bias gate voltage.
摘要翻译：包括FET的场效应晶体管（FET），集成电路（IC）芯片和形成FET的方法。每个FET包括沿半导体（例如，硅）翅片的一侧的器件栅极和沿鳍片相对的背偏置栅极。背偏置栅极电介质的不同之处在于器件栅极电介质的材料和/或厚度。可以通过调整背偏置栅极电压来调整器件阈值。

7. 发明申请

US20050048752A1 Ultra thin channel MOSFET 有权
标题翻译：超薄通道MOSFET
公开(公告)号：US20050048752A1
公开(公告)日：2005-03-03
申请号：US10650229
申请日：2003-08-28
申请人： Bruce Doris , Thomas Kanarsky , Ying Zhang , Huilong Zhu , Meikei Ieong , Omer Dokumaci
发明人： Bruce Doris , Thomas Kanarsky , Ying Zhang , Huilong Zhu , Meikei Ieong , Omer Dokumaci
IPC分类号： H01L21/336 , H01L21/84 , H01L27/12 , H01L29/786 , H01L21/3205
CPC分类号： H01L29/66772 , H01L21/84 , H01L27/1203 , H01L29/6656 , H01L29/78612 , H01L29/78621
摘要： Described is a method for making thin channel silicon-on-insulator structures. The inventive method comprises forming a set of thin spacer abutting a gate region in a first device and a second device region; forming a raised source/drain region on either side of the gate region in the first device region and the second device region, implanting dopants of a first conductivity type into the raised source drain region in the first device region to form a first dopant impurity region, where the second device region is protected by a second device region block mask; implanting dopants of a second conductivity type into the raised source/drain region in the second device region to form a second dopant impurity region, where the first device region is protected by a first device region block mask; and activating the first dopant impurity region and the second dopant impurity region to provide a thin channel MOSFET.
摘要翻译：描述了制造薄沟道硅绝缘体上结构的方法。本发明的方法包括在第一装置和第二装置区域中形成邻接栅极区的一组薄间隔件; 在第一器件区域和第二器件区域中的栅极区域的任一侧上形成凸起的源极/漏极区域，将第一导电类型的掺杂剂注入到第一器件区域中的凸起的源极漏极区域中以形成第一掺杂剂杂质区域，其中所述第二设备区域被第二设备区域块掩码保护; 将第二导电类型的掺杂剂注入所述第二器件区域中的所述升高的源极/漏极区域中以形成第二掺杂剂杂质区域，其中所述第一器件区域被第一器件区域阻挡掩模保护; 以及激活第一掺杂杂质区和第二掺杂杂质区，以提供薄沟道MOSFET。

8. 发明申请

US20050189589A1 HYBRID SOI/BULK SEMICONDUCTOR TRANSISTORS 有权
标题翻译：混合SOI / BULK半导体晶体管
公开(公告)号：US20050189589A1
公开(公告)日：2005-09-01
申请号：US10708378
申请日：2004-02-27
申请人： Huilong Zhu , Philip Oldiges , Bruce Doris , Xinlin Wang , Oleg Gluschenkov , Huajie Chen , Ying Zhang
发明人： Huilong Zhu , Philip Oldiges , Bruce Doris , Xinlin Wang , Oleg Gluschenkov , Huajie Chen , Ying Zhang
IPC分类号： H01L27/01 , H01L29/06 , H01L29/10 , H01L29/786
CPC分类号： H01L29/7849 , H01L29/0653 , H01L29/1054 , H01L29/7842 , H01L29/78603 , H01L29/78612 , H01L29/78618 , H01L29/78687
摘要： Channel depth in a field effect transistor is limited by an intra-layer structure including a discontinuous film or layer formed within a layer or substrate of semiconductor material. Channel depth can thus be controlled much in the manner of SOI or UT-SOI technology but with less expensive substrates and greater flexibility of channel depth control while avoiding floating body effects characteristic of SOI technology. The profile or cross-sectional shape of the discontinuous film may be controlled to an ogee or staircase shape to improve short channel effects and reduce source/drain and extension resistance without increase of capacitance. Materials for the discontinuous film may also be chosen to impose stress on the transistor channel from within the substrate or layer and provide increased levels of such stress to increase carrier mobility. Carrier mobility may be increased in combination with other meritorious effects.
摘要翻译：场效应晶体管中的沟道深度由包括在半导体材料的层或衬底内形成的不连续膜或层的层内结构限制。因此，可以以SOI或UT-SOI技术的方式控制通道深度，但是具有较便宜的衬底和更大的通道深度控制的灵活性，同时避免SOI技术的浮体效应特性。不连续膜的轮廓或横截面形状可以被控制为奥格或阶梯形状，以改善短通道效应，并且在不增加电容的情况下降低源极/漏极和延伸电阻。也可以选择用于不连续膜的材料以在衬底或层内从晶体管沟道施加应力，并提供增加的这种应力水平以增加载流子迁移率。携带者的流动性可能会与其他有利的影响相结合。

9. 发明申请

US20050145954A1 STRUCTURES AND METHODS FOR MAKING STRAINED MOSFETS 有权
标题翻译：制造应变MOSFET的结构和方法
公开(公告)号：US20050145954A1
公开(公告)日：2005-07-07
申请号：US10707690
申请日：2004-01-05
申请人： Huilong Zhu , Steven Bedell , Bruce Doris , Ying Zhang
发明人： Huilong Zhu , Steven Bedell , Bruce Doris , Ying Zhang
IPC分类号： H01L21/20 , H01L21/336 , H01L29/76 , H01L29/78 , H01L29/786 , H01L29/94 , H01L31/062
CPC分类号： H01L29/785 , H01L29/66795 , H01L29/7842 , H01L29/78687
摘要： A method and device providing a strained Si film with reduced defects is provided, where the strained Si film forms a fin vertically oriented on a surface of a non-conductive substrate. The strained Si film or fin may form a semiconductor channel having relatively small dimensions while also having few defects. The strained Si fin is formed by growing Si on the side of a relaxed SiGe block. A dielectric gate, such as, for example, an oxide, a high “k” material, or a combination of the two, may be formed on a surface of the strained Si film. Additionally, without substantially affecting the stress in the strained Si film, the relaxed SiGe block may be removed to allow a second gate oxide to be formed on the surface previously occupied by the relaxed SiGe block. Accordingly, a semiconductor device having a strained Si fin vertically oriented on a non-conductive substrate may be formed where the strained Si film is oriented such that it may form a channel of small dimensions allowing access to both sides and top in order to from single gate, double gate, or more gate MOSFETs and finFETs with a channel having a reduced number of defects and/or reduced dimensions.
摘要翻译：提供了提供具有减小的缺陷的应变Si膜的方法和装置，其中应变Si膜在非导电基板的表面上形成垂直取向的翅片。应变Si膜或翅片可以形成具有相对较小尺寸的半导体通道，同时也具有很少的缺陷。应变Si翅片通过在弛豫的SiGe块的一侧生长Si而形成。可以在应变Si膜的表面上形成诸如氧化物，高“k”材料或两者的组合的电介质栅极。另外，在基本上不影响应变Si膜中的应力的情况下，可以去除弛豫的SiGe块，以允许在松弛的SiGe块先前占据的表面上形成第二栅极氧化物。因此，可以形成具有垂直取向在非导电衬底上的应变Si鳍片的半导体器件，其中应变Si膜被定向成使得其可以形成允许接近两侧和顶部的小尺寸的通道，以便从单个栅极，双栅极或更多栅极MOSFET和finFET，沟道具有减少的缺陷数量和/或减小的尺寸。

10. 发明申请

US20080090366A1 Hybrid SOI-Bulk Semiconductor Transistors 失效
标题翻译：混合SOI-体半导体晶体管
公开(公告)号：US20080090366A1
公开(公告)日：2008-04-17
申请号：US11870436
申请日：2007-10-11
申请人： Huilong Zhu , Philip Oldiges , Bruce Doris , Xinlin Wang , Oleg Gluschenkov , Huajie Chen , Ying Zhang
发明人： Huilong Zhu , Philip Oldiges , Bruce Doris , Xinlin Wang , Oleg Gluschenkov , Huajie Chen , Ying Zhang
IPC分类号： H01L21/336
CPC分类号： H01L29/7849 , H01L29/0653 , H01L29/1054 , H01L29/7842 , H01L29/78603 , H01L29/78612 , H01L29/78618 , H01L29/78687
摘要： Channel depth in a field effect transistor is limited by an intra-layer structure including a discontinuous film or layer formed within a layer or substrate of semiconductor material. Channel depth can thus be controlled much in the manner of SOI or UT-SOI technology but with less expensive substrates and greater flexibility of channel depth control while avoiding floating body effects characteristic of SOI technology. The profile or cross-sectional shape of the discontinuous film may be controlled to an ogee or staircase shape to improve short channel effects and reduce source/drain and extension resistance without increase of capacitance. Materials for the discontinuous film may also be chosen to impose stress on the transistor channel from within the substrate or layer and provide increased levels of such stress to increase carrier mobility. Carrier mobility may be increased in combination with other meritorious effects.
摘要翻译：场效应晶体管中的沟道深度由包括在半导体材料的层或衬底内形成的不连续膜或层的层内结构限制。因此，可以以SOI或UT-SOI技术的方式控制通道深度，但是具有较便宜的衬底和更大的通道深度控制的灵活性，同时避免SOI技术的浮体效应特性。不连续膜的轮廓或横截面形状可以被控制为奥格或阶梯形状，以改善短通道效应，并且在不增加电容的情况下降低源极/漏极和延伸电阻。也可以选择用于不连续膜的材料以在衬底或层内从晶体管沟道施加应力，并提供增加的这种应力水平以增加载流子迁移率。携带者的流动性可能会与其他有利的影响相结合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式